CAE ( Moldflow) FPC. TFT-LCD FPC Moldflow FPC
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1 TFT-LCD FPC 98 6
2 CAE ( Moldflow) FPC FPC QA FPC Moldflow ABAQUS TFT-LCD FPC Moldflow FPC Moldflow ABAQUS Moldflow ABAQUS Moldflow ABAQUS
3 Abstract Due to the effects of uneven cooling rate, different material contraction and different fiber orientation, the connectors will warp after injection molding process. Therefore, the CAE software modeling injection molding (for example, Moldflow) is used to predict the warping behavior to ensure its value is confined to specifications requirement as designing the connectors. However, for FPC connectors, they are soldered on mother board by circle soldering process. As a result, the new thermal warping is induced by the residual stress, the anisotropic material property and fiber orientation on the injected connectors after they go through the circle soldering process. It is frequently occurred that the injected part can meet the specifications requirement but they cannot pass QA qualification due to the new thermal warping caused by circle soldering process. The thermal warping cannot be predicted by injection molding software along. It is proposed in the present analysis to combine the injection molding software Moldflow and the structural analysis software ABAQUS to study the thermal warping behavior for FPC connecters of TFT-LCD. First, the injection warping analysis is conducted by using Moldflow. As following, the thermal warping analysis is executed by using ABAQUS by inputting the residual stress, the anisotropic material property and fiber orientation etc. calculated by Moldflow as initial conditions through the Moldflow-ABAQUS interface module. Keywords: Warping, Connector, Moldflow, ABAQUS
4 ( : NSC E )
5 TFT-LCD FPC Moldflow Moldflow CAE ABAQUS ABAQUS CAE ABAQUS ABAQUS Moldflow ABAQUS Moldflow Moldflow ABAQUS ABAQUS Moldflow
6
7 1.1.1 TFT-LCD ( ) TFT-LCD ( ) D D :(a) (b) Global size = 1mm Global size = 0.3mm Global size = 0.2mm Global size = 0.15mm Global size = 1mm Global size = 0.3mm Global size = 0.2mm Global size = 0.15mm Global size = 1mm (Y ) Global size = 0.3mm (Y ) Global size = 0.2mm (Y )... 20
8 Global size = 0.15mm (Y ) ABAQUS ABAQUS ABAQUS (Y ) ABAQUS (Z ) ABAQUS (Y ) ABAQUS (Y ) ABAQUS (Z ) ABAQUS (Z ) ABAQUS (Y ) Moldflow (Z ) Case1 (Y ) Case1 (Y ) Case1 (Z ) Case1 (Z ) Case2 (Y )... 45
9 4.3.7 Case2 (Y ) Case2 (Z ) Case2 (Z ) Case3 (Y ) Case3 (Y ) Case3 (Z ) Case3 (Z ) Case4 (Y ) Case4 (Y ) Case4 (Z ) Case4 (Z ) :case3 ; :case :case1 ; :case (Y ) (Y ) (Y ) (Y ) (Z ) (Z ) (Z ) (Z ) (Y ) (Y ) (Y )... 61
10 5.2.6 (Z ) (Z ) (Z ) ( ) ( ) (230 ) ( ) ( 92.6 ) ( ) : ; : ; ( ) : ; : ; ( )... 67
11 PA case2. 58
12 1.1 PC DisplaySearch 99% 15% % LCD TV FPC (FPC) TFT-LCD DisplaySearch 2009 TFT-LCD , TFT-LCD DisplaySearch 4% %[1] FPC JAE Hirose 10% 30% FPC PC FPC FPC FPC FPC FPC 1
![[2]~[4] 1.](/docs-images/87/97050038/images/13-2.jpg "2 TFT-LCD")
13 [2]~[4] 1.2 TFT-LCD TFT-LCD thin-film transistor liquid-crystal display.( ) TFT-LCD TFT-LCD TFT-LCD TFT-LCD LCD TFT (TFT) TFT-Array TFT-LCD TFT-LCD [5] TFT-LCD ( ) 2
14 1.1.2 TFT-LCD ( ) 1.3 FPC TFT-LCD FPC FPC :(1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (1) 3
15 PCB (SURFACE MOUNT TECHNOLOGY) SMT (PCB) SMT 1.SMT PCB SMT
16 1.4.1 ( ) 2. SMT PCB
17 (1) Ramp-up : : (2) Soak or Preheat : PCB (3) Spike or Peak : 3 /sec (4) (Cooling): ( 1.4.3) (3-5 /sec)
![[6]~[9] 1.](/docs-images/87/97050038/images/18-16.jpg "4.5 PCB 1.")
18 mm/s 7 25 [6]~[9] PCB
19 1.5 Moldflow 1.6 TFT-LCD Moldflow Moldflow ABAQUS ABAQUS ABAQUS Moldflow ABAQUS ABAQUS
20 Moldflow ( ) Moldflow ABAQUS Interface for Moldflow ABAQUS Moldflow ABAQUS ( ) Moldflow ABAQUS ABAQUS ( )
21 Moldflow 2.1 Moldflow CAE Moldflow CAE 1976 CAE Moldflow CAE Moldflow CAE Moldflow Moldflow CAE : (1)?? (2)? 10
22 CAE (1) (2) CAE (3) Moldflow (4) (5) CAE Moldflow CAE (1) 11
23 (2) (3) (4) 12
24 D 106D Moldflow [10] 13
25 D 14
![[11]~[12]](/docs-images/87/97050038/images/26-22.jpg "2.3.1 15")
26 2.3 : [11]~[12]
![[13]~[16]](/docs-images/87/97050038/images/27-5.jpg "2..1-2.")
27 2.3.2 :(a) (b) [13]~[16]
28 2.4.1 Global size = 1mm Global size = 0.3mm Global size = 0.2mm Global size = 0.15mm 106D
29 2.4.5 Global size = 1mm Global size = 0.3mm 18
30 2.4.7 Global size = 0.2mm Global size = 0.15mm 19
31 Y Global size = 1mm (Y ) Global size = 0.3mm (Y ) Global size = 0.2mm (Y ) Global size = 0.15mm (Y ) 20
32 Z Global size = 1mm (Z ) Global size = 0.3mm (Z ) Global size = 0.2mm (Z ) Global size = 0.15mm (Z ) 0.15mm 21
33 2.4.1 (1 =0.01mm)
34 ABAQUS 3.1 ABAQUS CAE Abaqus IC Abaqus 23
35 Abaqus Abaqus Abaqus [17] 3.2 ABAQUS ABAQUS
36
37
![[18]~[21]](/docs-images/87/97050038/images/38-2.jpg "3.2.8 3.2.8 27")
38 3.2.7 ABAQUS ABAQUS [18]~[21]
39 3.3 ABAQUS Moldflow FPC Moldflow ABAQUS Moldflow ABAQUS TFT-LCD FPC Moldflow FPC Moldflow ABAQUS Moldflow [22] ABAQUS ABAQUS Moldflow ABAQUS Moldflow 1 ( )_mesh.inp: 2 ( )_e11.xml: 1 3 ( )_e22.xml: 2 4 ( )_e33.xml: 3 5 ( )_g12.xml: ( )_g13.xml: ( )_g23.xml: ( )_v12.xml: ( )_v13.xml: ( )_v23.xml: ( )_ltec_1.xml: 1 12 ( )_ltec_2.xml: 2 13 ( )_ltec_3.xml: 3 28
40 14 ( )_initstress.xml: 15 ( )_principaldirections.xml: 15 ABAQUS : ( ).inp ABAQUS input file ( ).mpt ( ).opt ( ).tpt ( ).rpt ABAQUS S11, S22, S33, S12, S13, S23 S11, S22, S33 S12, S13, S23 : 1, , , , , , Pa, Pa, Pa P, Pa, Pa 29
41 3.4 ABAQUS Moldflow ABAQUS Moldflow ABAQUS ABAQUS (Y ) 30
42 3.4.3 ABAQUS (Z ) ABAQUS ABAQUS (Y ) 31
43 3.4.5 ABAQUS (Y ) ABAQUS (Z ) 32
44 3.4.7 ABAQUS (Z ) ABAQUS Moldflow Moldflow 33
45 34 Moldflow ABAQUS 4.1 [23]~[27] : Fourier T(x,y,z,t) : t T c Q z T k z y T k y x T k x T z y x : : T c : k
46 35 : Q (1) ) ( ),,, ( t T t z y x T (2) (t) q n z T k n y T k n x T k f z z y y x x (3) ( T) T h n z T k n y T k n x T k c z z y y x x :,, z y x n n n (t): T (t): q f : h c : T : ) ( ),, ( ),,, ( t q z y x N t z y x T e T e ),, ( z y x N : e T q : (t) q e T ) ( ) ( ) ( ) ( 2 1 t T t T t T t q n e T
47 36 zx zx yz yz xy xy T yy xx zz zz T zz xx yy yy T zz yy xx xx G G G T E T E T E 1, 1, : : : E : : G 4.2 ABAQUS Moldflow ABAQUS Moldflow ABAQUS Moldflow ABAQUS ABAQUS Moldflow CAE
48 106C
49 4.2 ABAQUS Moldflow ABAQUS PA PA46 Elastic modulus 1st principal direction Elastic modulus 2nd principal direction 14753MPa 10586MPa Poisson s ratio ν Poisson s ratio ν Shear modulus 3320MPa Solid density g / cm Specific heat at J/kgC Conductivity at PA W/mC Moldflow ABAQUS Y 38
50 4.2.1 Moldflow (Y ) ABAQUS (Y ) 39
51 Moldflow (Z ) ABAQUS (Z ) 40
52 4.3 [28] [29] case FPC FPC FPC FPC FPC
53 Case1 Case2 Case3 Case
54 Case1: + : ( Y Z ) Case1 (Y ) Case1 (Y ) 43
55 4.3.4 Case1 (Z ) Case1 (Z ) 44
56 Case2: + : ( Y Z ) Case2 (Y ) Case2 (Y ) 45
57 4.3.8 Case2 (Z ) Case2 (Z ) 46
58 Case3: + : ( Y Z ) Case3 (Y ) Case3 (Y ) 47
59 Case3 (Z ) Case3 (Z ) 48
60 Case4: + : ( Y Z ) Case4 (Y ) Case4 (Y ) 49
61 Case4 (Z ) Case4 (Z ) 50
62 4.3.1 case1 case : (1) case3 case4 ) case1 case2 ( case3 case4 51
63 (2) case1 case case1 case2 case3 case case3 case4 (3) case1 case2 case3 case4 case3 case case3 case4 case3 case4 case1 case case1 case2 case1 case :case3 ; :case4 52
64 :case1 ; :case2 53
65 (Y ) (Y ) 54
66 4.4.3 (Y ) (Y ) 55
67 4.4.5 (Z ) (Z ) 56
68 4.4.7 (Z ) (Z ) 57
69 Y Z (1) (2) 58
70 A PA46[30] [31] 59
71 ( 5 ) 60
72 5.2.3 (Y ) (Y ) (Y ) 61
73 5.2.6 (Z ) (Z ) (Z )
74 5.3.1 ( ) ( ) 63
75 5.3.3 (230 ) ( ) 64
76 5.3.5 ( 92.6 ) ( ) ( ) 65
77 : ; : ; ( )
78 5.3.8 : ; : ; ( )
79 Moldflow ABAQUS Moldflow ABAQUS : (1)Moldflow ABAQUS ABAQUS (2) (3) 68
80 (4) ABAQUS Moldflow.. Moldflow [32]. 69
81 : [33] 70
82 [1] : [2] TFT-LCD [3] TFT-LCD [4] [5] [6] [7]Reinhard Edison Powell DEVELOPMENT OF CONVECTIVE SOLDER REFLOW AND PROJECTION MOIRÉ SYSTEM AND FEA MODEL FOR PWBA WARPAGE PREDICTION May 2006 [8] e [9]Faruk Sen, Metin Sayer ELASTO-PLASTIC THERMAL STRESS ANALYSIS IN A THERMOPLASTIC COMPOSITE DISC UNDER UNIFORM TEMPERATURE USING FEM Mathematical and Computational Applications, Vol. 11, No. 1, pp , 2006 [10] bname=0%2e5mm+pitch+w+rotary+actuator [11] IC [12] [13] 14 [14] MOLDFLOW MPI [15] [16] Moldflow [17] [18] ABAQUS
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