Surface Mount Plastic Package/ SOT-343 (SC-70) Outline 4T. Pin Configuration. Emitter 03
|
|
- Ισίδωρος Μπότσαρης
- 5 χρόνια πριν
- Προβολές:
Transcript
1 High Performance Isolated ollector Silicon Bipolar Transistor Technical Data HBFP-42 Features Ideal for High Gain, ow Noise Applications Transition Frequency f T = 25 GHz Typical Performance at 1.8 GHz Associated Gain of 17 db and Noise Figure of 1.1 db at 2 V and 5 ma P 1dB of 12 dbm at 2 V and 2 ma an be Used Without Impedance Matching Applications NA, Oscillator, Driver Amplifier, Buffer Amplifier, and Down onverter for ellular and PS Handsets and ordless Telephones Oscillator for TV Delivery and TVRO Systems up to 1 GHz Surface Mount Plastic Package/ SOT-343 (S-7) Outline 4T Pin onfiguration Base Emitter 3 Emitter ollector Note: Package marking provides orientation and identification. Description Hewlett Packard s HBFP-42 is a high performance isolated collector silicon bipolar junction transistor housed in a 4-lead S-7 (SOT-343) surface mount plastic package. HBFP-42 provides an associated gain of 17 db, noise figure of 1.1 db, and P 1dB of 12 dbm at 1.8 GHz. Because of high gain and low current characteristics, HBFP-42 is ideal for cellular/ PS handsets as well as for -Band and Ku-Band applications. This product is based on a 25 GHz transition frequency fabrication process, which enables the products to be used for high performance, low noise applications at 9 MHz, 1.9 GHz, 2.4 GHz, and beyond.
2 2 HBFP-42 Absolute Maximum Ratings Absolute Symbol Parameter Units Maximum [1] V EBO Emitter-Base Voltage V 1.5 V BO ollector-base Voltage V 15. V EO ollector-emitter Voltage V 4.5 I ollector urrent ma 36 P T Power Dissipation [2] mw 162 T j Junction Temperature 15 T STG Storage Temperature -65 to 15 Thermal Resistance: θ jc = 3 /W Notes: 1. Permanent damage may occur if any of these limits are exceeded. 2. P T limited by maximum ratings. Electrical Specifications, T = 25 Symbol Parameters and Test onditions Units Min. Typ. Max. D haracteristics BV EO ollector-emitter Breakdown Voltage I = 1 ma, open base V 4.5 I BO ollector-utoff urrent V B = 5 V, I E = na 15 I EBO Emitter-Base utoff urrent V EB = 1.5 V, I = µa 15 h FE D urrent Gain V E = 2 V, I = 5 ma RF haracteristics F MIN Minimum Noise Figure I = 5 ma, V E = 2 V, f = 1.8 GHz db G a Associated Gain I = 5 ma, V E = 2 V, f = 1.8 GHz db S 21 2 Insertion Power Gain I = 2 ma, V E = 2 V, f = 1.8 GHz db 17 P -1dB Power 1 db I = 2 ma, V E = 2 V, f = 1.8 GHz dbm 12 ompression Point
3 3 HBFP-42 Typical Scattering Parameters, V E = 2 V, I = 5 ma, T = 25 Freq. S 11 S 21 S 12 S 22 GHz Mag Ang db Mag Ang db Mag Ang Mag Ang HBFP-42 Noise Parameters: V E = 2 V, I = 5 ma Freq. F min Γ opt R N /5 G a GHz db Mag Ang Ω db S and noise parameters are measured on a microstrip line made on.25 inch thick alumina carrier. The input reference plane is at the end of the base lead, the output reference plane is at the end of the collector lead. S and noise parameters include the effect of four plated through via holes connecting emitter landing pads on the top of test carrier to the microstrip ground plane on the bottom side of the carrier. Two.2 inch diameter via holes are placed within.1 inch from each emitter lead contact point, one via on each side of that point.
4 4 HBFP-42 Typical Scattering Parameters, V E = 2 V, I = 15 ma, T = 25 Freq. S 11 S 21 S 12 S 22 GHz Mag Ang db Mag Ang db Mag Ang Mag Ang HBFP-42 Noise Parameters: V E = 2 V, I = 15 ma Freq. F min Γ opt R N /5 G a GHz db Mag Ang Ω db S and noise parameters are measured on a microstrip line made on.25 inch thick alumina carrier. The input reference plane is at the end of the base lead, the output reference plane is at the end of the collector lead. S and noise parameters include the effect of four plated through via holes connecting emitter landing pads on the top of test carrier to the microstrip ground plane on the bottom side of the carrier. Two.2 inch diameter via holes are placed within.1 inch from each emitter lead contact point, one via on each side of that point.
5 5 HBFP-42 Typical Performance ASSOIATED GAIN (db) ma 5 ma 1 ma 15 ma NOISE FIGURE (db) ma 5 ma 1 ma 15 ma ASSOIATED GAIN (db) GHz 1.8 GHz 2.5 GHz 3 GHz 4 GHz 5 GHz 6 GHz FREQUENY (GHz) FREQUENY (GHz) OETOR URRENT (ma) Figure 1. Associated Gain vs. Frequency and ollector urrent at 2 V. Figure 2. Noise Figure vs. Frequency and ollector urrent at 2 V. Figure 3. Associated Gain vs. ollector urrent and Frequency at 2 V NOISE FIGURE (db) GHz GHz 2.5 GHz 3 GHz.5 4 GHz 5 GHz 6 GHz OETOR URRENT (ma) Figure 4. Noise Figure vs. ollector urrent and Frequency at 2 V. ASSOIATED GAIN (db) GHz 1.8 GHz 2.5 GHz 3 GHz 4 GHz 5 GHz 6 GHz VOTAGE (V) Figure 5. Associated Gain vs. Voltage (V E ) at 5 ma. NOISE FIGURE (db) GHz 1.8 GHz 2.5 GHz.5 3 GHz 4 GHz 5 GHz 6 GHz VOTAGE (V) Figure 6. Noise Figure vs. Voltage (V E ) at 5 ma.
6 6 HBFP-42 Die Model and PSPIE Parameters XX B XX MP7 R R=7.78 OH =7E-3 pf MP2 DIODE AREA= REGION= MODE = DB TEMP= MP6 MP5 = 19E-3 pf MP9 R MP1 NPNBJTSUBST MP16 DIODE TEMP= MODE=DBE REGION= AREA= MP8 R R =12 OH AREA=3 REGION= MODE=BJTMODE R=.194 OH MP3 DIODE MP1 DIODEMODEFORM # DIODE MODE # MODE = DB AREA= REGION= MODE=DS TEMP= IS=I.457E-17 BV= IBV= IMAX= XTI= TNOM=21 KF= AF= IS=IE-24 BV= IBV= IMAX= XTI= TNOM=21 KF= AF= RS= JO=2.393E-14 TT= EG= VJ=.729 M=.44 N=1 F=.8 MP12 DIODEMODEFORM # DIODE MODE # MODE = DS ISR= NR= IKF= NBV= IBV= NBV= FFE= RS= E2 ISR= JO=8.974E-14 NR= TT= IKF= EG= NBV= VJ=.6 IBV= M=.42 NBV= N= FFE= F=.8 MP68 BITMODEFORM NPN=yes PNP= Forward BF=1E6 IKE=1.4737E-1 ISE=7.94E-2 NE=1.6 VAF=4.4E1 NF=1 TF=5.376E-12 XTF=2 Reverse BR=1 IKR=1.1E-2 IS= N=2 VAR=3.37 NR=1.5 TR=4E-9 VTF=.8 ITF= E-1 PTF=22 XTB=.7 APPROXOB=yes # BJT MODE # MODE = BJTMODE MP69 R XX R-1 OH E Diode and junction Parasitics Noise EG=1.17 J=2.756E-14 RB= KF= IS=4.4746E-18 IMAX= VJ=.6775 MJ=.3319 IRB= E-6 RBM=.1 AF= KB= XTI=3 XJ= E-1 RE= AB= TNOM=21 F=.8 R= FB= JE= E-14 Substrate VJE=.997 MJE=.563 IS5= NS= JS= VJS= MJS= MP11 DIODEMODEFORM # DIODE MODE # MODE = DE IS=IE-24 BV= IBV= IMAX= XTI= TNOM=21 KF= AF= RS= ISR= JO=2.593E-14 NR= TT= IKF= EG= NBV= VJ=.8971 IBV= M=2.292E-1 NBV= N=1.29 FFE= F=.8 This model can be used as a design tool. It has been tested on MDS for various specifications. However, for more precise and accurate design, please refer to the measured data in this data sheet. Note: The value of beta was high (BF=1E6) to compensate for the fact that diode DBE reduces the current going into the base (current flows through DBE). The diodes are necessary to model the non-linear effects.
7 7 SOT343 Package Model =.5 pf B =.22 nh =.8 pf T1 =.2 nh 2T1 =.5 pf 1T1 EB =.4 pf I =.7 nh B BASE EMITTER 2 OETOR =.2 nh MP44 =.7 nh =.1 pf 1T3 E T3 =.5 nh 2T3 =.1 pf 3 =.2 nh =.144 pf =.1 nh =.15 nh 1T2 T2 =.4 pf E =.1 pf 2T2
8 8 Part Number Ordering Information Part Number Devices per Reel ontainer HBFP-42-TR1 3 7" Reel HBFP-42-TR2 1, 13" Reel HBFP-42-BK 1 antistatic bag Package Dimensions SOT-343 (S-7 4 ead) 1.3 (.51) BS 1.3 (.51) REF E E1 2.6 (.12) 1.3 (.51).55 (.21) TYP.85 (.33) 1.15 (.45) BS e 1.15 (.45) REF D h A b TYP A1 TYP DIMENSIONS θ SYMBO A A1 b D E e h E1 θ MIN..8 (.31) ().25 (.1).1 (.4) 1.9 (.75) 2. (.79).55 (.22).45 TYP (.18) 1.15 (.45).1 (.4) MAX. 1. (.39).1 (.4).35 (.14).2 (.8) 2.1 (.83) 2.2 (.87).65 (.25) 1.35 (.53).35 (.14) 1 DIMENSIONS ARE IN MIIMETERS (INHES)
9 9 Device Orientation REE TOP VIEW 4 mm END VIEW ARRIER TAPE 8 mm USER FEED DIRETION OVER TAPE Tape Dimensions For Outline 4T P D P 2 P E F W t 1 (ARRIER TAPE THIKNESS) D 1 8 MAX. K 5 MAX. A B AVITY PERFORATION DESRIPTION SYMBO SIZE (mm) SIZE (INHES) ENGTH WIDTH DEPTH PITH BOTTOM HOE DIAMETER DIAMETER PITH POSITION A B K P D 1 D P E 2.24 ± ± ±.1 4. ± ±.5 4. ± ±.1.88 ±.4.92 ±.4.48 ± ± ± ±.4.69 ±.4 ARRIER TAPE WIDTH THIKNESS W t 1 8. ± ± ±.12.1 ±.5 DISTANE AVITY TO PERFORATION (WIDTH DIRETION) AVITY TO PERFORATION (ENGTH DIRETION) F P ±.5 2. ± ±.2.79 ±.2
10 For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/anada: or Far East/Australasia: all your local HP sales office. Japan: (81 3) Europe: all your local HP sales office. Data subject to change. opyright 1998 Hewlett-Packard o. Printed in U.S.A E (6/98)
Surface Mount Plastic Package/ SOT-343 (SC-70) Outline 4T. Pin Configuration. Emitter. 03x
High Performance Isolated ollector Silicon Bipolar Transistor Technical Data HBFP-42 Features Ideal for High Gain, ow Noise Applications Transition Frequency f T = 25 GHz Typical Performance at 1.8 GHz
Διαβάστε περισσότεραAT Surface Mount Package SOT-363 (SC-70) I I Y. Pin Connections B 1 C 1 E 1 E 2 C 2 B , 7:56 PM
AT-3263 Surface Mount Package SOT-363 (SC-7) I I Y Pin Connections B 1 C 1 E 1 E 2 C 2 B 2 Page 1 21.4., 7:6 PM Absolute Maximum Ratings [1] Absolute Thermal Resistance [2] : Symbol Parameter Units Maximum
Διαβάστε περισσότεραNPN Silicon Bipolar Common Emitter Transistor. Technical Data AT-38043
NPN Silicon Bipolar Common Emitter Transistor Technical Data AT-3843 Features Operates Over a Wide Range of Voltages and Frequencies +25. dbm P 1dB and 6% Collector Efficiency @ 9 MHz, 4.8 Volts, Typ.
Διαβάστε περισσότεραPRELIMINARY DATA SHEET NPN EPITAXIAL SILICON TRANSISTOR FOR MICROWAVE HIGH-GAIN AMPLIFICATION
PRELIMINARY DATA SHEET NPN EPITAXIAL SILICON TRANSISTOR FOR MICROWAVE HIGH-GAIN AMPLIFICATION NE699M FEATURES OUTLINE DIMENSIONS (Units in mm) HIGH ft: 6 GHz TYP at V, ma LOW NOISE FIGURE: NF =. db TYP
Διαβάστε περισσότερα4.8 V NPN Common Emitter Medium Power Output Transistor. Technical Data AT-31625
4.8 V NPN Common Emitter Medium Power Output Transistor Technical Data AT-31625 Features 4.8 Volt Operation +28. dbm P out @ 9 MHz, Typ. 7% Collector Efficiency @ 9 MHz, Typ. 9 db Power Gain @ 9 MHz, Typ.
Διαβάστε περισσότεραNPN SILICON OSCILLATOR AND MIXER TRANSISTOR
FEATURES NPN SILICON OSCILLATOR AND MIXER TRANSISTOR LOW COST HIGH GAIN BANDWIDTH PRODUCT: ft = MHz TYP LOW COLLECTOR TO BASE TIME CONSTANT: CC r b'b = 5 ps TYP LOW FEEDBACK CAPACITANCE: CRE=.55 pf TYP
Διαβάστε περισσότεραSURFACE MOUNT NPN SILICON HIGH FREQUENCY TRANSISTOR
FEATURES HIGH GAIN BANDWIDTH PRODUCT: ft of LOW VOLTAGE/LOW CURRENT OPERATION HIGH INSERTION POWER GAIN: SE = db @ V, 7 ma, GHz SE = db @ V, ma, GHz LOW NOISE:. db AT. GHz AVAILABLE IN SIX LOW COST PLASTIC
Διαβάστε περισσότερα4.8 V NPN Silicon Bipolar Common Emitter Transistor. Technical Data AT-38086
4.8 V NPN Silicon ipolar Common Emitter Transistor Technical Data AT-3886 Features 4.8 Volt Pulsed (pulse width = 577 µsec, duty cycle = 12.5%)/CW Operation +28 dm Pulsed P out @ 9 MHz, Typ. +23.5 dm CW
Διαβάστε περισσότερα3 V, 1500 MHz Si MMIC WIDEBAND AMPLIFIER
V, MHz Si MMIC WIDEBAND AMPLIFIER UPC7T FEATURES WIDE FREQUENCY RESPONSE: MHz LOW VOLTAGE OPERATION: V NOMINAL (. MIN) LOW POWER CONSUMPTION:. mw TYP SUPER SMALL PACKAGE TAPE AND REEL PACKAGING OPTION
Διαβάστε περισσότερα2.5 GHz SILICON MMIC WIDE-BAND AMPLIFIER
. GHz SILICON MMIC WIDE-BAND AMPLIFIER UPC79T FEATURES WIDE FREQUENCY RESPONSE:. GHz 3 GAIN vs. FREQUENCY HIGH GAIN: 3 db (UPC79T) SATURATED OUTPUT POWER: +. dbm (UPC79T) INTERNAL CURRENT REGULATION MINIMIZES
Διαβάστε περισσότεραAT Low Current, High Performance NPN Silicon Bipolar Transistor
AT-3263 Low Current, High Performance NPN Silicon Bipolar Transistor Data Sheet Description The AT-3263 contains two high performance NPN bipolar transistors in a single SOT-363 package. The devices are
Διαβάστε περισσότεραNPN Silicon RF Transistor BFQ 74
NPN Silicon RF Transistor BFQ 74 For low-noise amplifiers in the GHz range, and broadband analog and digital applications in telecommunications systems at collector currents from 1 ma to 25 ma. Hermetically
Διαβάστε περισσότεραSURFACE MOUNT NPN SILICON HIGH FREQUENCY TRANSISTOR
FEATURES PART NUMBER NE6858 NE6859 NE6850 NE685 NE6859/9R EIAJ REGISTERED NUMBER SC505 SC500 SC959 SC955 SC957 PACKAGE OUTLINE 8 9 0 9 SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX MIN TYP MAX MIN
Διαβάστε περισσότεραDISCONTINUED NE680 SERIES NPN SILICON HIGH FREQUENCY TRANSISTOR SILICON TRANSISTOR FEATURES DESCRIPTION
FEATURES DESCRIPTION NF (db) Noise Figure,..0..0. NPN SILICON HIGH FREQUENCY TRANSISTOR HIGH GAIN BANDWIDTH PRODUCT: ft = 0 GHz LOW NOISE FIGURE:.7 db at GHz.6 db at GHz HIGH ASSOCIATED GAIN:. db at GHz
Διαβάστε περισσότερα3 V, 900 MHz Si MMIC AMPLIFIER
V, 9 MHz Si MMIC AMPLIFIER UPC77T FEATURES LOW VOLTAGE - LOW CURRENT: ma at V LOW POWER CONSUMPTION: mw TYP SUPER SMALL PACKAGE TAPE AND REEL PACKAGING OPTION AVAILABLE DESCRIPTION The UPC77T is a Silicon
Διαβάστε περισσότερα3 V, 900 MHz LOW NOISE SI MMIC AMPLIFIER
V, 9 MHz LOW NOISE SI MMIC AMPLIFIER UPC78T FEATURES.8 db NOISE FIGURE LOW VOLTAGE - LOW CURRENT: ma at V LOW POWER CONSUMPTION: 8 mw TYP SUPER SMALL PACKAGE TAPE AND REEL PACKAGING OPTION AVAILABLE DESCRIPTION
Διαβάστε περισσότεραNE680 SERIES. from this datasheet are not NPN SILICON HIGH FREQUENCY TRANSISTOR SILICON TRANSISTOR FEATURES DESCRIPTION
SILICON TRANSISTOR NE680 SERIES NPN SILICON HIGH FREQUENCY TRANSISTOR FEATURES HIGH GAIN BANDWIDTH PRODUCT: ft = 0 GHz LOW NOISE FIGURE:.7 db at GHz.6 db at GHz HIGH ASSOCIATED GAIN:. db at GHz 8.0 db
Διαβάστε περισσότεραNPN SILICON HIGH FREQUENCY TRANSISTOR 00 (CHIP) 35 (MICRO-X)
FEATURES HIGH GAIN BANDWIDTH PRODUCT: ft = 8 GHz LOW NOISE FIGURE:. db at GHz.6 db at GHz HIGH ASSOCIATED GAIN: 5 db at GHz db at GHz LOW COST DESCRIPTION The NE68 series of NPN epitaxial silicon transistors
Διαβάστε περισσότεραNPN SILICON GENERAL PURPOSE TRANSISTOR
NPN SILICON GENERAL PURPOSE TRANSISTOR NE74 SERIES FEATURES LOW NOISE FIGURE: < db at 00 MHz HIGH GAIN: db at 00 MHz HIGH GAIN BANDWIDTH PRODUCT: GHz ( GHz for the ) SMALL COLLECTOR CAPACITANCE: pf HIGH
Διαβάστε περισσότεραElectrical Specifications at T AMB =25 C DC VOLTS (V) MAXIMUM POWER (dbm) DYNAMIC RANGE IP3 (dbm) (db) Output (1 db Comp.) at 2 f U. Typ.
Surface Mount Monolithic Amplifiers High Directivity, 50Ω, 0.5 to 5.9 GHz Features 3V & 5V operation micro-miniature size.1"x.1" no external biasing circuit required internal DC blocking at RF input &
Διαβάστε περισσότεραThe following part numbers from this datasheet are not recommended for new design. Please call sales office for PLEASE NOTE: details: NE68135
NEC's NPN SILICON HIGH FREQUENCY TRANSISTOR NE68 SERIES FEATURES HIGH GAIN BANDWIDTH PRODUCT: ft = 8 GHz LOW NOISE FIGURE:. db at GHz.6 db at GHz HIGH ASSOCIATED GAIN: 5 db at GHz db at GHz LOW COST DESCRIPTION
Διαβάστε περισσότεραPRELIMINARY DATA SHEET. C to Ku BAND SUPER LOW NOISE AMPLIFIER N-CHANNEL HJ-FET
PRELIMINARY DATA SHEET FEATURES C to Ku BAND SUPER LOW NOISE AMPLIFIER N-CHANNEL HJ-FET LOW NOISE FIGURE & HIGH ASSOCIATED GAIN: NF =.9 db TYP, GA = 1 db TYP at f = 1 GHz 6 PIN SUPER MINIMOLD PACKAGE GATE
Διαβάστε περισσότεραNPN SILICON HIGH FREQUENCY TRANSISTOR
NPN SILICON HIGH FREQUENCY TRANSISTOR NE86 SERIES FEATURES HIGH GAIN BANDWIDTH PRODUCT: ft = 7 GHz LOW NOISE FIGURE:. db at GHz HIGH COLLECTOR CURRENT: 00 ma HIGH RELIABILITY METALLIZATION LOW COST B E
Διαβάστε περισσότεραVGS=-8V. RG=15ohm. Item Symbol Condition Limit Unit. VDS=50V, IDS1=0.9mA VDS=50V, IDS2=7.2mA
FEATURES 2stage GaN in Plastic Package HAST Compliant GaN Technology Operable with both 28 and 50 CW Output Power: 10W @ 28, 20W @ 50 Suitable for Broadband Applications from DC to 3GHz SGFCF2002SD Plastic
Διαβάστε περισσότεραAgilent MGA-565P8 20 dbm P sat High Isolation Buffer Amplifier
Agilent MGA-6P8 dbm P sat High Isolation Buffer Amplifier Data Sheet Description The MGA-6P8 is designed for use in LO chains to drive high dynamic range passive mixers. It provides high isolation, high
Διαβάστε περισσότεραFeatures. Applications V CC = 5V. Rbias
AVT-50663 DC 6000 MHz InGaP HBT Gain Block Data Sheet Description Avago Technologies AVT-50663 is an economical, easyto-use, general purpose InGaP HBT MMIC gain block amplifier utilizing Darlington pair
Διαβάστε περισσότεραISM 868 MHz Ceramic Antenna Ground cleared under antenna, clearance area mm x 8.25 mm. Pulse Part Number: W3013
W0 Datasheet version.. Ceramic Antenna. (0/08). Ceramic Antenna Ground cleared under antenna, clearance area 0.80 mm x 8.5 mm. Pulse Part Number: W0 Features - Omni directional radiation - Low profile
Διαβάστε περισσότεραHigh Performance Voltage Controlled Amplifiers Typical and Guaranteed Specifications 50 Ω System
High Performance Voltage Controlled Amplifiers Typical and Guaranteed Specifications 50 Ω System Typical and guaranteed specifications vary versus frequency; see detailed data sheets for specification
Διαβάστε περισσότεραIXBH42N170 IXBT42N170
High Voltage, High Gain BIMOSFET TM Monolithic Bipolar MOS Transistor IXBH42N17 IXBT42N17 S 9 = 1 = 42A (sat) 2.8V Symbol Test Conditions Maximum Ratings TO-247 (IXBH) S = 25 C to 15 C 17 V V CGR = 25
Διαβάστε περισσότεραMonolithic Crystal Filters (M.C.F.)
Monolithic Crystal Filters (M.C.F.) MCF (MONOLITHIC CRYSTAL FILTER) features high quality quartz resonators such as sharp cutoff characteristics, low loss, good inter-modulation and high stability over
Διαβάστε περισσότεραISM 900 MHz Ceramic Antenna Ground cleared under antenna, clearance area mm x 8.25 mm. Pulse Part Number: W3012
W0 Datasheet version.. Ceramic Antenna. (0/08). Ceramic Antenna Ground cleared under antenna, clearance area 0.80 mm x 8.5 mm. Pulse Part Number: W0 Features - Omni directional radiation - Low profile
Διαβάστε περισσότεραNEC Silicon RFIC Amplifiers Low Power, Wideband & SiGe/SiGeC
NEC Silicon RFIC Amplifiers Low Power, Wideband & SiGe/SiGeC Low Power Amplifiers ELECTRICAL CHARACTERISTICS (TA = 25 C) Range VCC ICC NF Gain RLIN RLOUT PdB ISOL @ 3dB (V) (ma) (dbm) Part down Package
Διαβάστε περισσότεραMZ0.5GF SERIES ZENER DIODE TECHHICAL SPECIFICATION FEATURES. ABSOLUTE MAXIMUM RATINGE: (Ta=25 ) Parameter Symbols Limits Unit
MZ.GEV- THRU MZ.GEV-. MZ.GF SERIES MZ.GEV THRU MZ.GEV TECHHICAL SPECIFICATION FEATURES Silicon Planar Power Diodes Standard Voltage Tolerance is ±% DO- Glass Case High Reliability Weight: Approx..g DO-
Διαβάστε περισσότεραFirst Sensor Quad APD Data Sheet Part Description QA TO Order #
Responsivity (/W) First Sensor Quad PD Data Sheet Features Description pplication Pulsed 16 nm laser detection RoHS 211/65/EU Light source positioning Laser alignment ø mm total active area Segmented in
Διαβάστε περισσότερα1.575 GHz GPS Ceramic Chip Antenna Ground cleared under antenna, clearance area 4.00 x 4.25 mm / 6.25 mm. Pulse Part Number: W3011 / W3011A
W0 Datasheet version. ceramic antenna. (09/08).575 GHz Ceramic Chip Antenna Ground cleared under antenna, clearance area x 4.5 mm / 6.5 mm. Pulse Part Number: W0 / W0A Features - Omni directional radiation
Διαβάστε περισσότεραSAW FILTER - RF RF SAW FILTER
FEATURES - Frequencies from 0MHz to 700MHz - Custom specifications available - Industry standard package configurations - Low-loss saw component - Low amplitude ripple - RoHS compliance - Electrostatic
Διαβάστε περισσότεραTransient Voltage Suppressor
Transient Suppressor Features Glass passivated junction Low incremental surge resistance, excellent clamping capability Underwriters Laboratory Recognition under UL standard for safety 497B: Isolated Loop
Διαβάστε περισσότεραWiFi 2.4 GHz Typical performance (Test board size 80 x 37 mm, PWB top surface ground removal area x 6.25 mm, position 1 on PWB)
W3001 Datasheet version 1.0. Antenna. (04/08). Antenna Features - Omni directional radiation (Azimuthal plane) - Low profile - Compact size W x L x H (10 x 3. x 4 mm) - Low weight (600 mg) - Lead free
Διαβάστε περισσότεραSMBJ SERIES. SMBG Plastic-Encapsulate Diodes. Transient Voltage Suppressor Diodes. Peak pulse current I PPM A with a 10/1000us waveform See Next Table
SMBJ SERIES SMBG Plastic-Encapsulate Diodes HD BK 7 Transient Suppressor Diodes Features P PP 6W V RWM 5.V- 44V Glass passivated chip Applications Clamping Marking SMBJ XXCA/XXA/XX XX : From 5. To 44 SMBG
Διαβάστε περισσότεραMetal Oxide Varistors (MOV) Data Sheet
Φ SERIES Metal Oxide Varistors (MOV) Data Sheet Features Wide operating voltage (V ma ) range from 8V to 0V Fast responding to transient over-voltage Large absorbing transient energy capability Low clamping
Διαβάστε περισσότεραGenX3 TM 300V IGBT IXGA42N30C3 IXGH42N30C3 IXGP42N30C3 V CES = 300V I C110. = 42A V CE(sat) 1.85V t fi typ. = 65ns
GenX3 TM V IGBT High Speed PT IGBTs for -1kHz switching IXGA42NC3 IXGH42NC3 IXGP42NC3 V CES = V 1 = 42A V CE(sat) 5V t fi typ = 65ns TO-263 (IXGA) Symbol Test Conditions Maximum Ratings V CES = 25 C to
Διαβάστε περισσότεραRating to Unit ma ma mw W C C. Unit Forward voltage Zener voltage. Condition
MA MA Series Silicon planer e For stabilization of power supply ø.56. Unit : mm Features Color indication of VZ rank classification High reliability because of combination of a planer chip and glass seal
Διαβάστε περισσότεραMAX4147ESD PART 14 SO TOP VIEW. Maxim Integrated Products 1 MAX4147 EVALUATION KIT AVAILABLE ; Rev 1; 11/96 V CC V EE OUT+ IN+ R t SENSE IN-
-; Rev ; / EVALUATION KIT AVAILABLE µ µ PART ESD TEMP. RANGE - C to +5 C PPACKAGE SO TOP VIEW V EE V CC SENSE+ SENSE- R t R t R t R t MAX SENSE OUT SENSE+ SENSE- N.C. SHDN N.C. 3 5 R f R G R f 3 VDSL TRANSFORMER
Διαβάστε περισσότεραC121. External Dimensions (L W) (mm) 0603 [0201] [0402] [0603] [0805]
Multilayer Chip SDV Series Operating Temp. : -55 ~+125 FEATURES SMD type suitable for high density mounting Excellent clamping ratio and quick response time (
Διαβάστε περισσότερα0.5W SMD Zener Diodes TLZJ2.0A TLZJ W SMD Zener Diodes. Features. MiniMelf. Mechanical Data
Features Planar Die Construction 0.5W Power Dissipation Zener Voltage: 2.0V to 56V Ideally Suited for Automated Assembly Processes RoHS Compliant MiniMelf Mechanical Data Case: Molded Glass MiniMelf Terminals:
Διαβάστε περισσότεραSERIES DATASHEET INDUCTORS RF INDUCTORS (MRFI SERIES)
SERIES DATASHEET INDUCTORS RF INDUCTORS (MRFI SERIES) (8) 95-8365 venkel.com Features: RoHS Compliant and Halogen Free Good Q values High SRF range: 1nH to 47uH Tolerance: ±.2nH, ±.3nH, ±2%, ±5%, ±1% High
Διαβάστε περισσότεραBluetooth / WLAN / WiFi Ceramic Chip Antenna Ground cleared under antenna, clearance area 4.00 x 4.25/6.25 mm. Pulse Part Number W3008, W3008C
W8 Datasheet version.7. ceramic antenna. (/) Ground cleared under antenna, clearance area 4. x 4.5/6.5 mm. Pulse Part Number W8, W8C Features - Omni directional radiation - Low profile - Compact size W
Διαβάστε περισσότεραCSR series. Thick Film Chip Resistor Current Sensing Type FEATURE PART NUMBERING SYSTEM ELECTRICAL CHARACTERISTICS
FEATURE Operating Temperature: -55 ~ +155 C 3 Watts power rating in 1 Watt size, 1225 package High purity alumina substrate for high power dissipation Long side terminations with higher power rating PART
Διαβάστε περισσότεραSMD Transient Voltage Suppressors
SMD Transient Suppressors Feature Full range from 0 to 22 series. form 4 to 60V RMS ; 5.5 to 85Vdc High surge current ability Bidirectional clamping, high energy Fast response time
Διαβάστε περισσότεραMAX1886. TOP PART TEMP. RANGE PIN- PACKAGE M ARK MAX1886EZK -40 C to +85 C 5 Thin SOT23-5* ADQL
19-95; Rev ; 8/1 µ µ TOP PART TEMP. RANGE PIN- PACKAGE M ARK EZK -4 C to +85 C 5 Thin SOT3-5* ADQL *Requires a special solder temperature profile described in the Absolute Maximum Ratings section. TOP
Διαβάστε περισσότεραData sheet Thick Film Chip Resistor 5% - RS Series 0201/0402/0603/0805/1206
Data sheet Thick Film Chip Resistor 5% - RS Series 0201/0402/0603/0805/1206 Scope -This specification applies to all sizes of rectangular-type fixed chip resistors with Ruthenium-base as material. Features
Διαβάστε περισσότεραIXBK64N250 IXBX64N250
High Voltage, High Gain BiMOSFET TM Monolithic Bipolar MOS Transistor IXBK64N25 IXBX64N25 V CES = 25V 11 = 64A V CE(sat) 3.V TO-264 (IXBK) Symbol Test Conditions Maximum Ratings V CES = 25 C to 15 C 25
Διαβάστε περισσότερα2R2. 2 (L W H) [mm] Wire Wound SMD Power Inductor. Nominal Inductance Packing Tape & Reel. Design Code M ±20%
Wire Wound SMD Power Inductors WPN Series Operating temperature range : -40 ~+125 (Including self-heating) FEATURES Fe base metal material core provides large saturation current Metallization on ferrite
Διαβάστε περισσότεραHigh Current Chip Ferrite Bead MHC Series
High Current Chip Ferrite Bead MHC Series Features Combination of high frequency noise suppression with capability of handing high current. The current rating up to 6 Amps with low DC. Applications High
Διαβάστε περισσότεραMZ0.5GN SERIES ZENER DIODE TECHHICAL SPECIFICATION FEATURES. ABSOLUTE MAXIMUM RATINGE: (Ta=25 ) Parameter Symbols Limits Unit
MZ.GEV- THRU MZ.GEV-. MZ.GN SERIES MZ.GEV THRU MZ.GEV TECHHICAL SPECIFICATION FEATURES Silicon Planar Power Diodes The zener voltages are graded according to the International E standard smaller voltage
Διαβάστε περισσότεραSurface Mount Aluminum Electrolytic Capacitors
FEATURES CYLINDRICAL V-CHIP CONSTRUCTION LOW COST, GENERAL PURPOSE, 2000 HOURS AT 85 O C NEW EXPANDED CV RANGE (up to 6800µF) ANTI-SOLVENT (2 MINUTES) DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING
Διαβάστε περισσότεραHIS series. Signal Inductor Multilayer Ceramic Type FEATURE PART NUMBERING SYSTEM DIMENSIONS HIS R12 (1) (2) (3) (4)
FEATURE High Self Resonant Frequency Superior temperature stability Monolithic structure for high reliability Applications: RF circuit in telecommunication PART NUMBERING SYSTEM HIS 160808 - R12 (1) (2)
Διαβάστε περισσότεραPRODUCT IDENTIFICATION SWPA 3012 S 1R0 N T
Wire Wound SMD Power Inductors SWPA Series Operating temperature range: -4 ~+25 (Including self-heating) FEATURES Magnetic-resin shielded conruction reduces buzz noise to ultra-low levels Metallization
Διαβάστε περισσότεραB37631 K K 0 60
Multilayer Ceramic acitors High; X5R and X7R Chip Ordering code system B37631 K 7 5 K 6 Packaging 6 ^ cardboard tape, 18-mm reel 62 ^ blister tape, 18-mm reel Internal coding acitance tolerance K ^ ± %
Διαβάστε περισσότεραYAGEO CORPORATION SMD INDUCTOR / BEADS. CLH Series. Lead-free / For High Frequency Applications. CLH1005-H series CLH1608-H series ~1.4 0.
YAGEO CORPORATION SMD INDUCTOR / BEADS CLH Series Multilayer Chip Inductors High Frequency Lead-free / For High Frequency Applications APPLICATIONS RF Resonance and Impedance Matching Circuit RF and Wireless
Διαβάστε περισσότεραDATA SHEET Surface mount NTC thermistors. BCcomponents
DATA SHEET 2322 615 1... Surface mount N thermistors Supersedes data of 17th May 1999 File under BCcomponents, BC02 2001 Mar 27 FEATURES High sensitivity High accuracy over a wide temperature range Taped
Διαβάστε περισσότεραCSK series. Current Sensing Chip Resistor. Features. Applications. Construction FAITHFUL LINK
CSK series Current Sensing Chip Resistor Features» 3 Watts power rating in 1 Watt size, 1225 Package» Low TCR of ±100 PPM/ C» Resistance values from 1m to 1 ohm» High purity alumina substrate for high
Διαβάστε περισσότεραConfigurations: Dimension (mm) B (max) A (max) 0.20 IWCCG1005. Inductance Range IWCCG ~ IWCCG ~ 1000 IWCCG
Configurations: FEATURES High frequency. Highest possible SRFs as well as excellent Q values. The wire is wound directed on the core at a precision pitch. RoHS Compliant. APPLICATION Pagers, Cordless phones
Διαβάστε περισσότεραRF series Ultra High Q & Low ESR capacitor series
RF series Ultra High Q & Low ESR capacitor series FAITHFUL LINK Features Application» High Q and low ESR performance at high frequency» Telecommunication products & equipments:» Ultra low capacitance to
Διαβάστε περισσότεραMultilayer Chip Inductor
Features -Monolithic structure for high reliability -High self-resonant frequency -Excellent solderability and high heat resistance Construction Applications -RF circuit in telecommunication and other
Διαβάστε περισσότεραIWCSeries FEATURES APPLICATION ORDERING CODE TRIGON COMPONENTS. Configurations: Dimension (mm) IWC C G 1608 K 22N T (1) (2) (3) (4) (5) (6) (7)
Configurations: FEATURES High frequency. Highest possible SRFs as well as excellent Q values. The wire is wound directed on the core at a precision pitch. RoHS Compliant. APPLICATION Pagers, Cordless phones
Διαβάστε περισσότεραDistributed by: www.jameco.com -800-83-4242 The content and copyrights of the attached material are the property of its owner. Single-Chip Voice Record/Playback Devices 60-, 75-, 90-, and 20-Second Durations
Διαβάστε περισσότεραMultilayer Ceramic Chip Capacitors
FEATURES X7R, X6S, X5R AND Y5V DIELECTRICS HIGH CAPACITANCE DENSITY ULTRA LOW ESR & ESL EXCELLENT MECHANICAL STRENGTH NICKEL BARRIER TERMINATIONS RoHS COMPLIANT SAC SOLDER COMPATIBLE* PART NUMBER SYSTEM
Διαβάστε περισσότεραMultilayer Ceramic Chip Capacitors
FEATURES X7R, X6S, X5R AND Y5V DIELECTRICS HIGH CAPACITANCE DENSITY ULTRA LOW ESR & ESL EXCELLENT MECHANICAL STRENGTH NICKEL BARRIER TERMINATIONS RoHS COMPLIANT SAC SOLDER COMPATIBLE* Temperature Coefficient
Διαβάστε περισσότεραSurface Mount Multilayer Chip Capacitors for Commodity Solutions
Surface Mount Multilayer Chip Capacitors for Commodity Solutions Below tables are test procedures and requirements unless specified in detail datasheet. 1) Visual and mechanical 2) Capacitance 3) Q/DF
Διαβάστε περισσότεραCurrent Sensing Chip Resistor SMDL Series Size: 0201/0402/0603/0805/1206/1010/2010/2512/1225/3720/7520. official distributor of
Product: Current Sensing Chip Resistor SMDL Series Size: 0201/0402/0603/0805/1206/1010/2010/2512/1225/3720/7520 official distributor of Current Sensing Chip Resistor (SMDL Series) 1. Features -3 Watts
Διαβάστε περισσότεραTransient Voltage Suppression Diodes: 1.5KE Series Axial Leaded Type 1500 W
Features 1. Reliable low cost construction utilizing molded plastic technique 2. Both bi-directional and uni-directional devices are available 3. Fast response time 4. Excellent clamping capacity 5. 1500
Διαβάστε περισσότεραNPI Unshielded Power Inductors
FEATURES NON-SHIELDED MAGNETIC CIRCUIT DESIGN SMALL SIZE WITH CURRENT RATINGS TO 16.5 AMPS SURFACE MOUNTABLE CONSTRUCTION TAKES UP LESS PCB REAL ESTATE AND SAVES MORE POWER TAPED AND REELED FOR AUTOMATIC
Διαβάστε περισσότεραSunlord. Wire Wound SMD Power Inductors SPH Series Operating Temp. : -40 ~+125 (Including self-heating) 2R2 SPH
Wire Wound SMD Power Inductors SPH Series Operating Temp. : -4 ~+25 (Including self-heating) FEATURES Magnetic-resin shielded construction reduces buzz noise to ultra-low levels Metallization on ferrite
Διαβάστε περισσότεραNKT NTC Thermistor. Negative Temperature Coefficient Thermistor FEATURES
FEATURES Large, strong capacity of suppression of inrush current Big material (B value), small residual Small size, Long life, high reliability and fast response APPLICATIONS Switching -supply, switch,
Διαβάστε περισσότεραSunlord. Wire Wound SMD Power Inductors SWCS Series SWCS XXXX -XXX T. Operating Temperature: -25 ~ +105 FEATURES APPLICATIONS PRODUCT IDENTIFICATION
Wire Wound SMD Power Inductors SWCS Series Operating Temperature: -25 ~ +105 FEATURES Various high power inductors are superior to be high saturation Suitable for surface mounting equipment APPLICATIONS
Διαβάστε περισσότεραCeramic PTC Thermistor Overload Protection
FEATURES compliant CPTD type are bare disc type CPTL type are leaded Low, medium and high voltage ratings Low resistance; Small size No need to reset supply after overload No noise generated Stable over
Διαβάστε περισσότεραThin Film Chip Resistors
FEATURES PRECISE TOLERANCE AND TEMPERATURE COEFFICIENT EIA STANDARD CASE SIZES (0201 ~ 2512) LOW NOISE, THIN FILM (NiCr) CONSTRUCTION REFLOW SOLDERABLE (Pb FREE TERMINATION FINISH) Type Size EIA PowerRating
Διαβάστε περισσότεραData sheet Thin Film Chip Inductor AL Series
Data sheet Thin Film Chip Inductor AL Series Scope - 0201 and 0402 and 0603 series inductor is a photo lithographically etched single layer ceramic chip. This design provides high SRF, excellent Q, and
Διαβάστε περισσότεραPolymer PTC Resettable Fuse: KRG Series
Features 1. RoHS & Halogen-Free (HF) compliant 2. Radial leaded devices 3. Broadest range of resettable devices available in the industry 4. Hold current ratings from 0.1 to 3.75A 5. Maximum voltage is
Διαβάστε περισσότερα! " # $ &,-" " (.* & -" " ( /* 0 (1 1* 0 - (* 0 #! - (#* 2 3( 4* 2 (* 2 5!! 3 ( * (7 4* 2 #8 (# * 9 : (* 9
"# " # $ "%%" & '" (' )' * & + (' )' * &,-" " (.* & -" " ( /* 0 (1 1* 0 - (* 0 # - (#* 2 # - (#* 2 3( 4* 2 (* 2 5 3 ( * 2 6 3 (7 4* 2 #8 (# * 9 : (* 9 #" " 5,1 < = " = #+ +# 9 ' :> # &? + # & ISD i " @
Διαβάστε περισσότεραSunlord Specifications subject to change without notice. Please check our website for latest information. Revised 2018/04/15
Wire Wound SMD Power Inductors SPH Series Operating Temp. : -40 ~+125 (Including self-heating) FEATURES Magnetic-resin shielded construction reduces buzz noise to ultra-low levels Metallization on ferrite
Διαβάστε περισσότεραChilisin Electronics Singapore Pte Ltd
hilisin Electronics ingapore Pte Ltd High urrent hip Beads, PBY eries Feature: Our MD High urrent hips Beads is specially designed to with tand large urrents while providing a means of EMI/RFI attenuation
Διαβάστε περισσότεραThin Film Chip Inductor
Scope -Viking s 0201 and 0402 series inductor is a photo lithographically etched single layer ceramic chip. Viking s design provides high, excellent Q, and superior temperature stability. This highly stable
Διαβάστε περισσότεραMULTILAYER CHIP VARISTOR JMV S & E Series: (SMD Surge Protection)
INTRODUCTION Metal Oxide based chip varistors (JMVs) are used for transient suppression. JMVs have non-linear - behavior, which is similar to that of Zener Diode. Each grain in JMV exhibits small p-n junction
Διαβάστε περισσότεραHigh Power Amp BMT321. Application Note
RF MMIC Innovator www.berex.com [Classification] Application Note [Date] 2015.11 [Revision No.] Rev.A [Measuring Instruments] - NA_Agilent E5071B - SA_Agilent N9020A - SG_Agilent 4438C - SG_Agilent N5182A
Διαβάστε περισσότεραRSDW08 & RDDW08 series
/,, MODEL SELECTION TABLE INPUT ORDER NO. INPUT VOLTAGE (RANGE) NO LOAD INPUT CURRENT FULL LOAD VOLTAGE CURRENT EFFICIENCY (Typ.) CAPACITOR LOAD (MAX.) RSDW08F-03 344mA 3.3V 2000mA 80% 2000μF RSDW08F-05
Διαβάστε περισσότεραData Sheet High Reliability Glass Epoxy Multi-layer Materials (High Tg & Low CTE type) Laminate R-1755V Prepreg R-1650V
Data Sheet High Reliability Glass Epoxy Multi-layer Materials (High Tg & Low CTE type) Laminate R-1755V Prepreg R-1650V Nov. 2015 No.15111336 Specification / Laminate R-1755V No.; 15111336-1 Property Units
Διαβάστε περισσότεραLR Series Metal Alloy Low-Resistance Resistor
LR Series Metal Alloy LowResistance Resistor This specification is applicable to lead free, halogen free of RoHS directive for metal alloy lowresistance resistor. The product is for general purpose. The
Διαβάστε περισσότεραCurrent Sensing Thick Film Chip Resistor-SMDB Series Size: 0402/0603/0805/1206/1210/2010/2512. official distributor of
Product: Current Sensing Thick Film Chip Resistor-SMDB Series Size: 0402/0603/0805/1206/1210/2010/2512 official distributor of Current Sensing Thick Film Chip Resistor-SMDB Series 1. Scope -This specification
Διαβάστε περισσότεραHigh Frequency Chip Inductor / CF TYPE
High Frequency Chip Inductor / CF TYPE.Features: 1.Closed magnetic circuit avoids crosstalk. 2.S.M.T. type. 3.Excellent solderability and heat resistance. 4.High realiability. 5.The products contain no
Διαβάστε περισσότεραMAX3970 MAX3970. Maxim Integrated Products ; Rev 1; 10/01 3.3V SUPPLY FILTERING V CC 1 V CC 2 3.3V FILTER R F.
19-197; Rev 1; 1/1 Ω µ + + µ PART TEMP. RANGE PIN-PACKAGE U/D C to +85 C Dice Note: Dice are designed to operate over a C to +11 C junction temperature (T J ) range, but are tested and guaranteed at T
Διαβάστε περισσότεραChip Temp. Sensing NTC Thermistor SDNT Series Operating Temp. : -55 ~+125
hip Temp. Sensing T Thermistor ST Series Temp. : -55 ~+25 TURS S type suitable for high density mounting Series of constant for various applications xcellent solderability PPTOS Telecommunication equipments
Διαβάστε περισσότεραLR Series Metal Alloy Low-Resistance Resistor
Tel : 881745 Fax : 881749 LR Series Metal Alloy LowResistance Resistor This specification is applicable to lead free, halogen free of RoHS directive for metal alloy lowresistance resistor. The product
Διαβάστε περισσότεραSMD Power Inductor. - SPRH127 Series. Marking. 1 Marking Outline: 1 Appearance and dimensions (mm)
Marking Outline: Low DCR, high rated current. Magnetic shielded structure Lead free product, RoHS compliant. RoHS Carrier tape packing, suitable for SMT process. SMT Widely used in buck converter, laptop,
Διαβάστε περισσότεραAnti-Corrosive Thin Film Precision Chip Resistor (PR Series)
(PR Series) Features -Long term life stability and demonstrated the Anti Corrosion claims -Special passivated NiCr film for Anti-Acid and Anti-Damp -Tight tolerance down to ±0.1% -Extremely low TCR down
Διαβάστε περισσότεραNo Item Code Description Series Reference (1) Meritek Series CRA Thick Film Chip Resistor AEC-Q200 Qualified Type
Qualified FEATURE Excellent Mechanical Strength and Electrical Stability Ideal for Pick and Place Machinery Stable High Frequency Characteristics Miniature, High Board Density Equivalent Specification
Διαβάστε περισσότερα500mW Zener Diodes TZXJ2.0A TZXJ mW Zener Diodes. Features. Mechanical Data. Maximum Ratings (T Ambient=25ºC unless noted otherwise)
Features Planar Die Construction 500mW Power Dissipation Zener Voltage: 2.0V to 56V Ideally Suited for Automated Assembly Processes RoHS compliant and Halogen Free DO-35 Mechanical Data Case: Molded glass
Διαβάστε περισσότεραHigh Speed, Low Loss Multi-layer Materials
Data Sheet High Speed, Low Loss Multilayer Materials Laminate R5725 Prepreg R5620 UL/ANSI IPC4101 Slash Sheet FR4 Primary:/91 Secondary:/102(*) Jul. 2013 No.13070132 No.; 130701321 Property Units Test
Διαβάστε περισσότεραOperating Temperature Range ( C) ±1% (F) ± ~ 1M E-24 NRC /20 (0.05) W 25V 50V ±5% (J) Resistance Tolerance (Code)
FEATURES EIA STANDARD SIZING 0201(1/20), 0402(1/16), 0603(1/10), 0805(1/8), 1206(1/4), 1210(1/3), 2010(3/4) AND 2512(1) METAL GLAZED THICK FILM ON HIGH PURITY ALUMINA SUBSTRATE..(CERMET) PROVIDES UNIFORM
Διαβάστε περισσότερα