22 8 2010 8 PROGRESS IN CHEMISTRY Vol. 22 No. 8 Aug. 2010 * 430070 TB33 TM215. 92 A 1005-281X 2010 08-1619-07 Polymer-Based Composites with High Dielectric Constant and Low Dielectric Loss Lu Pengjian Wang Yilong Sun Zhigang Guan Jianguo State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of Technology Wuhan 430070 China Abstract Due to the wide important application of the polymer-based composites with both high dielectric constant and low dielectric loss in such fields as electrical and electronic engineering this paper reviews almost all the state-of-the-art research work focusing on them. In the attempt to establish the principles to design and prepare the polymer-based composites with high dielectric constant and low dielectric loss the effects of functional fillers polymer matrixes and their interaction on the dielectric properties of the polymer-based composites are discussed in details. As a consequence the future research trends are pointed out involving the development of the innovative approaches to prepare functional fillers with controlled structures morphologies and sizes advanced facile composite processes and techniques to adjust the interfaces and the theoretical models to correlate dielectric properties with the structure of the functional fillers etc. Key words dielectric constant dielectric loss composites polymers Contents 1 Introduction 2 The effect of the functional fillers on the dielectric properties of the polymer-based composites 2. 1 The types of the functional fillers 2. 2 The size and morphology of fillers 3 The effect of the polymer matrixes on the dielectric properties of the polymer-based composites 4 The effect of the interface between functional fillers and polymer matrixes on the dielectric properties of the polymer-based composites 5 The engineering applications of the polymer-based composites with high dielectric constant and low 2009 10 2009 12 * 863 No. 2006AA03Z461 No. A1420080185 Corresponding author e-mail guanjg@ whut. edu. cn
1620 22 dielectric loss 6 Conclusion 11 1 1 Ag 23% / / 12 ε 1 4 5 7 1 Ag-epoxy 12 Ag Fig. 1 Dielectric constant values of Ag / epoxy composites with different Ag filler loading at room temperature 12 Al Ag Ni / 2 12 15 Al Ag 1 7 2. 1 2. 1. 1 8-9 1 8 10 ε = ε 1 p c - p - β 1 p p c p < p c β - 1 Xu 13 Al
8 1621 Al 1 600 0. 7 Al Ag 80% 109 0. 02 Shen 16 17 Ag Ag @ C 2 2. 1. 2 > 300 < 0. 05 2 BT BST Lai 12 Ag / 40nm 22% 3 PVDF BT 22 MWNTs 19 2 BT Fig. 3 SEM photo of fractured surfaces of the TFP-MWNT / / BT PVDF inset is the TEM micrographs of the TFP- / BT MWNTs 19 BT BT Lu 20 BT 308 0. 05 BaTiO 3 - PMN- Dang 18 Yang 19 PT MWNTs PVDF 4 500 3 300 6 2 Fig. 2 16 Ag@ C Ag@ C core-shell structure 16 100 12 1 Kim 21 BaTiO 3 2 105 130nm 1μm 1μm BT Ag / / Ag 3. 7% 2 260 0. 45 3 / Cheng 23
1622 22 CaCu 3 Ti 4 O 12 CCTO 1kHz 1 000 Lu 28 20 000 / 10Hz 100Hz 3 000 0. 5 610 Bai 24 PMN-PT 2. 2-50% 200 excluded volume 6 V ex V ex f c BaTiO 3 2 29 f c = 1 - exp - B c V / V ex 2 6 25 V V ex B c 2. 1. 3 L / d = 100 0. 0055 Rao 30 / Zhang 1 26 2 000 Li 31 CuPc 10 5 P VDF-TrFE 225 427 10% Gelves 32 0. 4 1Hz CuPc Ang 33 Huang 27 1 Table 1 Composition and dielectric properties of high dielectric constant materials filler polymer matrix ε tanδ filler loading filler size ref Ag epoxy ~ 300 1kHz 0. 05 1kHz 22% 40nm 12 Ag@ C epoxy > 300 1kHz < 0. 05 1kHz 25% 30% 80 90nm 16 Al / Ag epoxy 160 10kHz 0. 45 10kHz 80% Al Ag < 20nm 39 40 Al@ Al 2 O 3 epoxy 109 10kHz 0. 02 10kHz 80% 3. 0μm 13 Ni PVDF 2 050 100Hz 10 100Hz 28% ~ 30nm 41 BaTiO 3 epoxy 40 1Hz 0. 035 1Hz 60% 100 200nm 42 Ag / BaTiO 3 epoxy 450 1kHz 0. 1 1kHz Ag 22% BaTiO 3 30% Ag 40nm 25 PANI epoxy 3 000 10kHz < 0. 5 10kHz 25% 28 Ag / carbon black epoxy 2260 0. 45 10kHz Ag 3. 7wt% CB 20wt% Ag 13nm 20 TFP-MWNT PVDF 4 500 1kHz 20 1kHz 15% 5 15μm 18
8 1623 < < 34 1 / Rao 44 Lu 40 15 20nm 3 5nm 35 1 4 Al Al / Ag-epoxy 50% 3 0. 1 Ag- 2 Bai 24 P VDF-TrFE P VDF-TrFE 2. 5 3 10 364 PS Fig. 4 TEM micrograph of Ag nanoparticles synthesized epoxy PVDF PET within epoxy resin via in-situ photochemical reduction PC PPS HTPP 2 6- PEN PI 37 38 4 - Li 43 HDPE LDPE 5 11 HDPE LDPE LDPE Al / epoxy 40 method 40
1624 22 5 Fig. 5 11 Schematic for filler / polymer materials consisting of filler particles interface and matrix 11 1 /5 50% 11 Lai 25 Ag 48 6 Nelson 45 TiO 2 Lewis 46 49 44 5 36 Shi 47
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