AL Series - Thin Film Chip Inductor
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1 Features A Photo Lithographic Single Layer Ceramic Chip High SRF, Excellent, Superior Temperature Stability Tight Tolerance of ± % or ±.nh Self Resonant Frequency Controlled within % Stable Inductance in High Frequency Circuit Highly Stable Design for Critical Needs Products with Pb-free Terminations Meet RoHS Requirements Applications Cellular Telephone, Pagers and GPS Products VCO,TCXO Circuit and RF Transceiver Module Wireless LAN, Bluetooth Module, Communication Appliances Construction How to Order How to Order AL G T N SEI Type Dimensions (LxW) Inductance Tolerance Packaging Inductance Type Codes Dimensions (LxW) EIA Codes Type Codes Type Codes Type AL AL. x. mm J ± % T Tape and Reel N.nH AL. x. mm H ± % N nh G ± % N.nH F ± % R nh S ±.nh C ±.nh B ±.nh
2 Dimensions Unit: mm Codes A B C D AL.±..±..±..±. C AL.±..±..±..±. D D B Standard Electrical Specifications A Chip Inductors Inductance (nh) Tolerance (% or nh) uality Factor /min. Resistance DC/Max (Ohm) Current DC/Max (ma) Self Resonant Frequency/min. (GHz).././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..9././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz.9 ///% / MHz.9 ///% / MHz. ///% / MHz. ///% / MHz. ///% / MHz.9 ///% / MHz. ///% / MHz.. 9 ///% / MHz.. ///% / MHz.. ///% / MHz. ///% / MHz. ///% / MHz. Test Equipment: HPA+Agilent 9A
3 Standard Electrical Specifications Chip Inductors Inductance (nh) Tolerance (% or nh) uality Factor /min. Resistance DC/Max (Ohm) Current DC/Max (ma) Self Resonant Frequency/min. (GHz).././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz..9././.nH / MHz..././.nH / MHz..././.nH / MHz..9././.nH / MHz..././.nH / MHz..././.nH / MHz..././.nH / MHz...././.nH / MHz.. 9.././.nH / MHz.. ///% / MHz.. ///% / MHz... ///% / MHz.. ///% / MHz.. ///% / MHz.9. ///% / MHz... ///% / MHz. 9. ///% / MHz. 9. ///% / MHz.. ///% / MHz.. Test Equipment: HPA+Agilent 9B
4 Inductor Electrical Characteristics- Series
5 Inductor Electrical Characteristics- Series ALGTN ALGTN ALGTN ALGTN
6 Inductor Electrical Characteristics- Series ALGTN ALGTN ALGTN ALGTN ALGTN ALGT9N ALGTR ALGTN
7 Inductor Electrical Characteristics- Series ALBTN ALBTN inductance(nh) FREUENCY (MHz) FREUENCY (MHz) ALBTN ALBTN Iuductance(nH).. FREUENCY (MHz).. FREUENCY (MHz) ALBTN.. FREUENCY (MHz)... ALBTN FREUENCY (MHz)... ALBTN FREUENCY (MHz)... ALBTN FREUENCY (MHz)
8 Inductor Electrical Characteristics- Series ALBTN ALBTN FREUENCY (MHz) FREUENCY (MHz) ALBTN ALBTN FREUENCY (MHz) FREUENCY (MHz) ALBTN ALBTN FREUENCY (MHz) FREUENCY (MHz) ALBTN9 FREUENCY (MHz) Inductance (nh)... ALBTN FREUENCY (MHz)
9 Inductor Electrical Characteristics- Series ALBTN ALBTN9 FREUENCY (MHz) FREUENCY (MHz) 9 ALBTN FREUENCY (MHz) 9 ALBTN FREUENCY (MHz) 9 ALBTN FREUENCY (MHz) ALBTN FREUENCY (MHz) ALBT9N ALGTN FREUENCY (MHz) FREUENCY (MHz) 9
10 Inductor Electrical Characteristics- Series ALGTN ALGTN FREUENCY (MHz) FREUENCY (MHz) ALGTN ALGTN FREUENCY (MHz) FREUENCY (MHz) ALGTN FREUENCY (MHz) ALGTN FREUENCY (MHz) ALGTN ALGTN FREUENCY (MHz) ALGTN
11 Packaging C W A B T Reel Specifications & Packaging uantity Unit: mm Codes ΦA ΦB ΦC W T Paper Tape (EA) AL ±.±..±..±..±., AL ±.+..±. 9.±..±., Paper Tape Specifications Bottom Tape Top Tape D A E B F W P T T Resistor P P P direction of unreeling Unit: mm Codes A B W E F P P P ψd T AL.±..±..±..±..±..±..±..±..±..±. AL.±..9±..±..±..±..±..±..±..±..±. Environmental Characteristics Item Specification Test Method Bending Test As SPEC. Dielectric Withstand Voltage >V Insulation Resistance >MΩ Resistance to Soldering Heat L% High Temperature Exposure L% Moisture Resistance L% Low Temperature Storage L% Temperature Cycle L% 9 Solderability 9% min coverage Storage Temperature : ; Humidity <%RH JIS-C--.. Bending Amplitude mm for seconds MIL-STD-F Method. Apply VA (rms) for minute. MIL-STD-F Method Apply VDC for minute. MIL-STD-F Method E ±, ±seconds JIS-C--. ±, +/ - hours MIL-STD-F Method B ±, 9~9%RH, +/ - hours JIS-C--. -±, +/ - hours JIS-C--. -/RT//RT, cycles MIL-STD-F Method H ±,±.(sec)
Data sheet Thin Film Chip Inductor AL Series
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CSK series. Current Sensing Chip Resistor. Features. Applications. Construction FAITHFUL LINK
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1 Alumina Substrate 4 Edge Electrode (NiCr) 7 Resistor Layer (NiCr) 2 Bottom Electrode (Ag) 5 Barrier Layer (Ni) 8 Overcoat (Epoxy)
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4. Construction. 5. Dimensions Unit mm
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Feature. shock and pressure. -Tighter tolerance down to ±2% -Smaller size of 0402 (1005) -CATV Filter, Tuner. -Cable Modem/ XDSL Tuner.
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.Features: 1.Coating epoxy resin that ensures the humidity resistance to be long life. 2.Contribute to be high Q and selfresonant frequencies.applications: 1.Electronics products. 2.Communication equipment.
Fixed Inductors / AL TYPE
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hin Film Precision hip Resistor-R Series Features -hin Film Passivated ir Resistor -Very ight olerance from ±0.01%~1% -Extremely Low R from ±5~ PPM/ -ide R-Value onstruction Marking pplications -Medical
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LR Series Metal Alloy Low-Resistance Resistor
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RS Series Current Sensing Thick Film Chip Resistor Current Sensing Thick Film Chip Resistor
Scope -his specification applies to all sizes of rectangular-type fixed chip resistors with Ruthenium-base as material. eatures -Low inductance -Highly reliable multilayer electrode construction -Higher
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SERIES DATASHEET INDUCTORS RF INDUCTORS (MRFI SERIES)
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Wire Wound Chip Ceramic Inductor SDWL-C Series Operating Temp. : -40 ~ N
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Configurations: Dimension (mm) 0.60 ±0.03 IMCH ±0.1 IMCH ±0.2 IMCH IMCH ± IMCH ±0.
Multilayer Chip s for High Frequency Configurations: FEATURES To prevent EMI interference noises between. High Q and high reliability and ceramic. Monolithic inorganic material construction. Shapes and
SMD Power Inductor-VLH
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IWCSeries FEATURES APPLICATION ORDERING CODE TRIGON COMPONENTS. Configurations: Dimension (mm) IWC C G 1608 K 22N T (1) (2) (3) (4) (5) (6) (7)
Configurations: FEATURES High frequency. Highest possible SRFs as well as excellent Q values. The wire is wound directed on the core at a precision pitch. RoHS Compliant. APPLICATION Pagers, Cordless phones
LR Series Metal Alloy Low-Resistance Resistor
Tel : 881745 Fax : 881749 LR Series Metal Alloy LowResistance Resistor This specification is applicable to lead free, halogen free of RoHS directive for metal alloy lowresistance resistor. The product
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Scope -Ceramic body and wire wound construction provide highest s available.. Features -Ceramic base provide high -Ultra-compact inductors provide high Q factors -ow profile, high current are available
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Thick Film Chip Resistor
Scope -his specification applies to all sizes of rectangular-type fixed chip resistors with Ruthenium-base as material. Features -Small size and light weight -Highly reliable multilayer electrode construction
Thick Film Chip Resistor
CR Series Scope -his specification applies to all sizes of rectangular-type fixed chip resistors with Ruthenium-base as material. Features -Small size and light weight -Highly reliable multilayer electrode
Metal thin film chip resistor networks
Metal thin film chip resistor networks AEC-Q200 Compliant Features Relative resistance and relative TCR definable among multiple resistors within package. Relative resistance : ±%, relative TCR: ±1ppm/
Thick Film Chip Resistor
CR Series Scope -his specification applies to all sizes of rectangular-type fixed chip resistors with Ruthenium-base as material. Features -Small size and light weight -Highly reliable multilayer electrode
Configurations: Dimension (mm) B (max) A (max) 0.20 IWCCG1005. Inductance Range IWCCG ~ IWCCG ~ 1000 IWCCG
Configurations: FEATURES High frequency. Highest possible SRFs as well as excellent Q values. The wire is wound directed on the core at a precision pitch. RoHS Compliant. APPLICATION Pagers, Cordless phones
Data Sheet. Size: 0201/0402/0603/0805/1206/1210/2010/2512 VIKING TECH CORPORATION KAOHSIUNG BRANCH 光頡科技股份有限公司高雄分公司
Data Sheet Customer: Product : Thin Film Precision Chip Resistor - AR Series Size: 0201/0402/0603/0805/1206/1210/2010/2512 Issued Date: 19-Aug-10 Edition : REV.C6 VIKING TECH CORPORATION 光頡科技股份有限公司 No.70,
Wire Wound Chip Ferrite Inductor SDWL-FW Series Operating Temp. : -40 ~+85 R27. External Dimensions 2012 [0805] 2520 [1008] 3216 [1206] 3225 [1210]
![Wire Wound Chip Ferrite Inductor SDWL-FW Series Operating Temp. : -40 ~+85 R27. External Dimensions 2012 [0805] 2520 [1008] 3216 [1206] 3225 [1210]](/thumbs/86/93358879.jpg "Wire Wound Chip Ferrite Inductor SDWL-FW Series Operating Temp. : -40 ~+85 R27. External Dimensions 2012 [0805] 2520 [1008] 3216 [1206] 3225 [1210]")
Wire Wound Chip Ferrite Inductor SDWL-FW Series Operating Temp. : -4 ~+85 FEATURES Small chip suitable for surface mounting High inductance with ferrite material APPLICATIONS Video cameras, liquid crystal
Inductor. TCRC Radial Series Choke Inductor - / 扼流线圈电感器 of 07
TCRC Radial Series Choke Inductor - / 扼流线圈电感器 Features Open Magnetic circuit construction. Low cost and high reliability. Applications Notebook, Notebook, Inkjet printer, Copying machine, Display monitor,
Thick Film Chip Resistors
FEATURES STANDARD SIZING 0402 (1/16W), 0603 (1/10W), 0805 (1/8W), 1206 (1/4W), 2010 (1/2W) AND 2512 (1W) HIGH VOLTAGE (100VDC ~ 3,000VDC) HIGH RESISTANCE VALUES (UP TO 100MΩ) THICK FILM ON ALUMINA SUSTRATE,
Multilayer Ceramic Chip Capacitor
.. Features -Wide capacitance range, extremely compost size -Low inductance of capacitor for high frequency application -Excellent solderability and resistance to soldering heat, suitable for flow and
Thin Film Chip Resistors
FETURES PRECISE TOLERNCE ND TEMPERTURE COEFFICIENT EI STNDRD CSE SIZES (0201 ~ 2512) LOW NOISE, THIN FILM (NiCr) CONSTRUCTION REFLOW SOLDERLE (Pb FREE TERMINTION FINISH) RoHS Compliant includes all homogeneous
B37631 K K 0 60
Multilayer Ceramic acitors High; X5R and X7R Chip Ordering code system B37631 K 7 5 K 6 Packaging 6 ^ cardboard tape, 18-mm reel 62 ^ blister tape, 18-mm reel Internal coding acitance tolerance K ^ ± %
Thin Film Chip Resistors
FETURES PRECISE TOLERNCE ND TEMPERTURE COEFFICIENT EI STNDRD CSE SIZES (0201 ~ 2512) LOW NOISE, THIN FILM (NiCr) CONSTRUCTION REFLOW SOLDERLE (Pb FREE TERMINTION FINISH) Type EI Size Power Rating at 70
No item Digit Description Series Reference (1) Meritek Series SI Signal Inductor LI: Leaded Inductor PI: Power Inductor
PART NUMBERING SYSTEM SI F 0805 K 780 F (1) (2) (3) (4) (5) (6) No item Digit Description Series Reference (1) Meritek Series SI Signal Inductor LI: Leaded Inductor PI: Power Inductor (2) Type F Ferrite
No item Digit Description Series Reference (1) Meritek Series SI Signal Inductor LI: Leaded Inductor PI: Power Inductor
FEATURE Operating Temperature: -40 C ~ +125 C Storage Temperature: 15~28 C; Humidity < 80%RH Ceramic base provide high SRF Ultra-compact inductors provide high Q factors Low profile, high current are available
Ferrite Chip Bead(Lead Free)
Ferrite Chip Bead(Lead Free) YCM-Series 1.Features 1. Monolithic inorganic material construction. 2. Closed magnetic circuit avoids crosstalk. 3. S.M.T. type. 4. Suitable for reflow soldering. 5. Shapes
Applications. 100GΩ or 1000MΩ μf whichever is less. Rated Voltage Rated Voltage Rated Voltage
Features Rated Voltage: 100 VAC, 4000VDC Chip Size:,,,,, 2220, 2225 Electrical Dielectric Code EIA IEC COG 1BCG Applications Modems LAN / WAN Interface Industrial Controls Power Supply Back-Lighting Inverter
Thick Film Chip Resistors
FEATURES STANDARD SIZING 0402 (1/16W), 0603 (1/10W), 0805 (1/8W), 1206 (1/4W), 2010 (1/2W) AND 2512 (1W) HIGH VOLTAGE (100VDC ~ 3,000VDC) HIGH RESISTANCE VALUES (UP TO 100MW) THICK FILM ON ALUMINA SUSTRATE,
SPECIFICATION FOR APPROVAL
信昌電子陶瓷股份有限公司 Prosperity Dielectrics Co., Ltd. No. 148, Chang-An Road, Sec 1,Lu-Tsu Shiang, Taoyuan, Taiwan, ROC. Tel.:886-3-3224471 Fax:886-3-3212216 SPECIFICATION FOR APPROVAL DATE: CUSTOMER: LIMITED
Multilayer Chip Capacitors C0G/NP0/CH
Multilayer Chip Capacitors C0G/NP0/CH Features Good thermal stability High insulation resistance Low dissipation factor Low inductance Applications Resonant circuits Filter circuits Timing elements Coupling
Chip Ferrite Bead MCB-S/B Series
Chip Ferrite Bead MCB-S/B Series Features Monolithic inorganic material construction Closed magnetic circuit avoids crosstalk SMD Type & suitable for reflow and wave soldering Available in various sizes
Data Sheet. VIKING TECH CORPORATION KAOHSIUNG BRANCH 光頡科技股份有限公司高雄分公司 No.248-3, Sin-Sheng Rd., Cian-Jhen Dist., Kaohsiung, 806, Taiwan
Data Sheet Customer: Product: Thick Film Chip Resistor - CR Series Size: 01005/0201/0402/0603/0805/1206/1210/2010/ 2512 Issued Date: Edition: 15-Mar-12 REV.B4 VIKING TECH CORPORATION 光頡科技股份有限公司 No.70,
HFC SERIES High Freq. Wound Ceramic Chip Inductors
FEATURES High frequency applications. Low DC resistance and high allowable DC current. Close tolerance application.2% tolerence is available for particular inductance values. Small footprint as well as