Contents Overview of Flexible Electronics Technology
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1 Contents 1 Overview of Flexible Electronics Technology... 1 I-Chun Cheng and Sigurd Wagner 1.1 HistoryofFlexibleElectronics MaterialsforFlexibleElectronics Degrees of Flexibility Substrates Backplane Electronics Frontplane Technologies Encapsulation Fabrication Technology for Flexible Electronics Fabrication on Sheets by Batch Processing FabricationonWebbyRoll-to-RollProcessing AdditivePrinting Outlook References Mechanical Theory of the Film-on-Substrate-Foil Structure: Curvature and Overlay Alignment in Amorphous Silicon Thin-Film Devices Fabricated on Free-Standing Foil Substrates Helena Gleskova, I-Chun Cheng, Sigurd Wagner, and Zhigang Suo 2.1 Introduction Theory The Built-in Strain ε bi Applications Strain in the Substrate, ε s (T d ), and the Film, ε f (T d ), at the Deposition Temperature T d Strain in the Substrate, ε s (T r ), and the Film, ε f (T r ), at Room Temperature T r RadiusofCurvatureRoftheWorkpiece Strain of the Substrate and the Curvature of the Workpiece for a Three-Layer Structure Experimental Results for a-si:h TFTs Fabricated on Kapton ix
2 x Contents 2.4 Conclusions References Low-temperature Amorphous and Nanocrystalline Silicon Materials and Thin-film Transistors Andrei Sazonov, Denis Striakhilev, and Arokia Nathan 3.1 Introduction Low-temperature Amorphous and Nanocrystalline SiliconMaterials Fundamental Issues for Low-temperature Processing Low-temperature Amorphous Silicon Low-temperature Nanocrystalline Silicon Low-temperatureDielectrics Characteristics of Low-temperature Dielectric Thin-film Deposition Low-temperatureSiliconNitrideCharacteristics Low-temperatureSiliconOxideCharacteristics Low-temperatureThin-filmTransistorDevices DeviceStructuresandMaterialsProcessing Low-temperature a-si:h Thin-Film Transistor Device Performance Contactstoa-Si:HThin-filmTransistors Low-temperature Doped nc-si Contacts Low-temperaturenc-SiTFTs Device Stability Conclusions and Future Prospective References Amorphous Silicon: Flexible Backplane and Display Application Kalluri R. Sarma 4.1 Introduction Enabling Technologies for Flexible Backplanes and Displays Flexible Substrate Technologies TFT Technologies for Flexible Backplanes Display Media for Flexible Displays (LCD, Reflective-EP, OLED) Barrier Layers Flexible Active Matrix Backplane Requirements foroleddisplays ActiveMatrixAddressing Flexible AMOLED Displays Using a-si TFT Backplanes Backplane Fabrication Using PEN Plastic Substrates FlexibleOLEDDisplayFabrication Flexible AMOLED Display Fabrication with Thin-film Encapsulation
3 Contents xi 4.5 Flexible Electrophoretic Displays Fabricated using a-si TFT Backplanes Outlook for Low-Temperature a-si TFT for Flexible Electronics Manufacturing References Flexible Transition Metal Oxide Electronics and Imprint Lithography Warren B. Jackson 5.1 Introduction PreviousWork Properties of Transistor Materials Semiconductors Dielectrics ContactMaterials DeviceStructures Fabrication on Flexible Substrates Imprint Lithography Self-Aligned Imprint Lithography SAILTransistorResults Summary of Imprint Lithography FlexibleTMODeviceResults FutureProblemsandAreasofResearch CarrierDensityControl Low-TemperatureDielectrics EtchingofTMOMaterials P-typeTMO Stability Flexure and Adhesion of TMO FlexibleFabricationMethodYields Summary References Materials and Novel Patterning Methods for Flexible Electronics William S. Wong, Michael L. Chabinyc, Tse-Nga Ng, and Alberto Salleo 6.1 Introduction MaterialsConsiderationsforFlexibleElectronics Overview Inorganic Semiconductors and Dielectrics Organic Semiconductors and Dielectrics Conductors Print-ProcessingOptionsforDeviceFabrication Overview...150
4 xii Contents Control of Feature Sizes of Jet-Printed Liquids Jet-PrintingforEtch-MaskPatterning Methods for Minimizing Feature Size PrintingActiveMaterials Performance and Characterization of Electronic Devices Overview BiasStressinOrganicThin-FilmTransistors Nonideal Scaling of Short-Channel Organic TFTs Low-Temperature a-si:h TFT Device Stability Low-temperaturea-Si:Hp i ndevices PrintedFlexibleElectronics Overview Digital Lithography for Flexible Image Sensor Arrays Printed Organic Backplanes Conclusions and Future Prospects References Sheet-Type Sensors and Actuators Takao Someya 7.1 Introduction Sheet-type Image Scanners Imaging Methods Device Structure and Manufacturing Process Electronic Performance of Organic Photodiodes OrganicTransistors Photosensor Cells Issues Related to Device Processes: Pixel Stability andresolution A Hierarchal Approach for Slow Organic Circuits The Double-Wordline and Double-Bitline Structure A New Dynamic Second-Wordline Decoder Higher Speed Operation with Lower Power Consumption New Applications and Future Prospects Sheet-Type Braille Displays Manufacturing Process Electronic Performance of Braille Cells OrganicTransistor-basedSRAM Reading Tests Future Prospects Summary References
5 Contents xiii 8 Organic and Polymeric TFTs for Flexible Displays and Circuits Michael G. Kane 8.1 Introduction ImportantOrganicTFTParametersforElectronicSystems Field-Effect Mobility ThresholdVoltage Subthreshold Swing Leakage Currents Contact Resistance Capacitances and Frequency Response TFT Nonuniformity Bias-Stress Instability and Hysteresis ActiveMatrixDisplays Introduction Liquid Crystal and Electrophoretic Displays ActiveMatrixOLEDDisplays Introduction UsingOrganicTFTsforElectronicCircuits Thin-FilmTransistorCircuits Frequency Limitations of OTFTs IntegratedDisplayDrivers Radio Frequency Identification Tags Conclusion References Semiconducting Polythiophenes for Field-Effect Transistor Devices in Flexible Electronics: Synthesis and Structure Property Relationships Martin Heeney and Iain McCulloch 9.1 Introduction Polymerization of Thiophene Monomers General Considerations Synthetic Routes for the Preparation of Thiophene Polymers Poly(3-Alkylthiophenes) Electrical Properties Thin-film Device Processing and Morphology Doping and Oxidative Stability Polythiophene Structural Analogues Thienothiophene Polymers Poly(Thieno(2,3-b)Thiophenes) Poly(Thieno(3,2-b)Thiophenes) Summary References
6 xiv Contents 10 Solution Cast Films of Carbon Nanotubes for Transparent Conductors and Thin Film Transistors David Hecht and George Grüner 10.1 Introduction: Nanoscale Carbon for Electronics, the Value Proposition Carbon NT Film Properties Carbon Nanotubes: The Building Blocks Carbon Nanotube Network as an Electronic Material Electrical and Optical Properties of NT Films Doping and Chemical Functionalization Fabrication Technologies Solubilization Deposition Carbon NT Films as Conducting and Optically TransparentMaterial Network Properties: Sheet Conductance and Optical Transparency Applications: ITO Replacement Challenges and the Path Forward TFTs with Carbon Nanotube Conducting Channels DeviceCharacteristics DeviceParameters Challenges and the Path Forward Conclusions References Physics and Materials Issues of Organic Photovoltaics Shawn R. Scully and Michael D. McGehee 11.1 Introduction BasicOperation Photocurrent DarkCurrent OrganicandHybridSolarCellArchitectures Materials LightAbsorption ExcitonHarvesting EffectsofDisorder ExtrinsicDefects MeasuringExcitonHarvesting Approaches to Overcome Small Diffusion Lengths ExcitonDissociation DissociatingGeminatePairs HeterojunctionEnergyOffsets Charge Transport and Recombination Diffusion-Limited Recombination
7 Contents xv Interface-Limited (Back Transfer Limited) Recombination MeasurementsRelevantforExtractingCharge Nanostructures EfficiencyLimitsandOutlook References Bulk Heterojunction Solar Cells for Large-Area PV Fabrication on Flexible Substrates C. Waldauf, G. Dennler, P. Schilinsky, and C. J. Brabec 12.1 Introduction and Motivation Photovoltaics Technology Overview Motivation for Large-Area, Solution-Processable Photovoltaics The Concept of Bulk Heterojunction Solar Cells BasicsofOrganicSolarCellMaterials Fundamentals of Photovoltaics Understanding and Optimization of BHJ Composites Challenges for Large-Area Processing Production Scheme Encapsulation of Flexible Solar Cells Conclusions References Substrates and Thin-Film Barrier Technology for Flexible Electronics Ahmet Gün Erlat, Min Yan, and Anil R. Duggal 13.1 Introduction Barrier Requirements Generic Requirements Substrate-Specific Requirements Thin-Film Barrier Technology Historical Background Permeation Measurement Techniques Permeation Through Thin-Film Barriers Barrier DeviceIntegration Substrate and Barrier Compatibility with OLEDs Thin-Film Encapsulation Concluding Remarks References Index...451
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Technology and Applications of Amorphous Silicon
Springer Series in Materials Science 37 Technology and Applications of Amorphous Silicon Technology and Applications Bearbeitet von Robert A. Street 1. Auflage 1999. Buch. xii, 417 S. Hardcover ISBN 978
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