WLCW1005 SMD Wire Wound Ceramic Chip Inductors

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1 WCW1005 SMD Wire Wound Ceramic Chip Inductors *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_WCW1005 Series_V5.0 Mar. 2016

2 Features 1. Standard chip size bobbin with wire wound coil provides high reliability, productivity and performance. 2. Excellence and SRF characteristics for RF application, such as O tank, antenna matching and filter. 3. Wide range inductance and various tolerance options. 4. RoHS compliant. Applications 1. Communication: GSM/3G/TE, Wi-Fi, GPS. 2. Consumer: Cabel/Terrestrial/BS Tuner, Bluetooth, Wireless Audio, Remote control. 3. M2M: ZigBee, Proprietary wilreless. Shape and Dimension A C E D E B WCW1005 Unit: mm WCW Series A B C D E Max Max 0.64 Max Recommend Patterns G F G H Unit: mm WCW Series F G H Page 2 of 7 ASC_WCW1005 Series_V5.0 Mar. 2016

3 Ordering Information W CW 1005 Z0 G 1N0 T B Product Code W: Inductor Series Dimensions Series extension SMD Wire Wound Ceramic Chip inductor Z0:STD G: ± 2% Tolerance Value Packing Code J: ± 5% 1N0 =1.0nH 10N=10nH R10=100nH T=7 Reeled (Paper tape) B:STD Electrical Characteristics WCW1005 series Walsin Part Number (nh) Tolerance (Min) Measuring Frequency (MHz) 900 MHz 1.7 GHz SRF (GHz) Min RDC Max (Ω) WCW1005Z0 1N0TB 1.0 J WCW1005Z0 1N2TB 1.2 J WCW1005Z0 1N8TB 1.8 J WCW1005Z0 1N9TB 1.9 J WCW1005Z0 2N0TB 2.0 G J WCW1005Z0 2N2TB 2.2 G J WCW1005Z0 2N4TB 2.4 G J WCW1005Z0 2N7TB 2.7 G J WCW1005Z0 3N3TB 3.3 G J WCW1005Z0 3N6TB 3.6 G J WCW1005Z0 3N9TB 3.9 G J WCW1005Z0 4N1TB 4.1 G J WCW1005Z0 4N3TB 4.3 G J WCW1005Z0 4N7TB 4.7 G J WCW1005Z0 5N1TB 5.1 G J WCW1005Z0 5N6TB 5.6 G J WCW1005Z0 6N2TB 6.2 G J WCW1005Z0 6N8TB 6.8 G J WCW1005Z0 7N3TB 7.3 G J WCW1005Z0 7N5TB 7.5 G J WCW1005Z0 8N2TB 8.2 G J WCW1005Z0 8N7TB 8.7 G J WCW1005Z0 9N0TB 9.0 G J WCW1005Z0 9N1TB 9.1 G J WCW1005Z0 9N5TB 9.5 G J WCW1005Z0 10NTB 10 G J WCW1005Z0 11NTB 11 G J WCW1005Z0 12NTB 12 G J WCW1005Z0 13NTB 13 G J Irms (ma) Page 3 of 7 ASC_WCW1005 Series_V5.0 Mar. 2016

4 Walsin Part Number (nh) Tolerance (Min) OPERATING TEMPERATURE : -40 ~ 125 STORAGE TEMERATURE : -40 ~ 125 MS:EVE 1 Measuring Frequency (MHz) 900 MHz 1.7 GHz SRF (GHz) Min RDC Max (Ω) WCW1005Z0 15NTB 15 G J WCW1005Z0 16NTB 16 G J WCW1005Z0 18NTB 18 G J WCW1005Z0 19NTB 19 G J WCW1005Z0 20NTB 20 G J WCW1005Z0 22NTB 22 G J WCW1005Z0 23NTB 23 G J WCW1005Z0 24NTB 24 G J WCW1005Z0 27NTB 27 G J WCW1005Z0 30NTB 30 G J WCW1005Z0 33NTB 33 G J WCW1005Z0 36NTB 36 G J WCW1005Z0 39NTB 39 G J WCW1005Z0 40NTB 40 G J WCW1005Z0 43NTB 43 G J WCW1005Z0 47NTB 47 G J WCW1005Z0 51NTB 51 G J WCW1005Z0 56NTB 56 G J WCW1005Z0 62NTB 62 G J WCW1005Z0 68NTB 68 G J WCW1005Z0 75NTB 75 G J WCW1005Z0 82NTB 82 G J WCW1005Z0 91NTB 91 G J WCW1005Z0 R10TB 100 G J Irms (ma) Page 4 of 7 ASC_WCW1005 Series_V5.0 Mar. 2016

5 Characteristic Curve WCW1005 series Material ist ITEM PART DESCRIPTION U NO. 1 WIRE SODERABE NAMEED COPPER WIRE. OR EUIV. E EPOXY UV OR EUIV UV Pb FREE OR EUIV TERMINA PATEING AgPd+Sn+Ni Page 5 of 7 ASC_WCW1005 Series_V5.0 Mar. 2016

6 Test condition & Requirements (WCW1005 series) No. Item Test condition Requirements 1 Salt Spray Test Chamber temperature 35, the concentration of salt spray 5% (Total 24 hours). 2 Humidity Test +40 ± 2, humidity of 90% ± 5% (total 96 hours). 3 4 High Temperature Storage ow Temperature Storage 5 Thermal Shock 1.Temperature: 125, 100, 85, 70, 55, 40, Test time: 2, 16, 72, 96 hours. 1. Temperature: -40, -25, Test time: 2, 16, 72, 96 hours. 6 ife Test +100 ±2 (1000Hour). 7 Vibration Test +125 ±5 (30 minutes) ~ -40 ± 5 (30 minutes), temperature switch time: 5 minutes (total 50 cycles) HZ, amplitude: 1.5mm, direction: X, Y, Z axes, and each axis 2 hours (total 6 hours). Method 101E Test Condition C Method 103B Test Condition B IEC 68-2 Test Condition B IEC 68-2 Test Condition A Method 107G Test Condition B-2 Method 108A Test Condition D Method 201A 8 Solder Heat Resistance Test DIP: Soak in 260 solder pot, stay 10Sec Reflow: Keep 250 ±5,30 ±5Sec in air, Temperature ramp:+1~4 C/sec; Above1 83 C, must keep 90 s s. Method 210F Test Condition B(DIP) Test Condition (Reflow) 9 Terminal Pull Strength Test 1/2, 1, 2, 3, 5, 10 Pound, as products terminal feature. Method 211A Test Condition A Solder Ability Test Terminal Push Strength Test Soak in 255 solder pot of 3Sec, PAD must have 95% above coverage. J-STD-003B No special requirements: 5N thrust to maintain 10 Sec. JIS C5321:1997 ical RoHS Reflow Profile Page 6 of 7 ASC_WCW1005 Series_V5.0 Mar. 2016

7 Packaging Specification THICKNESS (t) 0.10 MAX PAPER CAVITY THE FORCE FOR TEARING OFF COVER TAPE IS 10 TO 60 GRAMS IN THE ARROW DIRECTION. 165 TO 180 TOP COVER TAPE PAPER CARRIER BASE TAPE END START NO COMPONENTS 160 (mm) MIN COMPONENTS NO COMPONENTS MIN. 390 (mm) COVER TAPE USER DIRECTION OF FEED MAX. 560 (mm) CARRIER TAPE REES (mm) MATERIA: PASTIC DIMENSIONS OF CARRIER TAPE (mm) G 1.75± ± ±0.1 ψ A B N ψc W P ψc E T A B C E G N P T W DIM TO. MAX. ± MIN MAX ±0.2 uantity per reel:4k pcs Page 7 of 7 ASC_WCW1005 Series_V5.0 Mar. 2016

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