Data Sheet. HSMW-Cxxx White ChipLEDs HSMW-C191, HSMW-130, HSMW-265, HSMW-197, HSMW-120. Description. Features. Applications
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1 HSMW-Cxxx White ChipLEDs Data Sheet HSMW-C191, HSMW-13, HSMW-265, HSMW-197, HSMW-12 Description These white ChipLEDs come in unique shades of white and provide product differentiation for backlighting application. They are designed in industry standard package for ease of handling and use. These chipleds come in either top emitting packages (HSMW-C191, 13, 265, & 197) or in a side emitting package (HSMW-C12). The packages all compatible with IR reflow soldering process and come in 8 mm tape on 7" diameter reel. They are compatible with automatic placement equipment. In order to facilitate pick and place operation, these chipleds are shipped in tape and reel with 4 units per reel for HSMW-C191, 13, 197, and 12 packages, and 3 units per reel for HSMW-C265 package. Features White color Small size Industry standard footprint Compatible with reflow soldering Compatible with automatic placement equipment Operating temperature range 3 C to +85 C Come in 8 mm tape on 7" diameter reels Applications LCD backlighting Keypad backlighting Pushbutton backlighting Symbol backlighting CAUTION: HSMW-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.1. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
2 Package Dimensions LED DIE CATHODE MARK LED DIE CATHODE MARK.8 (.31) 1.6 (.63 ).4 (.16) 3.4 (.134 ) 1.25 (.49).3 (.12) 1. (.39) POLARITY DIFFUSED EPOXY 1.2 (.47) POLARITY DIFFUSED EPOXY PC BOARD CATHODE LINE.3 ±.15 (.12 ±.6).6 (.23).3 (.12).3 ±.15 (.12 ±.6) 1.1 (.43) PC BOARD CATHODE LINE.5 ±.15 (.2 ±.6).3 (.12) 1.1 (.43).5 ±.15 (.2 ±.6).7 (.28) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMW-C191 HSMW-C265 LED DIE LED DIE.3 (.12).6 (.24).8 (.31) 1.6 (.63 ).4 (.16) 1.6 (.63) POLARITY DIFFUSED EPOXY PC BOARD.16 (.6) POLARITY DIFFUSED EPOXY PC BOARD 1.2 (.47) 1. (.39).4 (.16).5 (.2) CATHODE LINE.3 ±.15 (.12 ±.6) CATHODE LINE 3.3 (.12).7 (.28) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMW-C197 HSMW-C12 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ±.1 mm UNLESS OTHERWISE NOTED. 2
3 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Package Dimensions, continued LED Die Cathode Mark ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ;.8.31 (.8) Polarity DIFFUSED EPOXY PCB BOARD.12.5 Cathode Line.3`.15.12`.6.3`.15.12`.6 ; ; ; ; ; ; ; ; ; ; Soldering Terminal.7 MIN..28 HSMW-C13 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ±.1 mm UNLESS OTHERWISE NOTED. 3
4 Device Selection Guide Package Dimension (mm) White Package Description 1.6 (L) x.8 (W) x.6 (H) HSMW-C191 Untinted, Diffused 1.6 (L) x.8 (W) x.35 (H) HSMW-C13 Untinted, Diffused 3.4 (L) x 1.25 (W) x 1.1 (H) [2] HSMW-C265 Untinted, Diffused 1.6 (L) x.8 (W) x.4 (H) HSMW-C197 Untinted, Diffused 1.6 (L) x.6 (W) x 1. (H) HSMW-C12 Untinted, Diffused Notes: 1. Right angle package. 2. Reverse mount package. Absolute Maximum Ratings at T A = 25 C Parameter HSMW-Cxxx Units DC Forward Current [1] 2 ma Power Dissipation 78 mw Reverse Voltage (I R = µa) 5 V LED Junction Temperature 95 C Operating Temperature Range 3 to +85 C Storage Temperature Range 4 to +85 C Soldering Temperature 11) Note: 1. Derate linearly as shown in Figure 4. See reflow soldering profile (Figures & Electrical Characteristics at T A = 25 C Reverse Forward Voltage Breakdown Capacitance C Thermal V F (Volts) V R (Volts) (pf), V F =, I F = 2 ma I R = µa f = 1 MHz Rθ J-PIN ( C/W) Part Number Typ. Max. Min. Typ. Typ. HSMW-Cxxx Note: 1. V F tolerance: ±.1 V. 4
5 Optical Characteristics at T A = 25 C Luminous Intensity Chromaticity Luminous I v (mcd) Coordinates [2] Viewing Angle 2 ma [1, 4] Typ. 2 θ 1/2 Degrees [3] η v (lm/w) Part Number Min. Typ. x y Typ. Typ. HSMW-C HSMW-C HSMW-C HSMW-C HSMW-C Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λ d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. Luminous intensity (I v ) tolerance: ± 15%. Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Bin ID Min. Max. A B C D E F G H J K L M N P Q R S T U V W X Y Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 5
6 Y-COORDINATE SMT WHITE COLOR BIN STRUCTURES D C1 D B1 C A1 A2.26 B X-COORDINATE I F FORWARD CURRENT ma 1 LUMINOUS INTENSITY (NORMALIZED AT 2 ma) V F FORWARD VOLTAGE V I F FORWARD CURRENT ma Figure 1. Color bin limits (CIE 1931 Chromaticity Diagram) [Tolerance: ±.2]. Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current. I F MAX. MAXIMUM FORWARD CURRENT ma T A AMBIENT TEMPERATURE C RELATIVE INTENSITY % ANGLE Figure 4. Maximum forward current vs. ambient temperature. Figure 5. Relative intensity vs. angle for HSMW-C191. RELATIVE INTENSITY % ANGLE Figure 6. Relative intensity vs. angle for HSMW-C13. 6
7 RELATIVE INTENSITY % ANGLE Figure 7. Relative intensity vs. angle for HSMW-C265. RELATIVE INTENSITY % ANGLE Figure 8. Relative intensity vs. angle for HSMW-C197. 7
8 RELATIVE INTENSITY ANGLE RELATIVE INTENSITY ANGLE Figure 9. Relative intensity vs. angle for HSMW-C12. 8
9 - 3 SEC. TEMPERATURE C SEC. MAX. 23 C MAX. 4 C/SEC. MAX. OVER 2 MIN. 4 C/SEC. MAX. 3 C/SEC. TEMPERATURE 217 C 2 C 15 C C 3 C/SEC. MAX. 3 C/SEC. MAX SEC. 6 C/SEC. MAX. SEC. MAX. TIME TIME (Acc. to J-STD-2C) Figure. Recommended reflow soldering profile. Figure 11. Recommended Pb-free reflow soldering profile..8 (.31) 2.2 (.87) DIA. PCB HOLE.8 (.31).7 (.28).8 (.31) 1.4 (.55) 2.3 (.91) 1.4 (.55) 1.25 (.49) Figure 12. Recommended soldering pattern for HSMW-C191, HSMW-C13, and HSMW-C197. Figure 13. Recommended soldering pad pattern for HSMW-C (.16).4 (.16).7 (.28).15 (.6).8 (.31) 1.2 (.47).8 (.31) CENTERING BOARD Figure 14. Recommended soldering pad pattern for HSMW-C12. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 9
10 USER FEED DIRECTION xxxxx xxxxx xxxxx xxxxx xxxxx CATHODE SIDE PRINTED LABEL Figure 15. Reeling orientation. 8. ± 1. (.315 ±.39) 3. ±.5 (.118 ±.2) ;.5 ± 1. (.413 ±.39) Ø 13.1 ±.5 (Ø.516 ±.2) Ø 2.2 MIN. (Ø.795 MIN.) ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) ; Figure 16. Reel dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
11 DIM. A DIM. B 8. ; 2. ±.5 (.79 ±.2) 4. (.157) 4. (.157) ; HSMW-C12 POSITION IN CARRIER TAPE ; DIM. A 1.5 (.59) PART NUMBER CATHODE USER FEED DIRECTION ; ; 1.75 (.69) 3.5 ±.5 (.138 ±.2) DIM. C ±.3 (.315 ±.12) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±. (±.4) DIM. B ±. (±.4) COVER TAPE.2 ±.5 (.8 ±.2) CARRIER TAPE DIM. C ±. (±.4) HSMW-C191 SERIES 1.85 (.73).88 (.35).88 (.35) HSMW-C197 SERIES 1.75 (.69).95 (.37).6 (.24) HSMW-C12 SERIES 1.9 (.75) 1.15 (.45).8 (.31) HSMW-C13 SERIES 1.75 (.69).88 (.35).5 (.2) [.23 ±.5(.9 ±.2) for HSMW-C13] DIM. B HSMW-C12 R.5 ±.5 (.2 ±.2) DIM. A ; DIM. B 2. ±.5 (.79 ±.2) 4. (.157) 4. (.157) 1.5 (.59) PART NUMBER CATHODE USER FEED DIRECTION.2 ± (.69) DIM. C 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±. (.4) DIM. B ±. (.4) COVER TAPE DIM. C ±. (.4) HSMx-C265 SERIES 3.7 (.146) 1.45 (.57) 1.3 (.51) (.8 ±.2) CARRIER TAPE Figure 17. Tape dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 11
![75 (.69).95 (.37).6 (.24) HSMW-C12 SERIES 1.9 (.75) 1.15 (.45).8 (.31) HSMW-C13 SERIES 1.75 (.69).88 (.35).5 (.2) [.23 ±.5(.9 ±.2) for HSMW-C13] DIM. B HSMW-C12 R.5 ±.5 (.2 ±.2) DIM. A ; DIM. B 2. ±.5 (.79 ±.](/docs-images/49/21113906/images/page_11.jpg "2) 4. (.157) 4. (.157) 1.5 (.59) PART NUMBER CATHODE USER FEED DIRECTION.2 ±.5 1.75 (.69) DIM. C 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±. (.4) DIM.")
12 END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 6, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS Figure 18. Tape leader and trailer dimensions. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 3 6% RH max. Baking is required under the condition: 1. Humidity Indicator Card is > % when read at 23± 5 C. 2. Device expose to factory conditions < 3 C/6% RH more than 672 hours. Baking recommended condition: 6 ± 5 C for 2 hours. For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright 26 Avago Technologies Limited. All rights reserved. Obsoletes EN AV1-685EN December, 26
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MAX4147ESD PART 14 SO TOP VIEW. Maxim Integrated Products 1 MAX4147 EVALUATION KIT AVAILABLE ; Rev 1; 11/96 V CC V EE OUT+ IN+ R t SENSE IN-
-; Rev ; / EVALUATION KIT AVAILABLE µ µ PART ESD TEMP. RANGE - C to +5 C PPACKAGE SO TOP VIEW V EE V CC SENSE+ SENSE- R t R t R t R t MAX SENSE OUT SENSE+ SENSE- N.C. SHDN N.C. 3 5 R f R G R f 3 VDSL TRANSFORMER
ISM 868 MHz Ceramic Antenna Ground cleared under antenna, clearance area mm x 8.25 mm. Pulse Part Number: W3013
W0 Datasheet version.. Ceramic Antenna. (0/08). Ceramic Antenna Ground cleared under antenna, clearance area 0.80 mm x 8.5 mm. Pulse Part Number: W0 Features - Omni directional radiation - Low profile
DC-DC Constant Current Step-Down LED driver LDD-300L LDD-350L LDD-500L LDD-600L LDD-700L CURRENT RANGE
SPECIFICATION ORDER NO. LDD-00L LDD-0L LDD-00L LDD-00L LDD-700L CURRENT RANGE 00mA 0mA 00mA VOLTAGE RANGE Note. ~ VDC for LDD-00~700L/LW ; ~ 8VDC for LDD-00~700LS CURRENT ACCURACY (Typ.) ±% at VDC input
B37631 K K 0 60
Multilayer Ceramic acitors High; X5R and X7R Chip Ordering code system B37631 K 7 5 K 6 Packaging 6 ^ cardboard tape, 18-mm reel 62 ^ blister tape, 18-mm reel Internal coding acitance tolerance K ^ ± %
RSDW08 & RDDW08 series
/,, MODEL SELECTION TABLE INPUT ORDER NO. INPUT VOLTAGE (RANGE) NO LOAD INPUT CURRENT FULL LOAD VOLTAGE CURRENT EFFICIENCY (Typ.) CAPACITOR LOAD (MAX.) RSDW08F-03 344mA 3.3V 2000mA 80% 2000μF RSDW08F-05
SMD Transient Voltage Suppressors
SMD Transient Suppressors Feature Full range from 0 to 22 series. form 4 to 60V RMS ; 5.5 to 85Vdc High surge current ability Bidirectional clamping, high energy Fast response time
CL-SB SLIDE SWITCHES CL - SB B T FEATURES PART NUMBER DESIGNATION. RoHS compliant
CL-SB RoHS ompliant INTERNAL STRUCTURE 1 6 4 5 Part name Material Flammability FEATURES Cover Stainless steel (SUS 4) Slider Housing Moving ontat Fixed ontat pin Polyamido Polyphenylenesulphide Copper
Applications. 100GΩ or 1000MΩ μf whichever is less. Rated Voltage Rated Voltage Rated Voltage
Features Rated Voltage: 100 VAC, 4000VDC Chip Size:,,,,, 2220, 2225 Electrical Dielectric Code EIA IEC COG 1BCG Applications Modems LAN / WAN Interface Industrial Controls Power Supply Back-Lighting Inverter
RoHS ASPI. Test Condition. DCR IDC Marking
-3D, 4D, 5D, 6D FEATURES: Magnetic shielded for low radiation Low profile, compact size Large Terminal surface for good PCB bonding Low DCR, High Energy storage, suitable for large currents Ideal for a
PRELIMINARY DATA SHEET NPN EPITAXIAL SILICON TRANSISTOR FOR MICROWAVE HIGH-GAIN AMPLIFICATION
PRELIMINARY DATA SHEET NPN EPITAXIAL SILICON TRANSISTOR FOR MICROWAVE HIGH-GAIN AMPLIFICATION NE699M FEATURES OUTLINE DIMENSIONS (Units in mm) HIGH ft: 6 GHz TYP at V, ma LOW NOISE FIGURE: NF =. db TYP
Power Inductor LVS Series
RoHS Compliant Halogen Free REACH Compliant Part Numbering LVS 6645 L - 1R M - AU Series Name Dimensions Code Inductance Internal Code (mm) (uh) Tolerance 4412 4.x4.x1.2 L Low DCR R47.47 M ±% 4418 4.x4.x1.8
Bulletin 1489 UL489 Circuit Breakers
Bulletin 489 UL489 Circuit Breakers Tech Data 489-A Standard AC Circuit Breaker 489-D DC Circuit Breaker 489-A, AC Circuit Breakers 489-D, DC Circuit Breakers Bulletin 489-A Industrial Circuit Breaker
ISM 900 MHz Ceramic Antenna Ground cleared under antenna, clearance area mm x 8.25 mm. Pulse Part Number: W3012
W0 Datasheet version.. Ceramic Antenna. (0/08). Ceramic Antenna Ground cleared under antenna, clearance area 0.80 mm x 8.5 mm. Pulse Part Number: W0 Features - Omni directional radiation - Low profile
NTC Thermistor:TTC3 Series
Features. RoHS compliant 2. Halogen-Free(HF) series are available 3. Body size: Ф3mm 4. Radial lead resin coated 5. Operating temperature range: -40 ~+25 6. Wide resistance range 7. Cost effective 8. Agency
Anti-Corrosive Thin Film Precision Chip Resistor-SMDR Series. official distributor of
Product : Anti-Corrosive Thin Film Precision Chip Resistor-SMDR Series Size : 0402/0603/0805/1206/2010/2512 official distributor of Anti-Corrosive Thin Film Precision Chip Resistor (SMDR Series) 1. Features
THICK FILM LEAD FREE CHIP RESISTORS
Features Suitable for lead free soldering. Compatible with flow and reflow soldering Applications Consumer Electronics Automotive industry Computer Measurement instrument Electronic watch and camera Configuration
CL-SB SLIDE SWITCHES CL - SB B T FEATURES PART NUMBER DESIGNATION. RoHS compliant
CL-SB RoHS ompliant INTERNAL STRUCTURE 1 6 4 FEATURES Part name Cover Slider Housing Moving ontat Fixed ontat pin 5 Material Flammability Stainless steel (SUS 4) UL94V- Polyamido PPS UL94V- Polyphenylenesulphide
WLCW1005 SMD Wire Wound Ceramic Chip Inductors
WCW1005 SMD Wire Wound Ceramic Chip Inductors *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_WCW1005 Series_V5.0 Mar. 2016 Features 1. Standard chip size bobbin with
Summary of Specifications
Snap Mount Large High CV High Ripple 85 C Temperature The series capacitors are the standard 85 C, large capacitance, snap-in capacitors from United Chemi-Con. The load life for the series is 2,000 hours
Sunlord. Wire Wound SMD Power Inductors SWCS Series SWCS XXXX -XXX T. Operating Temperature: -25 ~ +105 FEATURES APPLICATIONS PRODUCT IDENTIFICATION
Wire Wound SMD Power Inductors SWCS Series Operating Temperature: -25 ~ +105 FEATURES Various high power inductors are superior to be high saturation Suitable for surface mounting equipment APPLICATIONS
NPIS Shielded Power Inductors
FEATURES SHIELDED POWER INDUCTOR ULTRA LOW PROFILE (1.0 ~ 4.5mm MAX. HEIGHT) SURFACE MOUNTABLE CONSTRUCTION INDUCTANCE VALUES UP TO 220µH TAPED AND REELED FOR AUTOMATIC INSERTION CHARACTERISTICS Case Size
DC-DC Constant Current Step-Down LED driver LDD-300L LDD-350L LDD-500L LDD-600L LDD-700L CURRENT RANGE
SPECIFICATION ORDER NO. LDD-00L LDD-0L LDD-00L LDD-00L LDD-700L CURRENT RANGE 00mA 0mA 00mA 00mA VOLTAGE RANGE Note. ~ VDC for LDD-00~700L/LW ; ~ 8VDC for LDD-00~700LS CURRENT ACCURACY (Typ.) ±% at VDC
Configurations: Dimension (mm) B (max) A (max) 0.20 IWCCG1005. Inductance Range IWCCG ~ IWCCG ~ 1000 IWCCG
Configurations: FEATURES High frequency. Highest possible SRFs as well as excellent Q values. The wire is wound directed on the core at a precision pitch. RoHS Compliant. APPLICATION Pagers, Cordless phones
GenX3 TM 300V IGBT IXGA42N30C3 IXGH42N30C3 IXGP42N30C3 V CES = 300V I C110. = 42A V CE(sat) 1.85V t fi typ. = 65ns
GenX3 TM V IGBT High Speed PT IGBTs for -1kHz switching IXGA42NC3 IXGH42NC3 IXGP42NC3 V CES = V 1 = 42A V CE(sat) 5V t fi typ = 65ns TO-263 (IXGA) Symbol Test Conditions Maximum Ratings V CES = 25 C to
AT Low Current, High Performance NPN Silicon Bipolar Transistor
AT-3263 Low Current, High Performance NPN Silicon Bipolar Transistor Data Sheet Description The AT-3263 contains two high performance NPN bipolar transistors in a single SOT-363 package. The devices are
IWCSeries FEATURES APPLICATION ORDERING CODE TRIGON COMPONENTS. Configurations: Dimension (mm) IWC C G 1608 K 22N T (1) (2) (3) (4) (5) (6) (7)
Configurations: FEATURES High frequency. Highest possible SRFs as well as excellent Q values. The wire is wound directed on the core at a precision pitch. RoHS Compliant. APPLICATION Pagers, Cordless phones
STANDARD LED LAMPS (ROUND TYPES)
Package 3 3 3 1.0 Lead High 3.4 Part No. Chip Material/Emitted Color Wave Length p Lens Appearance Absolute Maximum Ratings Pd (mw) If Electro-optical Data (At ma) Vf (V) Iv (mcd) Typ Max Typ. BL-B4541
Metal thin film chip resistor networks
Metal thin film chip resistor networks AEC-Q200 Compliant Features Relative resistance and relative TCR definable among multiple resistors within package. Relative resistance : ±%, relative TCR: ±1ppm/
VAR Series Zinc Oxide Varistor
FEATURES Round Zinc Oxide, leaded Coating: epoxy resin, flame-retardant material Operating Temperature Range: -40 ~+105 Wide operating voltage Approvals: CQ C, UL, VDE RoHS 201165EU; REACH Compliant High
YAGEO CORPORATION SMD INDUCTOR / BEADS. CLH Series. Lead-free / For High Frequency Applications. CLH1005-H series CLH1608-H series ~1.4 0.
YAGEO CORPORATION SMD INDUCTOR / BEADS CLH Series Multilayer Chip Inductors High Frequency Lead-free / For High Frequency Applications APPLICATIONS RF Resonance and Impedance Matching Circuit RF and Wireless
XKT. Metal Oxide Varistor FEATURES
FEATURES Operating Temperature Range: -40 ~+105 Body Diameters Range From 5D to 20D Wide Operating from 18V to 1800V Full compliance with RoSH and REH DIMENSION L:16mm min SIZE D MAX H MAX d+-0.05 E c
NTC Thermistor:SCK Series
Features. RoHS & HF compliant 2. Body size: Ф5mm ~ Ф 30mm 3. Radial lead resin coated 4. High power rating 5. Wide resistance range 6. Cost effective 7. Operating temperature range: Φ5mm:-40~+50 Φ8~Φ0mm:-40~+70
C121. External Dimensions (L W) (mm) 0603 [0201] [0402] [0603] [0805]
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Multilayer Chip SDV Series Operating Temp. : -55 ~+125 FEATURES SMD type suitable for high density mounting Excellent clamping ratio and quick response time (
Multilayer Chip Capacitors C0G/NP0/CH
Multilayer Chip Capacitors C0G/NP0/CH Features Good thermal stability High insulation resistance Low dissipation factor Low inductance Applications Resonant circuits Filter circuits Timing elements Coupling
High Frequency Chip Inductor / CF TYPE
High Frequency Chip Inductor / CF TYPE.Features: 1.Closed magnetic circuit avoids crosstalk. 2.S.M.T. type. 3.Excellent solderability and heat resistance. 4.High realiability. 5.The products contain no
Unshielded Power Inductor / PI Series
.Features: 1. Excellent solderability and high heat resistance. 2. Excellent terminal strength construction. 3. Packed in embossed carrier tape and can be used by automatic mounting machine..applications:
1.575 GHz GPS Ceramic Chip Antenna Ground cleared under antenna, clearance area 4.00 x 4.25 mm / 6.25 mm. Pulse Part Number: W3011 / W3011A
W0 Datasheet version. ceramic antenna. (09/08).575 GHz Ceramic Chip Antenna Ground cleared under antenna, clearance area x 4.5 mm / 6.5 mm. Pulse Part Number: W0 / W0A Features - Omni directional radiation
NTIC Series. Limiting Inrush Current. NTC Power Thermistor for FEATURES PART NUMBER SYSTEM UL E Ф5~Ф15mm NTIC M S.
FEATURES UL E223037 Body size: Ф5mm ~ Ф30mm Radial lead resin coated High power rating Wide resistance range Cost effective Operating temperature range: Ф5mm: -40ºC~150ºC Ф8~Ф10mm: -40ºC~170ºC Ф13~Ф30mm:
CSK series. Current Sensing Chip Resistor. Features. Applications. Construction FAITHFUL LINK
CSK series Current Sensing Chip Resistor Features» 3 Watts power rating in 1 Watt size, 1225 Package» Low TCR of ±100 PPM/ C» Resistance values from 1m to 1 ohm» High purity alumina substrate for high
Surface Mount Multilayer Inductor
FETURES 0603, 0805, 0806 ND 1008 CSE SIZES HIGH CURRENT ND LOW RESISTNCE NEW "S" VERSION FOR INCRESED STURTION CURRENT UGRDED "H" VERSION FOR HIGHEST CURRENT REFLOW SOLDERING LICBLE CKGE FOR UTOMTIC ICKLCE
INPAQ Global RF/Component Solutions
MCB & MHC W Series Specification Product Name Series Multilayer Chip Ferrite Bead MCB & MHC W Series Size EIAJ 1005/1608/2012/3216/4516 MCB and MHC Series Chip Ferrite Bead for Automotive Applications
± 20% (rated cap. [µf] ) 1000 Leakage Current: For capacitance values > 33000µF, add the value of:
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TS-UP Series 85 C, 3000 hours Compact size for general purpose and industrial applications 2 and 3 pin versions available 20mm lengths for low profile applications RoHS Compliant Rated Working Voltage:
SMD Wire Wound Ferrite Chip Inductors - LS Series. LS Series. Product Identification. Shape and Dimensions / Recommended Pattern LS0402/0603/0805/1008
SMD Wire Wound Ferrite Chip Inductors - LS Series LS Series LS Series is the newest in open type ferrite wire wound chip inductors. The wire wound ferrite construction supports higher SRF, lower DCR and
NPN SILICON GENERAL PURPOSE TRANSISTOR
NPN SILICON GENERAL PURPOSE TRANSISTOR NE74 SERIES FEATURES LOW NOISE FIGURE: < db at 00 MHz HIGH GAIN: db at 00 MHz HIGH GAIN BANDWIDTH PRODUCT: GHz ( GHz for the ) SMALL COLLECTOR CAPACITANCE: pf HIGH
Current Sense Metal Strip Resistors (CSMS Series)
Features: Range: 1mΩ to 100mΩ Low TCR as low as 75PPM High power rating Custom Values available RoHS Compliant and Halogen Free Operating Temperature: -55 C to +170 C Part Number Structure CSMS 0805 -
2R2. 2 (L W H) [mm] Wire Wound SMD Power Inductor. Nominal Inductance Packing Tape & Reel. Design Code M ±20%
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Wire Wound SMD Power Inductors WPN Series Operating temperature range : -40 ~+125 (Including self-heating) FEATURES Fe base metal material core provides large saturation current Metallization on ferrite