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6 Loss of Gain Over Temperature Thermopad Response Linear Compensation Attenuation + = Attenuation Attenuation Temperature Temperature Temperature OPEN Decision Tool or

7 FOOT PRINT X 3.10mm [0.145 x 0.122] X 3.68mm [0.160 x 0.145] X 1.52mm [0.070 x 0.060] X 1.27mm [0.080 x 0.050] X 1.52 mm [0.075 x 0.060] X 1.65mm [0.120 x 0.065] THERMOPAD TVA ETVA WTVA AN7 MTVA /AN5 KTVA/QTVA FIXED TSO3 TSO3 TSO9 TSO7 TSO5 KFA /QFA or

8 Attenuation (α) ( ) dα TCA = dt db/db/ C α 25 C α 25 C dα 25 C dt Temperature (T) or

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ommon Substrate VSWR Comparison 2 Aluminum Nitride 1.8 Beryllium Oxide Diamond Frequency (GHz) 5x Power 10x Frequency 1/5 Size 34"56(7+1+5-%8(9:#8@,.",) or A#:,!"#$%&'()**+&,#*%-. //0/1!"#$%&'(2+.".*%-. /3045(!"#$%&'(6+-$"&#*"%&

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77 C T D LENGTH 04 = = 0.05" 06 = 0.06 TYPE 13 = 0.13" CT = Chip Terminations Note: Not every combination of size is available. WIDTH 02 = = 0.03" 05 = = 0.10" SUBSTRATE D = CVD Diamond or

78 C T D H T LENGTH 05 = 0.05" 13 = 0.13" TYPE CT = Chip Terminations WIDTH SUBSTRATE 05 = 0.05" D = CVD Diamond 10 = 0.10" (blank) = Chip Only T = Input Tab HT = Heat Sink and Tab TB = Tab Bent or

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94 RF Labs PIM Others PIM f (MHz) Part Number Power (W) LOW PIM TERMINATIONS NOTE Frequency PIM (dbc) VSWR (x:1) Footprint mm Configuration Chip Material 32P7037F 250 DC 2.7 GHz x 9.53 Flange Mount AlN 32P7196F 60 DC 2.0 GHz x 9.53 Flange Mount AlN 32P7204F 100 DC 4.0 GHz x 6.35 Flange Mount AlN 32P7197F 110 DC 2.5 GHz x 9.53 Flange Mount AlN 32P7198F 150 DC 2.3 GHz x 9.53 Flange Mount AlN 32P7201F 150 DC 2.2 GHz x 9.53 Flange Mount AlN NOTE - With 2 x 43 dbm input or

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96 HybriX Couplers Part Number Frequency [MHz] Power Rating [watts] Amplitude Balance [+/-db max] Insertion loss [db Max] Size [in] Phase HG064M2F x HD064M3F x BD064M3F x HE128MF x HD128M3F x HE298MF x HE450M2F x Part Number Frequency [MHz] HybriX Crossover Power Rating [watts] or IL [db] Isolation Size [in] XPMRF DC x XFMRF DC x 0.100

97 Electrically Isolating Electrically Conductive Thermal Bridging or

98 SD A Diamond Isolated [1.143] [0.635] [0.381] SD A Diamond Isolated [1.397] [1.397] [0.381] SD A Diamond Isolated [1.651] [0.889] [0.381] SD A Diamond Isolated [2.667] [2.667] [0.381] SD A Diamond Isolated [3.048] [2.032] [0.508] SD A Diamond Isolated [3.302] [2.667] [0.381] SD B Diamond Conductive [1.143] [0.635] [0.305] SD B Diamond Conductive [1.143] [0.635] [0.381] SD B Diamond Conductive [1.270] [0.508] [0.305] SD B Diamond Conductive [1.397] [1.397] [0.305] SD B Diamond Conductive [1.397] [1.397] [0.381] SD B Diamond Conductive [1.651] [0.889] [0.305] SD B Diamond Conductive [1.651] [0.889] [0.381] SD B Diamond Conductive [2.667] [2.667] [0.305] SD B Diamond Conductive [2.667] [2.667] [0.381] SD B Diamond Conductive [3.302] [2.667] [0.305] SD B Diamond Conductive [3.302] [2.667] [0.381] SD Diamond Bridging [1.143] [0.635] [0.381] [0.381] SD Diamond Bridging [1.397] [1.397] [0.381] [0.381] SD Diamond Bridging [1.651] [0.889] [0.381] [0.635] SD Diamond Bridging [2.667] [2.667] [0.381] [0.889] SD Diamond Bridging [3.302] [2.667] [0.381] [1.016] or

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105 Additional RF Component Testing Available: Stability of Attenuation After: Temperature Change Thermal Shock Vibration Shock Moisture Resistance Peak Power Salt Spray Sensitivity of Attenuation After: Change in Input Power Change in Frequency Change in Temperature Vibration and Shock Testing Moisture Resistance Peak Power Salt Spray Barometric Pressure Outgassing Endurance Resistance to Bonding Exposure Low Temperature Operation Short Term Overload High Temperature Exposure Solderable Mounting Integrity Bondable Mounting Integrity Resistance to Solvents Gross and Fine Leak Detection Multipaction Testing Radiographic Inspection First Article Inspection Pre-Cap Inspection Source Inspection Other testing services are available upon request. GROUP A TESTING AND INSPECTION (100% of the lot) Pre-cap Visual Inspection Conductor Metallization Defects Resistor Defects Substrate Defects Foreign Material Visual Mechanical Inspection Electrical Inspections Electrical Performance Thermal Shock Electrical Performance Burn-In [100% 168 hours at input power] Final RF Test Percent Defective Allowable (PDA) Temperature Coefficient of Attenuation GROUP B TESTING AND INSPECTION (Sample) Subgroup 1 (sample) Low Temperature Operation Electrical Performance High Temperature Bake Visual Mechanical Inspection Electrical Performance Termination Adhesion (Planar, W1, W3 only) Bondability (WB1 and G only) Termination Solderability (Planar, W1, W3, T3 and T3S only) Terminal Lead Strength (T3 and T3S only) Subgroup 2 (sample) Electrical Performance Life Test. Sample units for 1000 hours at the maximum input power specified Electrical Performance GROUP C TESTING AND INSPECTION (Sample) Electrical Performance Load Life. Burn-in units at 125 C for duration of 1000 hours at maximum input power specified. Electrical Performance Data Review and Data Pack or

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