SMD Shielded Power Inductor HPCRHF2D /3D /4D Series
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1 SMD Shielded Power Inductor HPCRHF2D /3D /4D Series Features: l SMD type power inductors by the electrode is attached to the ferrite core directly. l Magnetically shielded to prevent noise radiation. Applications: l Power supply for Set-top box, DC/DC converters. Dimensions and footprint (Unit: mm) Unit: mm TYPE A(MAX) B(MAX) C(MAX) J(typ) H(typ) K(typ) HPCRHF2D HPCRHF2D HPCRHF2D HPCRHF2D HPCRHF3D HPCRHF3D14HP HPCRHF3D HPCRHF3D16LD HPCRHF3D16HP HPCRHF4D Schematic diagram: Materials: a. Core: ferrite DR core b. Wire: enamelled copper wire c. Core: ferrite RI core d. Terminal: Ag+Sn+Ni General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: secs. 25
2 Part NO L(μH) HPCRHF2D Series SMD Shielded Power Inductor 2D09 2D11 2D14 2D18 1R R R R R R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC : D.C Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHz, 0.1V HPCRHF Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPCRHF2D09 T/R13 3,500 HPCRHF2D11 T/R13 3,000 HPCRHF2D14 T/R13 2,500 HPCRHF2D18 T/R13 2,000 26
3 Part NO L(μH) HPCRHF3D Series SMD Shielded Power Inductor 3D14 3D14LD 3D14HP 3D16 1R R R R R R R R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC : D.C Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHz, 0.1V HPCRHF Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPCRHF3D14 T/R13 2,500 HPCRHF3D14LD T/R13 2,500 HPCRHF3D14HP T/R13 2,500 HPCRHF3D16 T/R13 4,000 27
4 Part NO L(μH) HPCRHF3D /4D Series SMD Shielded Power Inductor 3D16LD 3D16HP 4D16 1R R R R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC : D.C Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHz, 0.1V HPCRHF Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPCRHF3D16LD T/R13 4,000 HPCRHF3D16HP T/R13 4,500 HPCRHF4D16 T/R13 3,500 28
5 SMD Shielded Power Inductor HPCRHF4D /5D /6D Series Features: l SMD type power inductors by the electrode is attached to the ferrite core directly. l Magnetically shielded to prevent noise radiation. Applications: l Power supply for Set-top box, DC/DC converters. Dimensions and footprint (Unit: mm) H J K PCB Pattern TYPE A(MAX) B(MAX) C(MAX) D(ref) J(typ) H(typ) Unit: mm K(typ) HPCRHF4D HPCRHF4D HPCRHF5D HPCRHF5D HPCRHF6D HPCRHF6D HPCRHF6D Schematic diagram: Materials: a. Core: ferrite DR core b. Core: ferrite RI core c. Wire: Enamelled copper wire d. Terminal: Ag+Ni+Sn General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: secs. 29
6 HPCRHF4D /5D Series SMD Shieded Power Inductor Part NO L(μH) 4D18 4D28 5D18 1R R R R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC : D.C Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHz, 0.1V HPCRHF Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPCRHF4D18 T/R13 3,500 HPCRHF4D28 T/R13 2,500 HPCRHF5D18 T/R13 3,500 30
7 Part NO L(μH) HPCRHF5D /6D Series SMD Shielded Power Inductor 5D28 6D18 6D28 6D38 2R R R R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC : D.C Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHz, 0.1V HPCRHF Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPCRHF5D28 T/R13 2,500 HPCRHF6D18 T/R13 2,000 HPCRHF6D28 T/R13 1,500 HPCRHF6D38 T/R13 1,000 31
8 Features: SMD Shielded Power Inductor HPCRHF8D Series l The electrode is attached to the ferrite core directly. l Various high power inductors are superior to be high saturation for surface mounting. Applications: l Power supply for VTR, OA Equipment,Digital camera,lcd television set,notebook PC,portable communication equipments, DC-DC converters,etc. Dimensions and footprint (Unit: mm) Unit: mm TYPE A B C J(typ) H(typ) K(typ) HPCRHF8D HPCRHF8D Schematic diagram: Materials: a. Core: ferrite DR core b. Wire: enamelled copper wire c. Core: ferrite RI core d. Terminal: Ag+Sn+Ni General Specification: a. Storage temp: b.operating temp: c.resistance to solder heat: secs. 32
9 HPCRHF Series SMD Shielded Power Inductor 8D28 8D43 Part NO L(μH) 1R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC : D.C Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHz, 0.1V HPTSD Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPCRHF8D28 T/R13 1,000 HPCRHF8D43 T/R13 1,000 33
10 Application Field SMD Shielded Power Inductor HP SLF6028 Series l Notebook,portable communication equipments, DC/DC converters. Features l Magnetically shielded construction. l Compact and thin. l For larqe currents. Dimensions and footprint (Unit: mm) TYPE A B C D E(ref) J(typ) H(typ) K(typ) HPSLF ± ± ± ± Unit: mm Schematic diagram: Materials: a. Core: ferrite core b. Wire: enamelled copper wire c. Terminal: Ag+Sn+Ni General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: secs. 34
11 HPSLF6028 Series SMD Shieided Power Inductor Part NO L(μH) ±20% Min 4R R Rated Current code : N±30% M±20% L±15% K±10% J±5% l Rated Current : last or lrms, whichever is lower. l Lsat : D.C. Current at which the inductance drops 35%(MAX.) from its value without current. Lrms : D.C. Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHZ, 0.1V HPSLF Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPSLF6028 T/R13 1,500 35
12 SMD Shielded Power Inductor HPSLF07 /HPSLF10145 Series Application Field l Notebook, portable communication equipments, DC/DC converters. Features l Magnetically shielded construction. l Compact and thin. l For larqe currents. Dimensions and footprint (Unit: mm) Unit: mm TYPE A B C D E H(typ) J(typ) K(typ) HPSLF ± ± ± ± ref HPSLF ± ± ± ref HPSLF ± ± ± ± ± Schematic diagram: Materials: a. Core: ferrite core b. Wire: enamelled copper wire c. Terminal: Ag+Sn+Ni General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat : secs. 36
13 HPSLF07 /HPSLF10145 Series SMD Shieled Power Inductor Part NO L(μH) RDC(Ω) Min RDC(Ω Min RDC(Ω) Min 3R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% l Rated Current : last or lrms, whichever is lower. l Lsat : D.C. Current at which the inductance drops 35%(MAX.) from its value without current. Lrms : D.C. Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHZ, 0.1V HPSLF Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPSLF0703 T/R13 1,500 HPSLF0704 T/R13 1,000 HPSLF10145 T/R
14 SMD Shielded Power Inductors HPSSD1205S/HPSSD1807S Series Application Field l Notebook, DC/DC converter, VGA card Video recorders Features l Magentic shielded construction. l Compact and thin. l Large Current and low DCR (HPSSD1807Series). Dimensions and footprint (Unit: mm) Unit: mm TYPE A() B() C(max) D E F G H(typ) J(typ) K(typ) HPSSD1205S ± ± ± ± HPSSD1807S ref 2.54ref 12.7ref Schematic diagram: Materials: a. Core: ferrite core b. Wire: enamelled copper wire c. Core: ferrite core d. TerMinnail: Tinned copper flat e. Adhesive: Epoxy resin General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: secs. 38
15 HPSSD1205S Series SMD Shieled Power Inductor Part NO L(μH) RDC(Ω) Min SRF(MHZ)Min 1R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC: L/L(0A) 10% Inductctance tested : 1.0μH -8.2μH /100KHz/0.25V 10μH μH /1KHz/0.25V 39
16 HPSSD1807S Series SMD Shielded Power Inductor Part NO L(μH) RDC(Ω) SRF(MHZ)Min 1R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC: L/L(0A) 10% Inductctance tested : 1.0μH -8.2μH/100KHz/0.25V 10μH -1500μH /1KHz/0.25V HPSSD Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPSSD1205S T/R 13 1,000 HPSSD1807S T/R
17 Application Field SMD Shielded Power Inductor HPSSDA1608 Series l Notebokk, DC/DC converter, VGA card Video recorders Features l Magentic shielded construction l Compact and thin l Large Current and low DCR Dimensions and footprint (Unit: mm) Unit: mm TYPE A B C H(typ) J(typ) K(typ) HPSSDA ± ± ± Schematic diagram: Materials: a. core: ferrite DR core b. wite: Enamelled copper wite c. Adhesive: Epoxy resin General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: secs. 41
18 HPSSDA1608 Series SMD Shielded Power Inductor Part NO L(μH) RDC(Ω) Min 1R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% l Rated Current : last or lrms, whichever is lower. l Lsat : D.C. Current at which the inductance drops 35%(MAX.) from its value without current. Lrms : D.C. Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHZ, 0.1V HPSSDA Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPSSDA1608 T/R
19 Features: SMD Shielded Power Inductor HPCDN10 Series Various high power inductors are superior to be high saturation for surface mounting. Applications: Power supply for VTR, OA Equipment, Digital camera, LCD television set, notebook PC, portable communication equipments, DC-DC converters,etc. Dimensions and Land Patterns (Unit: mm) Unit: mm TYPE A(max) B(max) C(max) D(ref) J(typ) H(typ) K(typ) HPCDN HPCDN HPCDN Schematic diagram: Materials: a. Core: ferrite DR core b. Wire: enamelled copper wire c. Core: ferrite RI core d. Terminal: Ag+Sn+Ni General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: sec. 43
20 HPCDN Series SMD Shielded Power Inductor Part NO L(μH) R R R R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% l Rated Current : last or lrms, whichever is lower. l Lsat : D.C. Current at which the inductance drops 35%(MAX.) from its value without current. Lrms : D.C. Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHZ, 0.1V HPCDA Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPCDA10030 T/R13 1,000 HPCDA10040 T/R13 1,000 HPCDA10050 T/R
21 SMD Shielded Power Inductor HPSCBB12 Series Application Field l VTR,OA equipment, LCD television set, Notebook, portable communication equipments, DC/DC converters, etc Features l Magnetically shielded construction. l Compact and thin. l Large Current and Low DCR. Dimensions and footprint (Unit: mm) Unit: mm TYPE A B C H(typ) K(typ) J(typ) HPSCBB ± ± ± HPSCBB ± ± ± HPSCBB ± ± ± Schematic diagram: Materials: a. Core: ferrite core b. Wire: enamelled copper wire c. Terminal: Ag+Sn+Ni/Pb General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: secs. 45
22 HPSCBB1204 Series SMD Shielded Power Inductor Part NO L(μH) MaX 6R HPBSD Series PACKING UNIT: ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPSCBB1204 T/R 13 1,000 HPSCBB1205 T/R HPSCBB1207 T/R Rated Current code : N±30% M±20% L±15% K±10% J±5% l Rated Current : last or lrms, whichever is lower. l Lsat : D.C. Current at which the inductance drops 35%(MAX.) from its value without current. Lrms : D.C. Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHZ, 0.1V 46
23 HPSCBB1205 Series SMD Shielded Power Inductor Part NO L(μH) MaX 4R Rated Current code : N±30% M±20% L±15% K±10% J±5% l Rated Current : last or lrms, whichever is lower. l Lsat : D.C. Current at which the inductance drops 35%(MAX.) from its value without current. Lrms : D.C. Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHZ, 0.1V 47
24 HPSCBB1207 Series SMD Shielded Power Inductor Part NO L(μH) MaX 1R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% l Rated Current : last or lrms, whichever is lower. l Lsat : D.C. Current at which the inductance drops 35%(MAX.) from its value without current. Lrms : D.C. Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHZ, 0.1V 48
25 SMD Power Inductors HPNSDC6655 Series Features: l Various high power inductors are superior to be high saturation for surface mounting. Applications: l VGA display card, Notebook Computers, Step-up and step-down converters, Flash Memory programmers, etc. Dimensions and Land Patterns (Unit: mm) Unit: mm TYPE A B C D(ref) E(ref) I(typ) J(typ) H(typ) K(typ) HPNSDC ± ± ± HPNSDC ± ± ± Schematic diagram: Materials: a. Core: ferrite core b. Wire: enamelled copper wire d. Terminal: Ag+Sn+Ni General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: secs. 49
26 HPNSDC Series SMD Power Inductor Part NO L(μH) RDC(Ω) Min RDC(Ω) Min 1R R R R R R R R R R R R
27 Part NO L(μH) RDC(Ω) Min RDC(Ω) Min Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC: L/L(0A) 10% Inductctance tested : 1.0μH 8.2μH /100KHz/0.25V 10μH -3900μH /1KHz/0.25V HPNSDC Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPNSDC T/R13 2,500 HPNSDC T/R13 2,500 51
28 SMD Power Inductors HPSD03 /HPSD04 /HPSD05 HPSD07 /HPSD10 Series Application Field l VTR, OA equipment, LCD television set,notebook,portable communication equipments, DC/DC converters etc Features l Open Magnetic circuit construction. l Compact and thin. l Put the electrode with ferrite core directly a small surface area allow a high mounting density. Dimensions and footprint (Unit: mm) TYPE A B C D(ref) J(typ) H(typ) Unit: mm K(typ) HPSD ± ± ± HPSD ± ± ± HPSD ± ± ± HPSD ± ± ± HPSD ± ± ± Schematic diagram: Materials: a. Core: ferrite core b. Wire: enamelled copper wire c. Terminal: Ag+Ni+Sn General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: secs. 52
29 HPSD Series SMD Power Inductor Part NO L(μH) 1R R R R R R R R R R R
30 HPSD Series SMD Power Inductor Part NO L(μH) RDC(Ω) Min RDC(Ω) Min RDC(Ω) Min RDC(Ω) Min RDC(Ω) Min Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC : D.C Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHz, 0.1V HPSD Series PACKING UNIT : ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPSD0302 T/R13 2,000 HPSD0403 T/R13 2,000 HPSD0504 T/R13 1,000 HPSD0705 T/R13 1,000 HPSD1005 T/R13 1,000 54
31 SMD Power Inductor HPNSD12 /HPNSD1807 Series Application Field l Notebook DC/DC converter, handheld devise, VGA card. Features l Open Magnetic circuit construction. l Compact and thin. l Large Current and Low DCR (NSD1807S). Dimensions and footprint (Unit: mm) Unit: mm TYPE A() B() C() D E F G H(typ) J(typ) K(typ) HPNSD ± ± ± ± HPNSD ± ± ± ± HPNSD ± ± ± ± HPNSD ± ± ± ref Schematic diagram: Materials: a. Core: ferrite DR core b. Wire: Enamelled copper wire c. Adhesive: Epoxy resin General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: secs. 55
32 HPNSD1203 Series SMD Power Inductor Part NO L(μH) RDC(Ω) HPNSD Series PACKING UNIT: ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPNSD1203 T/R 13 1,500 56
33 HPNSD1205 Series SMD Power Inductor Part NO L(μH) Rated Current lsat lrms 1R R R R R R HPNSD Series PACKING UNIT: ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPNSD1205 T/R Rated Current code : N±30% M±20% L±15% K±10% J±5% l Rated Current : last or lrms, whichever is lower. l Lsat : D.C. Current at which the inductance drops 35%(MAX.) from its value without current. Lrms : D.C. Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHZ, 0.1V 57
34 HPNSD1211 Series SMD Power Inductor Part NO L(μH) Rated Current lsat lrms 1R R R R R R R R HPNSD Series PACKING UNIT: ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPNSD1211 T/R Rated Current code : N±30% M±20% L±15% K±10% J±5% l Rated Current : last or lrms, whichever is lower. l Lsat : D.C. Current at which the inductance drops 35%(MAX.) from its value without current. Lrms : D.C. Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHZ, 0.1V 58
35 HPNSD1807 Series SMD Power Inductor Part NO L(μH) RDC(Ω) lsat Rated Current 1R R R R R R lrms Rated Current code : N±30% M±20% L±15% K±10% J±5% l Rated Current : last or lrms, whichever is lower. l Lsat : D.C. Current at which the inductance drops 35%(MAX.) from its value without current. Lrms : D.C. Current for temperature rise T=40 C above 20 C ambient Inductctance tested : 100KHZ, 0.1V HPNSD Series PACKING UNIT: ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPNSD1807 T/R
36 SMD Power Inductors HPBSD0806/HPBSD1205/HPBSD2207 Series Application Field l Notebook, Low voltage DC-DC converter power supply applications PDA. Features l Open Magnetic circuit construction. l Compact and thin. l Rugged self ledded construction. l 8mm high for large and low DCR(BSD2207). Dimensions and footprint (Unit: mm) Unit: mm TYPE A() B() C() D(ref) E(ref) H(typ) J(typ) K(typ) HPBSD HPBSD HPBSD Schematic diagram: Materials: a. Core: ferrite DR core b. Wire: enamelled copper wire d. Adhesive: Epoxy resin General Specification: a. Storage temp: b. Operating temp: c. Resistance to solder heat: secs. 60
37 HPBSD0806 Series SMD Power Inductor Part NO L(μH) RDC(Ω) Min SRF(MHZ)Min R R R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC: L/L(0A) 10% Inductctance tested : 0.56μH -8.2μH/100KHz/0.25V 10μH -100μH /1KHz/0.25V 61
38 HPBSD1205 Series SMD Power Inductor Part NO L(μH) RDC(Ω) Min SRF(MHZ)Min R R R R R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC: L/L(0A) 10% Inductctance tested : 0.33μH -8.2μH/100KHz/0.25V 10μH -100μH /1KHz/0.25V 62
39 HPBSD2207 Series SMD Power Inductor Part NO L(μH) RDC(Ω) Min SRF(MHZ)Min R R R R R R R R R R R Rated Current code : N±30% M±20% L±15% K±10% J±5% IDC: L/L(0A) 10% Inductctance tested : 0.78μH -8.2μH/100KHz/0.25V 10μH -100μH /1KHz/0.25V HPBSD Series PACKING UNIT: ITEM NO DIMENSIONS OF REEL Q TY/REEL(PCS) HPBSD0806 T/R HPBSD1205 T/R HPBSD2207 T/R
INDEX HOESUNG COIL PARTS
1. Metal Molding High Current SMD Power Inductor PART NO DEMINSION(mm) Inductance Range Rated DC Current Page MMI 06518 SERIES 6.5 7.1 1.8 1.0uH ~ 4.7uH 9.8A ~ 5.0A 5 MMI 06524 SERIES 6.5 7.1 2.4 0.47uH
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