Production specification. Low profile package with built-in strain relief for surface mounted applications
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1 FEATURES Plastic package has underwriters laboratory flammability classification 94V-0 Optimized for LAN protection applications Low profile package with built-in strain relief for surface mounted applications Low incremental surge resistance, excellent clamping capability 400W peak pulse power capability with a 10/1000 Ìs wave form, repetition rate (duty cycle): 0.01% (300W above 78V) Very fast response time High temperature soldering guaranteed: 260 / 10 seconds at terminals MECHANICAL DATA Case: JEDEC DO-214AC molded plastic over passivated chip Terminals: solder plated, solderable per MIL-STD-750, method 2026 Polarity: foruni-directional types the color band denotes the cathode, which is postitive with respect to the anode under normal TVS operation Mounting position: any Weight: ounces, grams Devices for Bidirectional Applications For bi-directional devices, use suffix C or CA (e.g. SMAJ10C, SMAJ10CA). Electrical characteristics apply in both directions. Maximum Ratings and Thermal Characteristics (T A =25 unless otherwise noted) Characteristic Symbol Value Unit Peak power dissipation with a 10/1000μs waveform (NOTE 1,2, FIG.1) P PPM Minimum 400 W Peak pulse current with a 10/1000μs waveform (NOTE 1) See next table A Typical thermal resistance, junction to ambient (NOTE 3) R θ JA /W Peak forward surge current, 8.3ms single half sine-wave uni-directional only (NOTE 2) I FSM 40.0 A Typical thermal resistance, junction to ambient (NOTE 3) R θ J L 30 /W Operating junction and storage temperature range T J, T STG NOTES: (1) Non-repetitive current pules, per Fig. 3 and derate above T A =25 per Fig. 2. Rating is 300W above 78V. (2) Mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pads to each terminal. (3) Mounted on minimum recommended pad layout. 1
2 ELECTRICAL CHARACTERISTICS (T A =25 ) Type Device marking code UNI BI Dynamic I RM VC T Min Max m A V u A A V SMAJ5.0 AAD AWD SMAJ5.0A AAE AWE SMAJ6.0 AAF AWF SMAJ6.0A AAG AWG SMAJ6.5 AAH AWH SMAJ6.5A AAK AWK SMAJ7.0 AAL AWL SMAJ7.0A AAM AWM SMAJ7.5 AAN AWN SMAJ7.5A AAP AWP SMAJ8.0 AAQ AWQ SMAJ8.0A AAR AWR SMAJ8.5 AAS AWS SMAJ8.5A AAT AWT SMAJ9.0 AAU AWU SMAJ9.0A AAV AWV SMAJ10 AAW AWW SMAJ10A AAX AWX SMAJ11 AAY AWY SMAJ11A AAZ AWZ SMAJ12 ABD AXD SMAJ12A ABE AXE SMAJ13 ABF AXF SMAJ13A ABG AXG SMAJ14 ABH AXH SMAJ14A ABK AXK SMAJ15 ABL AXL SMAJ15A ABM AXM SMAJ16 ABN AXN SMAJ16A ABP AXP SMAJ17 ABQ AXQ SMAJ17A ABR AXR SMAJ18 ABS AXS SMAJ18A ABT AXT
3 Device marking Type code UNI BI Dynamic I RM VC T Min Max m A V u A A V SMAJ20 ABU AXU SMAJ20A ABV AXV SMAJ22 ABW AXW SMAJ22A ABX AXX SMAJ24 ABY AXY SMAJ24A ABZ AXZ SMAJ26 ACD AYD SMAJ26A ACE AYE SMAJ28 ACF AYF SMAJ28A ACG AYG SMAJ30 ACH AYH SMAJ30A ACK AYK SMAJ33 ACL AYL SMAJ33A ACM AYM SMAJ36 ACN AYN SMAJ36A ACP AYP SMAJ40 ACQ AYQ SMAJ40A ACR AYR SMAJ43 ACS AYS SMAJ43A ACT AYT SMAJ45 ACU AYU SMAJ45A ACV AYV SMAJ48 ACW AYW SMAJ48A ACX AYX SMAJ51 ACY AYY SMAJ51A ACZ AYZ SMAJ54 ARD AZD SMAJ54A ARE AZE SMAJ58 ARF AZF SMAJ58A ARG AZG SMAJ60 ARH AZH SMAJ60A ARK AZK SMAJ64 ARL AZL SMAJ64A ARM AZM SMAJ70A ARP AZP SMAJ75 ARQ AZQ SMAJ75A ARR AZR SMAJ78 ARS AZS SMAJ78A ART AZT
4 Type Device marking code UNI BI Dynamic I RM V C T Min Max m A V u A A v SMAJ85 ARU AZU SMAJ85A ARV AZV SMAJ90A ARX AZX SMAJ100 ARY AZY SMAJ100A ARZ AZZ SMAJ110 ASD AVD SMAJ110A ASE AVE SMAJ120 ASF AVF SMAJ120A ASG AVG SMAJ130 ASH AVH SMAJ130A ASK AVK SMAJ150 ASL AVL SMAJ150A ASM AVM SMAJ160 ASN AVN SMAJ160A ASP AVP SMAJ170 ASQ AVQ SMAJ170A ASR AVR SMAJ188 AST AVT SMAJ188A ASS AVS
5 PACKAGE OUTLINE DIMENSIONS DO-214AC(SMA) Dim Min Max A B C D E 0.2Typical F G 0.20MAX H I All Dimensions in mm SOLDERING FOOTPRINT Unit :mm PACKAGE INFORMATION Device Package Shipping SMAJ5.0-SMAJ188CA DO-214AC(SMA) 5000/Tape&Reel 5
6 6
For bi-directional devices, use suffix C or CA (e.g. SMAJ10C, SMAJ10CA). Electrical characteristics apply in both directions.
Transient Suppressor Features Optimized for LAN protection applications Low profile package with built-in strain relief for surface mounted applications Low incremental surge resistance, excellent clamping
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ISO/TS16949 ISO 9001 ISO14001 2015 Thermistor (NTC /PTC) GNTC (Chip in Glass Thermistor) SMD NTC Thermistor SMD PTC Thermistor Radial type Thermistor Bare Chip Thermistor (Gold & silver Electrode) 9B-51L,
NTIC Series. Limiting Inrush Current. NTC Power Thermistor for FEATURES PART NUMBER SYSTEM UL E Ф5~Ф15mm NTIC M S.
FEATURES UL E223037 Body size: Ф5mm ~ Ф30mm Radial lead resin coated High power rating Wide resistance range Cost effective Operating temperature range: Ф5mm: -40ºC~150ºC Ф8~Ф10mm: -40ºC~170ºC Ф13~Ф30mm:
YAGEO CORPORATION SMD INDUCTOR / BEADS. CLH Series. Lead-free / For High Frequency Applications. CLH1005-H series CLH1608-H series ~1.4 0.
YAGEO CORPORATION SMD INDUCTOR / BEADS CLH Series Multilayer Chip Inductors High Frequency Lead-free / For High Frequency Applications APPLICATIONS RF Resonance and Impedance Matching Circuit RF and Wireless
SCL Series. Multilayer Chip Ferrite Inductor
Multilayer Chip Ferrite Inductor Features 1 Monolithic structure for high reliability 2 Compact size inductor possible 3 No cross coupling due to magnetic shield 4 Perfect shape for mounting with no directionality
Current Sensing Chip Resistor
Features -3 atts power rating in 1 att size, 1225 package -Low CR of ±100 PPM/ C -Resistance values from 1m to 1 ohm -High purity alumina substrate for high power dissipation -Long side terminations with
Power Inductor LVS Series
RoHS Compliant Halogen Free REACH Compliant Part Numbering LVS 6645 L - 1R M - AU Series Name Dimensions Code Inductance Internal Code (mm) (uh) Tolerance 4412 4.x4.x1.2 L Low DCR R47.47 M ±% 4418 4.x4.x1.8
Bluetooth / WLAN / WiFi Ceramic Chip Antenna Ground cleared under antenna, clearance area 4.00 x 4.25/6.25 mm. Pulse Part Number W3008, W3008C
W8 Datasheet version.7. ceramic antenna. (/) Ground cleared under antenna, clearance area 4. x 4.5/6.5 mm. Pulse Part Number W8, W8C Features - Omni directional radiation - Low profile - Compact size W
Ceramic PTC Thermistor Overload Protection
FEATURES compliant CPTD type are bare disc type CPTL type are leaded Low, medium and high voltage ratings Low resistance; Small size No need to reset supply after overload No noise generated Stable over
SURFACE MOUNT NPN SILICON HIGH FREQUENCY TRANSISTOR
FEATURES HIGH GAIN BANDWIDTH PRODUCT: ft of LOW VOLTAGE/LOW CURRENT OPERATION HIGH INSERTION POWER GAIN: SE = db @ V, 7 ma, GHz SE = db @ V, ma, GHz LOW NOISE:. db AT. GHz AVAILABLE IN SIX LOW COST PLASTIC
Thin Film Precision Chip Resistor (AR Series)
Construction D1 L (AR Series) Features -Advanced thin film technology -Very tight tolerance down to ±0.01% -Extremely low TCR down to ±5PPM/C -Wide resistance range 1ohm ~ 3Mega ohm -Miniature size 0201
Thin Film Chip Inductor
Scope -Viking s 0201 and 0402 series inductor is a photo lithographically etched single layer ceramic chip. Viking s design provides high, excellent Q, and superior temperature stability. This highly stable
1 Alumina Substrate 4 Edge Electrode (NiCr) 7 Resistor Layer (NiCr) 2 Bottom Electrode (Ag) 5 Barrier Layer (Ni) 8 Overcoat (Epoxy)
ARN series Thin Film High Precision Chip Resistor Features» Advanced thin film technology» Very tight tolerance down to ±0.01%» Extremely low TCR down to ±5ppm/» Wide resistance range 1ohm-3Mega ohm» Miniature
LR(-A) Series Metal Alloy Low-Resistance Resistor
LR(A) Series Metal Alloy LowResistance Resistor This specification is applicable to lead free, halogen free of RoHS directive for metal alloy lowresistance resistor. The product is for general purpose.
THICK FILM CHIP RESISTOR" CAL-CHIP ELECTRONICS INC."
THICK FILM CHIP RESISTOR CAL-CHIP ELECTRONICS INC. CAL-CHIP SERIES: RM SERIES 1 2 3 INTRODUCTION SCOPE Applies to all sizes of rectangular-type fixed chip resistors with Ruthenium base as material. FEATURES
NPIS Shielded Power Inductors
FEATURES SHIELDED POWER INDUCTOR ULTRA LOW PROFILE (1.0 ~ 4.5mm MAX. HEIGHT) SURFACE MOUNTABLE CONSTRUCTION INDUCTANCE VALUES UP TO 220µH TAPED AND REELED FOR AUTOMATIC INSERTION CHARACTERISTICS Case Size
SMD Power Inductor-VLH
SMD Power Inductor-VH PAD AYOUT Dimensions Unit: mm Type A B C E F H I J 252010 2.5±0.2 2.0±0.2 1.0max. 0.4±0.2 1.0min. 2.1 0.90 0.8 252012 2.5±0.2 2.0±0.2 1.2max. 0.4±0.2 1.0min. 2.1 0.90 0.8 252510 2.5±0.2
1000 VDC 1250 VDC 125 VAC 250 VAC J K 125 VAC, 250 VAC
Metallized Polyester Film Capacitor Type: ECQE(F) Non-inductive construction using metallized Polyester film with flame retardant epoxy resin coating Features Self-healing property Excellent electrical
Thin Film Chip Resistors
FETURES PRECISE TOLERNCE ND TEMPERTURE COEFFICIENT EI STNDRD CSE SIZES (0201 ~ 2512) LOW NOISE, THIN FILM (NiCr) CONSTRUCTION REFLOW SOLDERLE (Pb FREE TERMINTION FINISH) Type EI Size Power Rating at 70
Pb Chip Ferrite Inductor (MFI Series) Engineering Spec.
RoHS Pb Chip Ferrite Inductor (MFI Series) Engineering Spec. FEATURES The monolithic construction performs high reliability and ensures a closed magnetic flux in a component avoids magnetic and interference
ISM 900 MHz Ceramic Antenna Ground cleared under antenna, clearance area mm x 8.25 mm. Pulse Part Number: W3012
W0 Datasheet version.. Ceramic Antenna. (0/08). Ceramic Antenna Ground cleared under antenna, clearance area 0.80 mm x 8.5 mm. Pulse Part Number: W0 Features - Omni directional radiation - Low profile
2.5 GHz SILICON MMIC WIDE-BAND AMPLIFIER
. GHz SILICON MMIC WIDE-BAND AMPLIFIER UPC79T FEATURES WIDE FREQUENCY RESPONSE:. GHz 3 GAIN vs. FREQUENCY HIGH GAIN: 3 db (UPC79T) SATURATED OUTPUT POWER: +. dbm (UPC79T) INTERNAL CURRENT REGULATION MINIMIZES