Surface Mount Resistors Packaging Method (Taping)
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1 Products Precision Metal Film (Thin Film), High Reliability Type /High Sound Quality Type / Low Resistance Type Current Sensing Resistors, Metal Plate Type Current Sensing Resistors, Metal Foil Type Surface Mount Resistors Series Pressed Packaging (Standard Quantity : pcs./reel) Embossed ERJXGN 42(15) 2, 4, ERJ1GN 63(21) 15, ERJ2GE 15(42) 1,, 2, ERJ3GE 168(63) 5, ERJ6GE 2(85) 5, ERJ8GE 3216(6) 5, ERJ (1) 5, ERJ 4532(18) 5, ERJZ 525(21) 5, ERJ1T 6432(25) 4, ERJXGN 42(15) 2, 4, ERJ1GN/1RH 63(21) 15, ERJ2RC/2RH/2RK 15(42) 1, ERJ3RB/3RE/3EK 168(63) 5, ERJ6RB/6RE/6EN 2(85) 5, ERJ8EN 3216(6) 5, ERJ14N 3225(1) 5, ERJN 4532(18) 5, ERJS 525(21) 5, ERJ1TN 6432(25) 4, ERA1A 63(21) 15, ERA2A/2H 15(42) 1, ERA3A 168(63) 5, ERA6A 2(85) 5, ERA8A 3216(6) 5, ERJ2LW/2BW 15(42) 1, ERJ2BS/2BQ 15(42) 1, ERJ3L/3B/3R/L3 168(63) 5, ERJ6L/6B/6C ERJ6D/6R/L6 2(85) 5, ERJ8B/8C/8R/L8 3216(6) 5, ERJ14B/14R/L (1) 5, ERJR/L 4532(18) 5, ERJZ/L1D 525(21) 5, ERJ1TR 6432(25) 4, ERJL1W 6432(25) 3, 3216(6) 3, ERJMP3 525(21) 3, ERJMP4 6432(25) 2, ERJMS4 6432(25) 2, ERJMS6 6468(2526) 1, (8 mm Pitch) ERJMB1 255() 3, ERJM1W 6432(25) 3, ERJMFBA 15(42) 1, W8P2 : Width 8 mm, Pitch 2 mm, W4P1 : Width 4 mm, Pitch 1 mm (1) Anti-Sulfurated High Power / Wide Terminal Type 14 Jan. 218
2 Products High Power / Wide Terminal Type High Precision/ Anti-Surge Anti-Pulse Anti-Sulfurated Array Anti-Sulfurated Array Networks Chip Attenuator Surface Mount Resistors Series Pressed Packaging (Standard Quantity : pcs./reel) Embossed ERJA1 3264(25) 4, ERJB1/ERJC1 (1) 255() 5, ERJB2 1632(6) 5, ERJB3 2(58) 5, ERJPA2 15(42) 1, ERJPB3/P3/PA3 168(63) 5, ERJPB6/P6 2(85) 5, ERJP8 3216(6) 5, ERJP (1) 5, ERJT6 2(85) 5, ERJT8 3216(6) 5, ERJT (1) 5, ERJU1 63(21) 15, ERJS2/U2 15(42) 1, ERJS3/U3 168(63) 5, ERJS6/U6 2(85) ERJU6S/U6Q/UP6 5, ERJS8/U8/UP8 3216(6) 5, ERJS14/U (1) 5, ERJS/U 4532(18) 5, ERJS1D/U1D 525(21) 5, ERJS1T/U1T 6432(25) 4, EXB14V 86(32) 1, EXB24V 11(44) 1, EXB34V 1616(66) 5, EXBV4V 1616(66) 5, EXB18V 146(52) 1, EXB28V 21(84) 1, EXBN8V 21(84) 1, EXB38V 3216(6) 5, EXBV8V 3216(6) 5, EXBS8V 522(29) 2,5 EXB2HV 3816(156) 5, EXBU14 86(32) 1, EXBU18 146(52) 1, EXBU24 11(44) 1, EXBU (66) 5, EXBU28 21(84) 1, EXBU (6) 5, EXBU2H 3816(156) 5, EXBD 3216(6) 5, EXBE 421(168) 4, EXBA 6431(25) 4, EXBQ 3816(156) 5, EXB14AT 86(32) 1, EXB24AT 11(44) 1, (1) Anti-Sulfurated High Power / Wide Terminal Type 14 Jan. 218
3 Carrier Tape Pressed Carrier Carrier Embossed Carrier fd P 1 P 2 P B W F E T T T A P 1 (2 mm Pitch) fd 1 (Only Emboss) Pressed (2 mm Pitch) / Precision Chip / Metal Film(Thin Film)Chip / Low Resistance / Anti-Surge / Anti-Sulfur A B W F E P 1 P 2 P D T ERJXGN 42(15).24 ±.3.45 ±.3.31 ±.5 ERJ1GN ERJ1R 63 ERJU1 (21).38 ±.5.68 ±.5 8. ± ± ±.1 2. ±.1 2. ±.5 4. ± ERA1A.42 ±.5 ERJ2LW 15(42).68 ± ±.1.6 ±.5 ERJ2BW 15(42).67 ± ±.1.61 ±.5 (2 mm Pitch) / Precision Chip / Metal Film(Thin Film)Chip / Low Resistance / Anti-Surge / Anti-Sulfur / Metal Foil Type ERJ2 ERJPA2 ERJ 2 ERA2 (4 mm Pitch) / Precision Chip / Metal Film(Thin Film)Chip / Low Resistance / High Power / High Precision / Anti-Surge / Anti-Pulse / Anti-Sulfur ERJ3 ERJ3LW(1 mω) ERJ3BW 168 ERJ 3 (63) ERA3A ERJ3LW(5 mω) ERJ6 ERJ 6 ERJU6S, U6Q ERA6A ERJB3 2(58) ERJ6BW 2 ERJ6LW (85) ERJ6CW ERJ8 ERJ8 W ERJ 8 ERA8A 15 (42) ERJB2 1632(6) A B W F E P 1 P 2 P D T.67 ± ±.5 8. ± ± ±.1 2. ±.1 2. ±.5 4. ± ±.5 ERJMFBA.6 ±.5 A B W F E P 1 P 2 P D T 1.1 ± ±.1 2 (85) 1.65 ± ± ± ±.2 8. ± ± ±.1 4. ±.1 2. ±.5 4. ± ±.5.84 ±.5.94 ± (6) 2. ± ±.2.84 ±.5 Array / Anti-Sulfurated Array / Chip Attenuator A B W F E P 1 P 2 P D T EXB14V EXB14AT (32) EXB18V 146(52) 1.6 ±.1 EXB24V EXBU24 11 EXB24AT (44) 8. ± ± ±.1 2. ±.1 2. ±.5 4. ± ±.5 EXB28V EXBU28 EXBN8V 21 (84) 1.2 ± ± ±.1 Jan. 218
4 Array / Anti-Sulfurated Array / Networks A B W F E P 1 P 2 P D T EXB34V EXBU (66) 1.95 ±.2 EXB38V EXBU (6) 3.6 ±.2.7 ±.5 EXB2HV 1.95 ± (156) 4.1±.15 EXBU2H 8. ± ± ±.1 4. ±.1 2. ±.5 4. ± EXBV4V 1616(66) 1.95 ±.2 EXBV8V 3216(6) 3.6 ±.2.84 ±.5 EXBD 3216(6) 2. ± ±.2.84 ±.1 EXBQ 3816(156) 1.9 ± ±.2.64 ±.5 Embossed (1 mm Pitch) A B W F E P 1 P 2 P D T ERJXGN 42(15).25 ±.5.45 ±.5 4. ± ±.5.9 ±.1 1. ±.1 1. ±.1 2. ±.1.8 ±.1.5 max. Embossed (4 mm Pitch) / Precision Chip / Low Resistance / High Power / Anti-Surge / Anti-Pulse / Anti-Sulfur Pulse / Anti-Sulfur A B W F E P 1 P 2 P D T D1 ERJ ERJ 14 (1) 2.8 ± ±.2 8. ± ±.5 ERJ 4532 ERJ (18) 3.5 ± ±.2 ERJZ 525 ERJS ERJ 1D (21) ERJB1 255 ERJC1 () ERJ1T ERJ 1T 6432 (25) ± ± ± ±.1 4. ±.1 2. ±.5 4. ± ± ± min. 3.6 ± ±.2 ERJL1W 1.6 ±.1 ERJA1 3264(25) 3.5 ± ± ±.2 Current Sensing Resistors, Metal Plate Type Array / Networks A B W F E P 1 P 2 P D T D1 EXBS8V 522(229) 2.8 ± ± max. EXBE 421(168) 2.5 ± ±.2. ± ± ±.1 4. ±.1 2. ±.5 4. ± min. 1.1 ±.2 EXBA 6431(25) 3.5 ± ±.2 A B W F E P 1 P 2 P D T D1 (1m Ω) 3216(6) 1.55 ±.2 (2m Ω) 3216(6) 1.9 ± ±.2 8. ± ± ±.2 (3 to 5m Ω) 3216(6) 1.1±.2 ERJMP3 (1 to 2m Ω) 525(21) ± ERJMP3 2.9 ± ±.2. ± ± ±.1 4. ±.1 2. ±.5 4. ± (3 to 5m Ω) 525(21) 1.15±.2 ERJMB1 255() 1.55 ±.2 ERJMP4 (1 to 2m Ω) 6432(25) 1.6 ± min. ERJMP4 (3 to 5m Ω) 6432(25) 3.5 ± ±.2. ± ±.1 1.2±.2 ERJMS4 6432(25) 1.6 ± min. ERJM1W 6432(25) 1.8 ± min. Jan. 218
5 Embossed (8 mm Pitch) Current Sensing Resistors, Metal Plate Type A B W F E P 1 P 2 P D T D1 ERJMS6 6468(2526) 6.9 ± ±.2. ± ± ±.1 8. ±.1 2. ±.5 4. ± ± min. Taping Reel fc fn ±3. Tape Width (W) A N C W 1 W 2 4mm Width ±.5 7. ± fa W1 W2 8mm Width ± ±.2 mm Width ±1. 24mm Width 38. ±2. 8. ± ± ±1. Jan. 218
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YAGEO CORPORATION SMD INDUCTOR / BEADS CLH Series Multilayer Chip Inductors High Frequency Lead-free / For High Frequency Applications APPLICATIONS RF Resonance and Impedance Matching Circuit RF and Wireless
Thin Film Chip Inductor
Scope -Calchip s 0201 and 0402 series inductor is a photo lithographically etched single layer ceramic chip. Calchip s design provides high, excellent Q, and superior temperature stability. This highly
SPECIFICATION FOR APPROVAL
信昌電子陶瓷股份有限公司 Prosperity Dielectrics Co., Ltd. No. 148, Chang-An Road, Sec 1,Lu-Tsu Shiang, Taoyuan, Taiwan, ROC. Tel.:886-3-3224471 Fax:886-3-3212216 SPECIFICATION FOR APPROVAL DATE: CUSTOMER: LIMITED
High Voltage Thick Film Chip Resistor. RCV Series. Features. Applications. Construction
High Voltage Thick Film Chip Resistor High Voltage Thick Film Chip Resistor Features Highly reliable multilayer electrode construction High component and equipment reliability Excellent performance at
Polymer PTC Resettable Fuse: KRT Series
Polymer PT Resettable use: KRT Series Radial Lead Type or Telecom pplications eatures 1. RoHS & Halogen-ree (H) compliant 2. Hold current ratings from 0.08 to 0.18 3. High operating voltage rating :100Vdc/250Vdc
Pb Chip Ferrite Inductor (MFI Series) Engineering Spec.
RoHS Pb Chip Ferrite Inductor (MFI Series) Engineering Spec. FEATURES The monolithic construction performs high reliability and ensures a closed magnetic flux in a component avoids magnetic and interference
RoHS 555 Pb Chip Ferrite Inductor (MFI Series) Engineering Spec.
RoHS 555 Pb Chip Ferrite Inductor (MFI Series) Engineering Spec. PRODUCT DETAIL Electrical Characteristics μh L (Min) Q MHz (Min) SRF Ω DCR IDC ma TEST FREQ: MHz TEST LEVEL: 100 mv Test Instruments HP4291
Thin Film Precision Chip Resistor-AR Series
hin Film Precision hip Resistor-R Series Features -hin film passivated ir resistor -Very tight tolerance down to ±0.01% -Extremely low R down to ±5 PPM/ -ide resistance range 1ohm ~ 3Meg ohm -Miniature
NTIC Series. Limiting Inrush Current. NTC Power Thermistor for FEATURES PART NUMBER SYSTEM UL E Ф5~Ф15mm NTIC M S.
FEATURES UL E223037 Body size: Ф5mm ~ Ф30mm Radial lead resin coated High power rating Wide resistance range Cost effective Operating temperature range: Ф5mm: -40ºC~150ºC Ф8~Ф10mm: -40ºC~170ºC Ф13~Ф30mm:
Low Value Multilayer Inductors (LMCI Series)
Structure Features: RoHS Compliant and Halogen Free Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs Size range: 0201, 05, 1608 Perfect shape for automatic mounting
TODA-ISU Corporation. SMD Power Inductor. SPI series. SMD Team
SMD Power Inductor SPI series TODA-ISU Corporation Advantages & Applications Advantages Low profile High current capability & Low DCR Low temperature rise Increased thermal efficiency Patent (Coil Integrated
Thick Film Array Chip Resistor
CN Series Scope -This specification applies to all sizes of rectangular-type fixed chip resistors with Ruthenium-base as material. Features -Small size and light weight -Reduction of assembly costs and
THICK FILM LEAD FREE CHIP RESISTORS
Features Suitable for lead free soldering. Compatible with flow and reflow soldering Applications Consumer Electronics Automotive industry Computer Measurement instrument Electronic watch and camera Configuration
SMD Power Inductor-VLH
SMD Power Inductor-VH Dimensions Unit: mm Type A B C E F H I J 252010 2.5±0.2 2.0±0.2 1.0max. 0.4±0.2 1.0min. 2.1 0.90 0.8 252012 2.5±0.2 2.0±0.2 1.2max. 0.4±0.2 1.0min. 2.1 0.90 0.8 321618C 3.2±0.3 1.6±0.2
Metal Film Leaded Precision Resistor
Power ratio(%) MFR Series Features Excellent overall stability Very tight tolerance down to ±0.05% Extremely low TCR down to ±5 PPM/ C High power rating up to 3 Watts Excellent ohmic contact Applications
Polymer PTC Resettable Fuse: KMC Series
Features 1. RoHS & Halogen-Free (HF) compliant 2. IA size: 0603, 0805, 1206, 1812 3. Hold current ratings from 0.05 to 3A 4. Voltage ratings from 6V computer and electronic applications to 60V 5. Small
DC-DC converter circuits for mobile phones, wearbale devices, DVCs, HDDs, etc.
Multilayer Chip Power Inductor MPH Series Operating Temp. : -40 ~+85 FEATURES Higher DC bias current and lower DC resistance due to Trench Technology Low profile and thin thickness Monolithic structure
Thin Film Chip Inductor
Scope -Viking s 0201 and 0402 series inductor is a photo lithographically etched single layer ceramic chip. Viking s design provides high, excellent Q, and superior temperature stability. This highly stable
NTC Thermistor:TSM type
Features. RoHS compliant 2. EIA size 0402, 0603, 0805, 206 3. Highly reliable structure 4. -40 ~ +25 operating temperature range 5. Wide resistance range 6. Cost effective 7. Agency recognition: UL Recommended
B37631 K K 0 60
Multilayer Ceramic acitors High; X5R and X7R Chip Ordering code system B37631 K 7 5 K 6 Packaging 6 ^ cardboard tape, 18-mm reel 62 ^ blister tape, 18-mm reel Internal coding acitance tolerance K ^ ± %
MULTILAYER CHIP VARISTOR JMV S & E Series: (SMD Surge Protection)
INTRODUCTION Metal Oxide based chip varistors (JMVs) are used for transient suppression. JMVs have non-linear - behavior, which is similar to that of Zener Diode. Each grain in JMV exhibits small p-n junction
Thin Film Precision Chip Resistor-AR Series
hin Film Precision hip Resistor-R Series Features -hin Film Passivated ir Resistor -Very ight olerance from ±0.01%~1% -Extremely Low R from ±5~ PPM/ -ide R-Value onstruction Marking pplications -Medical
High Voltage Thick Film Chip Resistor
Scope -his specification applies to all sizes of rectangular-type fixed chip resistors with Ruthenium-base as material. Features -Highly reliable multilayer electrode construction -Higher component and
HIS series. Signal Inductor Multilayer Ceramic Type FEATURE PART NUMBERING SYSTEM DIMENSIONS HIS R12 (1) (2) (3) (4)
FEATURE High Self Resonant Frequency Superior temperature stability Monolithic structure for high reliability Applications: RF circuit in telecommunication PART NUMBERING SYSTEM HIS 160808 - R12 (1) (2)
Unshielded Power Inductors
Unshielded Power Inductors /080/0804/0810/106/106 Series Inductance with current and temperature: Inductance is measured with P-484 LR Meter or equivalent. Inductance drops 10% typical at Isat level with
SMD Power Inductor-VLH
SMD Power Inductor-VH PAD AYOUT Dimensions Unit: mm Type A B C E F H I J 252010 2.5±0.2 2.0±0.2 1.0max. 0.4±0.2 1.0min. 2.1 0.90 0.8 252012 2.5±0.2 2.0±0.2 1.2max. 0.4±0.2 1.0min. 2.1 0.90 0.8 252510 2.5±0.2
High Frequency Chip Inductor / CF TYPE
High Frequency Chip Inductor / CF TYPE.Features: 1.Closed magnetic circuit avoids crosstalk. 2.S.M.T. type. 3.Excellent solderability and heat resistance. 4.High realiability. 5.The products contain no
Current Sensing Chip Resistor
Features -3 atts power rating in 1 att size, 1225 package -Low CR of ±100 PPM/ C -Resistance values from 1m to 1 ohm -High purity alumina substrate for high power dissipation -Long side terminations with
Shunts & Multiple Shunts. Stamped Contact DIP IC Sockets. PLCC Sockets. Jumpers. DDR DIMM Sockets SOCKETS. System CS - Technical Specifications
System - Technical Specifications Shunts & Multiple Shunts Stamped Contact DIP IC Sockets ~ ~ PLCC Sockets ~ Jumpers ~ DDR DIMM Sockets Electrical: Current/Voltage rating: 0.5A/25VAC for Single Type 0.3A/25VAC
SPM R2 M P S A
Wire Wound s (SPM/SAM/SPS/SPH/SPN Series) Ordering Code Product Code: SPM: Molding Inductor-General SAM: Molding Inductor-Automotive SPM 2520 2R2 M P S A SPS : Metal Coating (Ultra high Current) SPN :
RoHS ASPI. Test Condition. DCR IDC Marking
-3D, 4D, 5D, 6D FEATURES: Magnetic shielded for low radiation Low profile, compact size Large Terminal surface for good PCB bonding Low DCR, High Energy storage, suitable for large currents Ideal for a
Thin Film Chip Resistors
FETURES PRECISE TOLERNCE ND TEMPERTURE COEFFICIENT EI STNDRD CSE SIZES (0201 ~ 2512) LOW NOISE, THIN FILM (NiCr) CONSTRUCTION REFLOW SOLDERLE (Pb FREE TERMINTION FINISH) Type EI Size Power Rating at 70
NTC Thermistor:SCK Series
Features. RoHS & Halogen Free (HF) compliant 2. Body size: Ф5mm ~ Ф30mm 3. Radial lead resin coated 4. High power rating 5. Wide resistance range 6. Cost effective 7. Operating temperature range: Ф5mm: