HIS series. Signal Inductor Multilayer Ceramic Type FEATURE PART NUMBERING SYSTEM DIMENSIONS HIS R12 (1) (2) (3) (4)

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1 FEATURE High Self Resonant Frequency Superior temperature stability Monolithic structure for high reliability Applications: RF circuit in telecommunication PART NUMBERING SYSTEM HIS R12 (1) (2) (3) (4) J No item Code Description Series Reference (1) Meritek Series HIS Signal Inductor (2) Dimension : 0603 EIA size : 0402 EIA size (3) R12 R12: 0.12µH 1N0: 1.0nH, 39N: 39nH (4) Tolerance J J: ±5% S: ±0.3nH, J: ±5%, K: ±10% DIMENSIONS Standard Type Size Figure L (mm) W (mm) T (mm) A (mm) HIS (<12nH) ± ± ± ±0.10 HIS ( 12nH) &2 1.00± ± ± ±0.10 HIS ( 100nH) ± ± ± ±0.20 HIS ( 120nH) ± ± ± ±0.20

2 ELECTRICAL CHARACTERISTICS - HIS HIS series (nh) Tolerance (± %) Min Q L/Q Freq. (MHz) Q(Typical) Freq.(MHz) Min SRF (GHz) Max DCR (Ω) HIS N0 1.0 ±0.3nH HIS N1 1.1 ±0.3nH HIS N2 1.2 ±0.3nH HIS N3 1.3 ±0.3nH HIS N5 1.5 ±0.3nH HIS N6 1.6 ±0.3nH HIS N8 1.8 ±0.3nH HIS N0 2.0 ±0.3nH HIS N2 2.2 ±0.3nH HIS N4 2.4 ±0.3nH HIS N7 2.7 ±0.3nH HIS N0 3.0 ±0.3nH HIS N3 3.3 ±0.3nH HIS N6 3.6 ±0.3nH HIS N9 3.9 ±0.3nH HIS N3 4.3 ±0.3nH HIS N7 4.7 ±0.3nH HIS N1 5.1 ±0.3nH HIS N6 5.6 ±0.3nH HIS N2 6.2 ±0.3nH HIS N8 6.8 ±5%, ±10% HIS N5 7.5 ±5%, ±10% HIS N2 8.2 ±5%, ±10% HIS N1 9.1 ±5%, ±10% HIS N 10 ±5%, ±10% HIS N 12 ±5%, ±10% HIS N 15 ±5%, ±10% HIS N 18 ±5%, ±10% HIS N 20 ±5%, ±10% HIS N 22 ±5%, ±10% HIS N 27 ±5%, ±10% HIS N 33 ±5%, ±10% HIS N 39 ±5%, ±10% HIS N 43 ±5%, ±10% HIS N 47 ±5%, ±10% HIS N 56 ±5%, ±10% HIS N 68 ±5%, ±10% HIS N 82 ±5%, ±10% HIS100505R ±5%, ±10% HIS100505R ±5%, ±10% HIS100505R ±5%, ±10% HIS100505R ±5%, ±10% HIS100505R ±5%, ±10% HIS100505R ±5%, ±10% HIS100505R ±5%, ±10% Notes: 1. Operation : -55 C ~+125 C 2. : Tolerance: S: ±0.3nH, J: ±5%, K: ±10%, Max IDC (ma) Back to Top

3 ELECTRICAL CHARACTERISTICS - HIS HIS Series (nh) Tolerance (± %) Min Q L/Q Freq. (MHz) Q(Typical) Freq.(MHz) Min SRF (GHz) Max RDC (Ω) HIS N0 1.0 ±0.3nH HIS N2 1.2 ±0.3nH HIS N5 1.5 ±0.3nH HIS N8 1.8 ±0.3nH HIS N2 2.2 ±0.3nH HIS N7 2.7 ±0.3nH HIS N3 3.3 ±0.3nH HIS N9 3.9 ±0.3nH HIS N7 4.7 ±0.3nH HIS N6 5.6 ±0.3nH HIS N8 6.8 ±5%, ±10% HIS N2 8.2 ±5%, ±10% HIS N 10 ±5%, ±10% HIS N 12 ±5%, ±10% HIS N 15 ±5%, ±10% HIS N 18 ±5%, ±10% HIS N 22 ±5%, ±10% HIS N 27 ±5%, ±10% HIS N 33 ±5%, ±10% HIS N 39 ±5%, ±10% HIS N 47 ±5%, ±10% HIS N 56 ±5%, ±10% HIS N 68 ±5%, ±10% HIS N 82 ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% HIS160808R ±5%, ±10% Notes: 1. Operation : -40 C ~+85 C 2. : Tolerance: S: ±0.3nH, J: ±5%, K: ±10% Max IDC (ma) Back to Top

4 RELIABILITY TEST CONDITON AND REQUIREMENT Item Test Conditions / Equipment Requirement Quality Factor (Q) DC Resistance : 20±1 C. Relative Humidity: 45% to 85% RH. Atmospheric Pressure: 86 to 106kpa. Measuring equipment and fixture: 0201: E991A+HP16197A 0402/0603: E991A+HP16192A Test Signal: -20dBm or 50mV, Test compensation(for 0201 high Q): Product true value= test value + compensation value: for L<3.6nH, compensation value is 0.25nH; for 3.6nH L<6.8nH, compensation value is 0.43nH; for 6.8 nh L<9.1nH, compensation value is 0.5nH; for L 9.1nH, compensation value is 0.85nH; : 20±1 C. Relative Humidity: 45 to 85% RH. Atmospheric Pressure: 86 to 106kpa : 20±1 C. Relative Humidity: 45 to 85% RH. Atmospheric Pressure: 86 to 106kpa Measuring equipment: HP 4338 Flexure: 2mm. Pressurizing speed: 0.5mm/sec Keep time: 30sec. Within specified tolerance Refer to standard electrical characteristic spec Refer to standard electrical characteristic spec Bending Strength No mechanical damage shall be observed Solderability Resistance to Soldering Heat Drop Solderability Thermal Shock Resistance to Low Resistance to High Solder temperature: 240±2 C for 3 seconds Solder: Sn/3.0Ag/0.5Cu Flux: 25% resin and 75% ethanol in weight Solder temperature: 260±3 C for 5 seconds Solder: Sn/3.0Ag/0.5Cu Flux: 25% resin and 75% ethanol in weight Stabilized at normal condition for 1~2 hours before measuring Drop chip inductor 10 times on a concrete floor form a height of 100cm. Inductor shall be dipped in a melted solder bath at 245±5 for 3 seconds 0201/0402 series: -55 for 30±3 min 125 for 30±3 min series: -40 for 30±3 min 85 for 30±3 min. Transforming interval: max. 20 seconds Test cycle: 100 cycles The chip shall be stabilized at normal condition for 1~2. : 0201/0402 series: -55±2 ; 0603 series: -40 ±2 for 1000±24 hours : 0201/0402 series: 125±2 ; 0603 series: 85 ±2 for 1000±24 hours Wetting shall exceed 75% coverage for 0201 series; exceed 95% coverage for others Wetting shall exceed 75% coverage for 0201 series; exceed 95% coverage for others change: within±10% Q change: within±20% change: within±10% Q change: within±20%. 90% covered with solder

5 RELIABILITY TEST CONDITON AND REQUIREMENT (CONTINUED) Item Test Conditions / Equipment Requirement Damp Heat (Steady States) Loading Under Damp Heat Loading at High (Life Test) : 60±2 Humidity: 90~95% RH. Time: 1000±24 hours : 60±2 Humidity: 90~95% RH. Time: 1000±24 hours. Applied current: Rated current : 0201/0402 series: 125±2 ; 0603 series: 85± 2 for 1000±24 hours Applied current: Rated current Notes: Storage : 15~28 C; Humidity < 80%RH PACKAGING DIMENSION Series Reel Dimension (mm) Tape Dimensions (mm) Parts Per Reel A±1 B±0.5 C±0.2 D±0.15 E±0.5 W±0.2 P±0.1 P0±0.1 P1±0.05 h±0.05 t± HIS ,000 HIS ,000 *Specifications subject to change without notice.