Pb Chip Ferrite Inductor (MFI Series) Engineering Spec.

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1 RoHS Pb Chip Ferrite Inductor (MFI Series) Engineering Spec. FEATURES The monolithic construction performs high reliability and ensures a closed magnetic flux in a component avoids magnetic and interference All for higher mounting density APPLICATIONS RF and wireless communication, information technology equipment which includes computer, telecommunications, radar detectors, automotive elect SHAPES AND DIMENSIONS E T W L Unit: mm TYPE (EIA0603) (EIA 0805) (EIA 0805) (EIA 1206) L 1.60± ± ± ±0.20 W 0.80± ± ± ±0.20 T 0.80± ± ± ±0.20 E 0.30± ± ± ±0.30 The thickness of 2012 specification under 4.7µH is 0.90mm±0.20mm PART NUMER CODE MFI R7 K E Series Name 2 Size Code: the first two digitals : length(mm), the last two digitals : width(mm) 3 Inductance (R=Decimal Point) Unit: μh 4 Tolerance: J= ±5%, K= ±10%, M = ±20% 5 Soldering : Green Parts: A Soldering Lead-Free Lead-Free for whole chip 6 Packaging: P - Embossed paper tape, 7" reel. E - Embossed plastic tape, 7" reel. SPEC REV.: A12 Page 1 of 8

2 PART NUMER AND CHARACTERISTICS TALE Inductance & S.R.F Thickness Q Test Freq. Part No. Tolerance (mm) (min) (μh) Min DCR(Ω) (Max.) Rated Curren (ma) MFI1608 Series MFI1608 R10KP 0.8 ± ± 10% MFI1608 R12KP 0.8 ± ± 10% MFI1608 R15KP 0.8 ± ± 10% MFI1608 R18KP 0.8 ± ± 10% MFI1608 R22KP 0.8 ± ± 10% MFI1608 R27KP 0.8 ± ± 10% MFI1608 R33KP 0.8 ± ± 10% MFI1608 R39KP 0.8 ± ± 10% MFI1608 R47KP 0.8 ± ± 10% MFI1608 R56KP 0.8 ± ± 10% MFI1608 R68KP 0.8 ± ± 10% MFI1608 R82KP 0.8 ± ± 10% MFI1608 1R0KP 0.8 ± ± 10% MFI1608 1R2KP 0.8 ± ± 10% MFI1608 1R5KP 0.8 ± ± 10% MFI1608 1R8KP 0.8 ± ± 10% MFI1608 2R2KP 0.8 ± ± 10% MFI1608 2R7KP 0.8 ± ± 10% MFI1608 3R3KP 0.8 ± ± 10% MFI1608 3R9KP 0.8 ± ± 10% MFI1608 4R7KP 0.8 ± ± 10% MFI RKP 0.8 ± ± 10% MFI2012 Series MFI2012 R10KP 0.9 ± ± 10% MFI2012 R12KP 0.9 ± ± 10% MFI2012 R15KP 0.9 ± ± 10% MFI2012 R18KP 0.9 ± ± 10% MFI2012 R22KP 0.9 ± ± 10% MFI2012 R27KP 0.9 ± ± 10% MFI2012 R33KP 0.9 ± ± 10% MFI2012 R39KP 0.9 ± ± 10% MFI2012 R47KP 0.9 ± ± 10% MFI2012 R56KP 0.9 ± ± 10% MFI2012 R68KP 0.9 ± ± 10% SPEC REV.: A12 Page 2 of 8

3 Part No. Thickness (mm) Inductance & Tolerance (μh) Q (min) Test Freq. S.R.F Min DCR(Ω) (Max.) Rated Curren (ma) MFI2012 Series MFI2012 R82KP 0.9 ± ± 10% MFI2012 1R0KP 0.9 ± ± 10% MFI2012 1R2KP 0.9 ± ± 10% MFI2012 1R5KP 0.9 ± ± 10% MFI2012 1R8KP 0.9 ± ± 10% MFI2012 2R2KP 0.9 ± ± 10% MFI2012 2R7KP 0.9 ± ± 10% MFI2012 3R3KP 0.9 ± ± 10% MFI2012 3R9KP 0.9 ± ± 10% MFI2012 4R7KP 0.9 ± ± 10% MFI2012 5R6KE 1.25 ± ± 10% MFI2012 6R8KE 1.25 ± ± 10% MFI2012 8R2KE 1.25 ± ± 10% MFI RKE 1.25 ± ± 10% MFI RKE 1.25 ± ± 10% MFI RKE 1.25 ± ± 10% MFI RKE 1.25 ± ± 10% MFI RKE 1.25 ± ± 10% MFI3216 Series MFI3216 R10KE 1.1 ± ±10% MFI3216 R12KE 1.1 ± ±10% MFI3216 R15KE 1.1 ± ±10% MFI3216 R18KE 1.1 ± ±10% MFI3216 R22KE 1.1 ± ±10% MFI3216 R27KE 1.1 ± ±10% MFI3216 R33KE 1.1 ± ±10% MFI3216 R39KE 1.1 ± ±10% MFI3216 R47KE 1.1 ± ±10% MFI3216 R56KE 1.1 ± ±10% MFI3216 R68KE 1.1 ± ±10% MFI3216 R82KE 1.1 ± ±10% MFI3216 1R0KE 1.1 ± ±10% MFI3216 1R2KE 1.1 ± ±10% MFI3216 1R5KE 1.1 ± ±10% MFI3216 1R8KE 1.1 ± ±10% MFI3216 2R2KE 1.1 ± ±10% SPEC REV.: A12 Page 3 of 8

4 Part No. Thickness (mm) Inductance & Tolerance (μh) Q (min) Test Freq. S.R.F Min DCR(Ω) (Max.) Rated Curren (ma) MFI3216 Series MFI3216 2R7KE 1.1 ± ±10% MFI3216 3R3KE 1.1 ± ±10% MFI3216 3R9KE 1.1 ± ±10% MFI3216 4R7KE 1.1 ± ±10% MFI3216 5R6KE 1.1 ± ±10% MFI3216 6R8KE 1.1 ± ±10% MFI3216 8R2KE 1.1 ± ±10% MFI RKE 1.1 ± ±10% MFI RKE 1.1 ± ±10% MFI RKE 1.1 ± ±10% MFI RKE 1.1 ± ±10% MFI RKE 1.1 ± ±10% TEST LEVEL:100 mv HP4291 RF IMPEDANCE / MATERIAL ANALYZER Test Instruments HP4338A/ MILLIOHMMETER Agilent 8720ES S-PARAMETER NETWORK ANALYZER HP6632 SYSTEM DC POWER SUPPLY ** For special part number which is not shown in above table, please refer to the appendix. GENRAL TECHNICAL DATA Operating temperature range : - 55 ~ +125 Storage Condition : Less than 40 and 70% RH Storage Time: 12 months Max. Soldering method: Reflow or Wave Soldering SPEC REV.: A12 Page 4 of 8

5 TAPE AND REEL SPECIFICATIONS PLASTIC CARRIER PAPER CARRIER TAPING DIMENSIONS Unit: mm Size Symbol PLASTIC PLASTIC PAPER PAPER W 7.90~ ~ ± ±0.10 P 4.00± ± ± ±0.10 E 1.75± ± ± ±0.10 F 3.50± ± ± ±0.10 D 1.55± ± ± ±0.10 D1 0.95~ ~1.20 NA NA Po 4.00± ± ± ±0.10 Po ± ± ±0.20 NA P2 2.00± ± ± ±0.10 Ao 1.85± ± ± ±0.05 o 3.43± ± ± ±0.05 Ko(T) 1.22± ± ± ±0.05 t 0.25± ±0.10 NA NA SPEC REV.: A12 Page 5 of 8

6 REEL DIMENSIONS Unit: mm PART SIZE (EIA SIZE) Reel Packaging Quantity 1608 (0603) (0805) (0805) 3216 (1206) 7 REEL Qty. (pcs) 4,000 4,000 3,000 3,000 The Contents of a box: 3216 (1206): 5 reels / inner box 2012 (0805): 5 reels / inner box 1608 (0603): 5 reels / inner box SPEC REV.: A12 Page 6 of 8

7 RECOMMENDED SOLDERING CONDITIONS LAND PATTERNS FOR REFLOW SOLDERING SOLDER LAND INFORMATION Unit: mm (inches) Size A C ~ ~ ~ 0.95 (0.019 ~ 0.027) (0.083 ~ 0.122) (0.026 ~ 0.037) 1.0 ~ ~ ~ 1.1 (0.039 ~ 0.047) (0.118 ~ 0.157) (0.031 ~ 0.043) 2.0 ~ ~ ~ 1.4 (0.079 ~ 0.094) (0.165 ~ 0.204) (0.039 ~ 0.055) SPEC REV.: A12 Page 7 of 8

8 RELIAILITY AND TEST CONDITION Test item Test condition Criteria a. Temperature : -40 ~ +85 b. Cycle : 100 cycles a. No mechanical damage b. Induction value should be Temperature Cycle c. Dwell time : 30minutes within ± 10 % of the initial Measurement : at ambient temperature value 24 hrs after test completion c. Q vale should be within ± 30% of the initial value Operational Life a. No mechanical damage a. Temperature : 125 ± 5 b. Induction value should be b. Test time : 1000 hrs within ± 10 % of the initial c. Apply current : full rated current value Measurement : at ambient temperature Q vale should be within ± 30% of 24 hrs after test completion the initial value iased Humidity Resistance to Solder Heat Adhesive Test Steam Aging Test a. Temperature : 40 ± 2 a. No mechanical damage b. Humidity : 90 ~ 95 % RH b. Induction value should be c. Test time : 1000 hrs within ± 10 % of the initial d. Apply current : full rated current value Measurement : at ambient temperature Q vale should be within ± 30% of 24 hrs after test completion the initial value a. Solder temperature : 260 ± 5 b. Flux : Rosin c. DIP time : 10 ± 1 sec a. Reflow temperature : 245 It shall be Soldered on the substrate applying direction parallel to the substrate b. Apply force(f) : 5 N Test time : 10 sec a. Temperature : 93 b. Test time : 8 hrs c. Solder temperature : 235 ± 5 d. Flux : Rosin e. DIP time : 5 ± 1 sec a. More than 95 % of terminal electrode should be covered with new solder b. No mechanical damage c. Induction value should be within ± 10 % of the initial value Q vale should be within ± 30% of the initial value a. No mechanical damage b. Soldering the products on PC after the pulling test force > 5 N More than 95 % of terminal electrode should be covered with new solder SPEC REV.: A12 Page 8 of 8

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