CAE ( Moldflow) FPC. TFT-LCD FPC Moldflow FPC

TFT-LCD FPC 98 6

CAE ( Moldflow) FPC FPC QA FPC Moldflow ABAQUS TFT-LCD FPC Moldflow FPC Moldflow ABAQUS Moldflow ABAQUS Moldflow ABAQUS

Abstract Due to the effects of uneven cooling rate, different material contraction and different fiber orientation, the connectors will warp after injection molding process. Therefore, the CAE software modeling injection molding (for example, Moldflow) is used to predict the warping behavior to ensure its value is confined to specifications requirement as designing the connectors. However, for FPC connectors, they are soldered on mother board by circle soldering process. As a result, the new thermal warping is induced by the residual stress, the anisotropic material property and fiber orientation on the injected connectors after they go through the circle soldering process. It is frequently occurred that the injected part can meet the specifications requirement but they cannot pass QA qualification due to the new thermal warping caused by circle soldering process. The thermal warping cannot be predicted by injection molding software along. It is proposed in the present analysis to combine the injection molding software Moldflow and the structural analysis software ABAQUS to study the thermal warping behavior for FPC connecters of TFT-LCD. First, the injection warping analysis is conducted by using Moldflow. As following, the thermal warping analysis is executed by using ABAQUS by inputting the residual stress, the anisotropic material property and fiber orientation etc. calculated by Moldflow as initial conditions through the Moldflow-ABAQUS interface module. Keywords: Warping, Connector, Moldflow, ABAQUS

( : NSC-96-2221-E-034-009)

... 1 1.1... 1 1.2 TFT-LCD... 2 1.3 FPC... 3 1.4... 4 1.5... 8 1.6... 8 Moldflow... 10 2.1 Moldflow CAE... 10 2.2... 13 2.3... 15 2.4... 16 ABAQUS... 23 3.1 ABAQUS CAE... 23 3.2 ABAQUS... 24 3.3 ABAQUS Moldflow... 28 3.4 ABAQUS Moldflow... 30 Moldflow ABAQUS... 34 4.1... 34 4.2... 36 4.2 ABAQUS Moldflow... 38 4.3... 41 4.4... 54

... 59 5.1... 59 5.2... 59 5.3... 62... 68

1.1.1 TFT-LCD ( )... 2 1.1.2 TFT-LCD ( )... 3 1.3.1... 4 1.4.1... 5 1.4.3... 6 1.4.5... 7 1.6.1... 9 2.2.1 106D... 13 2.2.2 106D... 14 2.3.1... 15 2.3.2 :(a) (b)... 16 2.3.3... 16 2.3.4... 16 2.4.1 Global size = 1mm... 17 2.4.2 Global size = 0.3mm... 17 2.4.3 Global size = 0.2mm... 17 2.4.4 Global size = 0.15mm... 17 2.4.5 Global size = 1mm... 18 2.4.6 Global size = 0.3mm... 18 2.4.7 Global size = 0.2mm... 19 2.4.8 Global size = 0.15mm... 19 2.4.9 Global size = 1mm (Y )... 20 2.4.10 Global size = 0.3mm (Y )... 20 2.4.11 Global size = 0.2mm (Y )... 20

2.4.12 Global size = 0.15mm (Y )... 20 3.2.1... 24 3.2.2... 24 3.2.3... 25 3.2.4... 25 3.2.5... 26 3.2.6... 26 3.2.7 ABAQUS... 27 3.2.8... 27 3.4.1 ABAQUS... 30 3.4.2 ABAQUS (Y )... 30 3.4.3 ABAQUS (Z )... 31 3.4.4 ABAQUS (Y )... 31 3.4.5 ABAQUS (Y )... 32 3.4.6 ABAQUS (Z )... 32 3.4.7 ABAQUS (Z )... 33 4.1.1... 37 4.1.2... 37 4.2.2 ABAQUS (Y )... 39 4.2.3 Moldflow (Z )... 40 4.3.1... 42 4.3.2 Case1 (Y )... 43 4.3.3 Case1 (Y )... 43 4.3.4 Case1 (Z )... 44 4.3.5 Case1 (Z )... 44 4.3.6 Case2 (Y )... 45

4.3.7 Case2 (Y )... 45 4.3.8 Case2 (Z )... 46 4.3.9 Case2 (Z )... 46 4.3.10 Case3 (Y )... 47 4.3.11 Case3 (Y )... 47 4.3.12 Case3 (Z )... 48 4.3.13 Case3 (Z )... 48 4.3.14 Case4 (Y )... 49 4.3.15 Case4 (Y )... 49 4.3.16 Case4 (Z )... 50 4.3.17 Case4 (Z )... 50 4.3.18 :case3 ; :case4... 52 4.3.19 :case1 ; :case2... 53 4.4.1 (Y )... 54 4.4.2 (Y )... 54 4.4.3 (Y )... 55 4.4.4 (Y )... 55 4.4.5 (Z )... 56 4.4.6 (Z )... 56 4.4.7 (Z )... 57 4.4.8 (Z )... 57 5.2.1... 60 5.2.2... 60 5.2.3 (Y )... 61 5.2.4 (Y )... 61 5.2.5 (Y )... 61

5.2.6 (Z )... 62 5.2.7 (Z )... 62 5.2.8 (Z )... 62 5.3.1 ( )... 63 5.3.2 ( )... 63 5.3.3 (230 )... 64 5.3.4 ( )... 64 5.3.5 ( 92.6 )... 65 5.3.6 ( )... 65 5.3.7 : ; : ; ( )... 66 5.3.8 : ; : ; ( )... 67

2.4.1.22 4.2.1 PA46.....38 4.3.1...51 4.4.1 case2. 58

1.1 PC DisplaySearch 99% 15% 2006 1080 24% LCD TV FPC (FPC) TFT-LCD DisplaySearch 2009 TFT-LCD 1 990 2014 2 4,090 2009 2 TFT-LCD DisplaySearch 4% 2011 7%[1] FPC JAE Hirose 10% 30% FPC PC FPC FPC FPC FPC FPC 1

[2]~[4] 1.2 TFT-LCD TFT-LCD thin-film transistor liquid-crystal display.( ) TFT-LCD 1960 1991 TFT-LCD TFT-LCD TFT-LCD LCD TFT (TFT) TFT-Array 1.1.1 TFT-LCD 1.1.2 TFT-LCD [5] 1.1.1 TFT-LCD ( ) 2

1.1.2 TFT-LCD ( ) 1.3 FPC TFT-LCD FPC FPC :(1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (1) 3

1.3.1 1.4 PCB (SURFACE MOUNT TECHNOLOGY) SMT (PCB) SMT 1.SMT PCB SMT 1.4.1 4

1.4.1 ( ) 2. SMT 3. 1.4.2 PCB 1.4.2 5

(1) Ramp-up : 110-120 : (2) Soak or Preheat : 150-170 PCB (3) Spike or Peak : 3 /sec 235-245 20 (4) (Cooling): ( 1.4.3) (3-5 /sec) 1.4.3 6

1.4.4 1.4.4 1 2 3 4 4.5mm/s 7 25 [6]~[9] 1.4.5 PCB 1.4.5 7

1.5 Moldflow 1.6 TFT-LCD Moldflow Moldflow ABAQUS ABAQUS ABAQUS Moldflow ABAQUS ABAQUS 1.6.1 8

Moldflow ( ) Moldflow ABAQUS Interface for Moldflow ABAQUS Moldflow ABAQUS ( ) Moldflow ABAQUS ABAQUS ( ) 1.6.1 9

Moldflow 2.1 Moldflow CAE Moldflow CAE 1976 CAE Moldflow CAE Moldflow CAE Moldflow Moldflow CAE : (1)?? (2)? 10

CAE (1) (2) CAE (3) Moldflow (4) (5) CAE Moldflow CAE (1) 11

(2) (3) (4) 12

2.2 2.2.1 2.2.1 106D 106D 2.2.2 Moldflow [10] 13

2.2.2 106D 14

2.3 : 2.3.1-2.3.4 [11]~[12] 2.3.1 15

2.3.2 :(a) (b) 2.3.3 2.3.4 2.4 [13]~[16] 2.4.1-2.4.4 16

2.4.1 Global size = 1mm 2.4.2 Global size = 0.3mm 2.4.3 Global size = 0.2mm 2.4.4 Global size = 0.15mm 106D 2.4.5-2.4.8 17

2.4.5 Global size = 1mm 2.4.6 Global size = 0.3mm 18

2.4.7 Global size = 0.2mm 2.4.8 Global size = 0.15mm 19

Y 2.4.9-2.4.12 2.4.9 Global size = 1mm (Y ) 2.4.10 Global size = 0.3mm (Y ) 2.4.11 Global size = 0.2mm (Y ) 2.4.12 Global size = 0.15mm (Y ) 20

Z 2.4.13-2.4.16 2.4.13 Global size = 1mm (Z ) 2.4.14 Global size = 0.3mm (Z ) 2.4.15 Global size = 0.2mm (Z ) 2.4.16 Global size = 0.15mm (Z ) 0.15mm 21

2.4.1 (1 =0.01mm) 2.4.1 22

ABAQUS 3.1 ABAQUS CAE Abaqus IC Abaqus 23

Abaqus Abaqus Abaqus [17] 3.2 ABAQUS ABAQUS 3.2.1 3.2.2 3.2.1 3.2.2 3.2.3-3.2.6 24

3.2.3 3.2.4 25

3.2.5 3.2.6 26

3.2.7 ABAQUS 3.2.7 ABAQUS [18]~[21] 3.2.8 3.2.8 27

3.3 ABAQUS Moldflow FPC Moldflow ABAQUS Moldflow ABAQUS TFT-LCD FPC Moldflow FPC Moldflow ABAQUS Moldflow [22] ABAQUS ABAQUS Moldflow ABAQUS Moldflow 1 ( )_mesh.inp: 2 ( )_e11.xml: 1 3 ( )_e22.xml: 2 4 ( )_e33.xml: 3 5 ( )_g12.xml: 1-2 6 ( )_g13.xml: 1-3 7 ( )_g23.xml: 2-3 8 ( )_v12.xml: 1-2 9 ( )_v13.xml: 1-3 10 ( )_v23.xml: 2-3 11 ( )_ltec_1.xml: 1 12 ( )_ltec_2.xml: 2 13 ( )_ltec_3.xml: 3 28

14 ( )_initstress.xml: 15 ( )_principaldirections.xml: 15 ABAQUS : ( ).inp ABAQUS input file ( ).mpt ( ).opt ( ).tpt ( ).rpt ABAQUS S11, S22, S33, S12, S13, S23 S11, S22, S33 S12, S13, S23 : 1, 142901671.140377, 146852557.579042, 136190819.114901, -651254.776895178, 4103631.10778482, 763652.492038431 1 142901671.140377Pa, 146852557.579042Pa, 136190819.114901Pa -651254.776895178P, 4103631.10778482Pa, 763652.492038431Pa 29

3.4 ABAQUS Moldflow 3.4.1-3.4.3 ABAQUS Moldflow 3.4.1 ABAQUS 3.4.2 ABAQUS (Y ) 30

3.4.3 ABAQUS (Z ) ABAQUS 3.4.4 ABAQUS (Y ) 31

3.4.5 ABAQUS (Y ) 3.4.6 ABAQUS (Z ) 32

3.4.7 ABAQUS (Z ) ABAQUS Moldflow Moldflow 33

34 Moldflow ABAQUS 4.1 [23]~[27] : Fourier T(x,y,z,t) : t T c Q z T k z y T k y x T k x T z y x : : T c : k

35 : Q (1) ) ( ),,, ( t T t z y x T (2) (t) q n z T k n y T k n x T k f z z y y x x (3) ( T) T h n z T k n y T k n x T k c z z y y x x :,, z y x n n n (t): T (t): q f : h c : T : ) ( ),, ( ),,, ( t q z y x N t z y x T e T e ),, ( z y x N : e T q : (t) q e T ) ( ) ( ) ( ) ( 2 1 t T t T t T t q n e T

36 zx zx yz yz xy xy T yy xx zz zz T zz xx yy yy T zz yy xx xx G G G T E T E T E 1, 1, 1 1 1 1 : : : E : : G 4.2 ABAQUS Moldflow ABAQUS Moldflow ABAQUS Moldflow ABAQUS 50 50 50 ABAQUS Moldflow CAE

106C 4.1.1 4.1.1 4.1.2 4.1.2 37

4.2 ABAQUS Moldflow ABAQUS PA46 4.2.1 PA46 Elastic modulus 1st principal direction Elastic modulus 2nd principal direction 14753MPa 10586MPa Poisson s ratio ν12 0.384 Poisson s ratio ν23 0.435 Shear modulus 3320MPa Solid density 3 1.852g / cm Specific heat at 51 932.5J/kgC Conductivity at 30 4.2.1 PA46 0.309W/mC 4.2.1-4.2.2 Moldflow ABAQUS Y 38

4.2.1 Moldflow (Y ) 4.2.2 ABAQUS (Y ) 39

4.2.3-4.2.4 4.2.3 Moldflow (Z ) 4.2.4 ABAQUS (Z ) 40

4.3 [28] [29] case 4.3.1 FPC FPC FPC 1.4.5 FPC FPC 240 41

+ + + + Case1 Case2 Case3 Case4 4.3.1 42

Case1: + : 4.3.2-4.3. ( Y Z ) 4.3.2 Case1 (Y ) 4.3.3 Case1 (Y ) 43

4.3.4 Case1 (Z ) 4.3.5 Case1 (Z ) 44

Case2: + : 4.3.6-4.3.9 ( Y Z ) 4.3.6 Case2 (Y ) 4.3.7 Case2 (Y ) 45

4.3.8 Case2 (Z ) 4.3.9 Case2 (Z ) 46

4.3.12 Case3 (Z ) 4.3.13 Case3 (Z ) 48

4.3.16 Case4 (Z ) 4.3.17 Case4 (Z ) 50

4.3.1 case1 case4 4.3.1 : (1) case3 case4 ) case1 case2 ( case3 case4 51

(2) case1 case2 4.3.1 case1 case2 case3 case4 4.3.1 case3 case4 (3) case1 case2 case3 case4 case3 case4 4.3.18 case3 case4 case3 case4 case1 case2 4.3.19 case1 case2 case1 case2 4.3.18 :case3 ; :case4 52

4.3.19 :case1 ; :case2 53

4.4 4.3.1 4.4.1-4.4.8 4.4.1 (Y ) 4.4.2 (Y ) 54

4.4.3 (Y ) 4.4.4 (Y ) 55

4.4.5 (Z ) 4.4.6 (Z ) 56

4.4.7 (Z ) 4.4.8 (Z ) 57

4.3.1 4.4.1 4.4.1 4.4.2 4.4.5 4.4.6 4.4.3 4.4.4 4.4.7 4.4.8 Y Z 4.4.1 (1) (2) 58

5.1 112A PA46[30] 5.2 5.2.1 [31] 59

5.2.1 5.2.2 5.2.2 5.2.3-5.2.8 ( 5 ) 60

5.2.3 (Y ) 5.2.4 (Y ) 5.2.5 (Y ) 61

5.2.6 (Z ) 5.2.7 (Z ) 5.2.8 (Z ) 5.3 5 5.3.1-5.3.6 62

5.3.1 ( ) 5.3.2 ( ) 63

5.3.3 (230 ) 5.3.4 ( ) 64

5.3.5 ( 92.6 ) 5.3.6 ( ) ( ) 65

5.3.7-5.3.8 5.3.7 : ; : ; ( ) 5.3.7 66

5.3.8 : ; : ; ( ) 5.3.8 67

Moldflow ABAQUS Moldflow ABAQUS : (1)Moldflow ABAQUS ABAQUS (2) (3) 68

(4) ABAQUS Moldflow.. Moldflow [32]. 69

: [33] 70

[1] : http://www.eettaiwan.com/art_8800570295_480702_nt_0832791b.htm [2] TFT-LCD 2005 9 [3] TFT-LCD 2005 7 [4] http://www.cmo.com.tw/ [5] http://www.auo.com/auodev/technology.php?sec=tftintro&ls=tc [6] 2007 8 [7]Reinhard Edison Powell DEVELOPMENT OF CONVECTIVE SOLDER REFLOW AND PROJECTION MOIRÉ SYSTEM AND FEA MODEL FOR PWBA WARPAGE PREDICTION May 2006 [8] e 2001 11 [9]Faruk Sen, Metin Sayer ELASTO-PLASTIC THERMAL STRESS ANALYSIS IN A THERMOPLASTIC COMPOSITE DISC UNDER UNIFORM TEMPERATURE USING FEM Mathematical and Computational Applications, Vol. 11, No. 1, pp. 31-39, 2006 [10] http://www.starconn.com/big5/catlists.asp?midid=m02-4&subid=m02-4-1&su bname=0%2e5mm+pitch+w+rotary+actuator [11] IC 2004 7 [12] 4 56 2005 4 [13] 14 [14] MOLDFLOW MPI 2005 6 [15] 2005 9 [16] Moldflow 2005 5 [17] http://www.simutech.com.tw/html/front/bin/home.phtml [18] ABAQUS 2007 4 71

[19] ABAQUS6.6 2007 5 [20] ABAQUS 2009 1 [21] TFT-LCD 28 2004 [22]Abaqus Interface for Moldflow User's Manual [23] 2006 6 [24] 2001 6 [25] PBGA IR-redlow 2001 7 [26] IR-reflow 2000 7 [27]Wei Tan DEVELOPMENT OF CONVECTIVE REFLOW-PROJECTION MOIRÉ WARPAGE MEASUREMENT SYSTEM AND PREDICTION OF SOLDER BUMP RELIABILITY ON BOARD ASSEMBLIES AFFECTED BY WARPAGE April 2008 [28] 2009 1 [29]Chih-Hung Chen, Fu-Ming Lin, Hsuan-Teh Hu1, Fang-Yao Yeh RESIDUAL STRESS AND BOW ANALYSIS FOR SILICON SOLAR CELL INDUCED BY SOLDERING December 2008 [30] 2007 9 [31]G. Sánchez Sarmiento, M.J. Mizdrahi, P. Bastias, M. Pizzi Heat Transfer, Thermal-Stress and Pipe-whip Analysis in Steel Pipes of a Nuclear Power Plants by ABAQUS/Standard 2004 ABAQUS Users Conference 2004 [32] 2002 4 [33]Fox, McDonald, Pritchard, Introduction to FLUID MECHANICS 2004 72